Patent Grant
10410818
The present disclosure relates to a fuse element mounted on a current path and blown by self-generated heat when a rate-exceeding current flows, or blown by heat from a heat generator, to interrupt the current path, and relates to a fuse device and protective device using the same. This application claims priority to Japanese Patent Application No. 2016-182381 filed on Sep. 16, 2016, the entire contents of which are hereby incorporated by reference.
Conventionally, fuse elements blown by self-generated heat when a rate-exceeding current flows are used to interrupt a current path. Examples of commonly used fuse elements include holder-fixed fuses having solder enclosed in glass, chip fuses having an Ag electrode printed on a ceramic substrate surface, and screw-in or insertable fuses having a copper electrode with a narrow portion assembled into a plastic case.
However, problems have been identified in existing fuse elements described above such as inability to surface mount using reflow, low current ratings, and inferior blowout speeds when increasing size for higher current ratings.
Moreover, in the case of a reflow-mountable rapid-interruption fuse device, in general, this would preferably have a high melting point Pb solder with a melting point of 300° C. or more in the fuse element in view of blowout properties. However, use of solder containing Pb is limited with few exceptions under the RoHS directive, and demand for a transition to Pb-free products is expected to rise.
Due to such demand, as illustrated in
Such a fuse element 100 can be manufactured, for example, by forming a film of high melting point metal 102 such as Ag using film-forming techniques such as plating, vapor deposition, or sputtering on the surface of an elongated low melting point metal layer 101 such as a solder foil.
PLT 1: Japanese Unexamined Patent Application No. 2015-65156
High melting point metal layers formed by thin-film forming methods such as plating, vapor deposition, and sputtering have low crystallinity and low mechanical strength in comparison with bulk materials. Consequently, during deformation such as when bending, cracks form in bent portions; moreover, defects such as boundary and lattice defects increase conductor resistances, lowering performance as a conductive material.
In particular, in the case of laminating a high melting point metal layer such as of Ag at a thickness of 10 μm or more using plating onto the surface of a low melting point metal layer formed of an alloy having Sn as a primary constituent and having a thickness of 100 μm or more, as illustrated in
Therefore, an object of the present disclosure is to provide a fuse element as well as a fuse device and protective device using the same which are capable of suppressing generation of defects such as cracks in the high melting point metal layer, maintaining good conduction, and maintaining blowout properties.
In order to solve the above problems, a fuse element according to the present disclosure has a low melting point metal layer and a high melting point metal layer which are laminated, at least one peak among peaks in an X-ray diffraction spectrum (2θ) of a surface of the high melting point metal layer having a full width at half maximum of 0.15 degrees or less.
Furthermore, a method for manufacturing a fuse element according to the present disclosure includes a laminating step of laminating a high melting point metal layer and a low melting point metal layer and a heating step of heating the high melting point metal layer to a temperature of at least 120° C. and at most a melting point of the low melting point metal layer.
Furthermore, a fuse device according to the present disclosure includes an insulating substrate and the aforementioned fuse element mounted on the insulating substrate.
Furthermore, a protective device according to the present disclosure includes an insulating substrate, the aforementioned fuse element mounted on the insulating substrate, and a heat generator arranged on the insulating substrate for heating and blowing the fuse element.
According to the present disclosure, because at least one peak among peaks in an X-ray diffraction spectrum (2θ) of a surface of a high melting point metal layer constituting an outer layer has a full width at half maximum of 0.15 degrees or less, crystallinity is improved so that mechanical strength against such processes as bending is improved and resistance is reduced. This can suppress cracks and prevent increased conductor resistance in the fuse element so that the fuse element can have a desired current rating and fluctuation in blowout properties can be prevented.
Hereinafter, a fuse element, a fuse device, and a protective device according to the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the present disclosure is not limited to the following embodiments and various modifications can be made without departing from the scope of the present disclosure. Moreover, the features illustrated in the drawings are shown schematically and are not intended to be drawn to scale. Actual dimensions should be determined in consideration of the following description. Furthermore, those skilled in the art will appreciate that dimensional relations and proportions may be different among the drawings in certain parts.
Fuse Element
First, a fuse element according to the present disclosure will be described. A fuse element 1 according to the present disclosure is used as a fusible conductor in a fuse device and a protective device to be described below and is blown by self-heating (Joule heating) caused when a rate-exceeding current flows or blown by heat from a heat generator. In the following, while configuration of the fuse element 1 is described in a case of being mounted in a fuse device 20, it should be noted that operation is equivalent in the case of being mounted in a protective device described below.
The fuse element 1, for example, is formed in a roughly rectangular plate-shape having a total thickness of approximately 200 μm and is mounted on an insulating substrate 21 of the fuse device 20 as illustrated in
The high melting point metal layer 3, for example, is preferably formed of Ag, Cu, or an alloy having Ag or Cu as a primary constituent and has a high melting point so as not to melt even in the case of mounting the fuse element 1 on the insulating substrate 21 using a reflow oven.
The low melting point metal layer 2 is preferably formed of, for example, Sn or an alloy containing Sn as a primary constituent, a material commonly known as “Pb-free solder.” The melting point of the low melting point metal layer 2 is not necessarily higher than reflow oven temperature and may be less than 260° C. Moreover, the low melting point metal layer 2 may use Bi, In, or an alloy containing Bi or In having an even lower melting point.
Manufacturing Method of Fuse Element 1
The fuse element 1 can be manufactured by film-forming a high melting point metal using plating techniques on the low melting point metal layer 2. For example, an element film can be manufactured by plating Ag, such as by electroplating, on a long solder foil which can be cut to size according to need to efficiently manufacture the fuse element 1 and allow convenient use.
Terminal Portion
Furthermore, both end portions in the long direction of the fuse element 1 are preferably bent to form a pair of terminal portions 5a, 5b for connecting to an external circuit. Forming the terminal portions 5a, 5b in the fuse element 1 and providing electrodes on the surface for mounting the fuse element 1 of the insulating substrate 21 removes the need to provide external connection electrodes on a back surface of the insulating substrate 21 for connecting to these electrodes, thus simplifying manufacturing processes as well as eliminating restrictions on current ratings due to electrical resistance between electrodes of the insulating substrate 21 and external connection electrodes and allowing the fuse element 1 itself to regulate the rated current so that current ratings can be improved.
The terminal portions 5a, 5b are formed by bending edge portions of the fuse element 1 mounted on a surface of the insulating substrate 21 to follow a side surface of the insulating substrate 21 and may also be bent outward or inward one or more times as appropriate. Thus, a bent portion 6 is formed in the fuse element 1 between a substantially flat main surface and a surface of a bent end.
Then, in the fuse device 20, the terminal portions 5a, 5b are exposed to the exterior of the device so that, when mounted to an external circuit substrate, the terminal portions 5a, 5b are connected to terminals formed on the external circuit substrate such as by using solder, thus incorporating the fuse element 1 into the external circuit.
Concave/Convex, Open Hole, and Embossing
Furthermore, in the fuse element 1, under high-temperature conditions such as during reflow, to prevent variance in resistance as well as fluctuations in blowout properties due to the low melting point metal flowing and local collapsing/expanding, an open hole 7 (
Crystallinity
Herein, in the fuse element 1, crystallinity of the high melting point metal layer constituting an outer layer is increased to improve mechanical strength against such processes as bending and to reduce electrical resistance. This suppresses cracks in the bent portion 6 and prevents increased conductor resistance to provide the fuse element 1 with a desired current rating and prevent fluctuations in blowout properties.
Crystallinity can be verified by full widths at half maximum of the 2θ peaks in the X-ray diffraction spectrum, and the full width at half maximum of at least one of a plurality of reflection peaks is preferably 0.15 degrees or less. Furthermore, the greatest peak preferably has a full width at half maximum of 0.15 degrees or less.
In order to improve crystallinity in the fuse element 1, after laminating the low melting point metal layer and the high melting point metal layer, the fuse element 1 is heat-treated at a temperature of 120° C. or higher. By heat-treating, a stable crystal structure is formed in the high melting point metal layer and crystallinity is improved. Treating with heat before forming the terminal portions 5a, 5b, the open hole 7, the blind hole 8, or the concave/convex portion 9 in the fuse element 1 can suppress cracks in the bent portion 6.
Furthermore, the fuse element 1 is preferably heat-treated at a temperature not exceeding the melting point of the low melting point metal, and as described above, in the case of using Sn or an alloy containing Sn as a primary constituent in the low melting point metal and using Ag, Cu, or an alloy containing Ag or Cu as a primary constituent in the high melting point metal, the fuse element 1 is preferably heat-treated at 210° C. or less. Heat-treating at 210° C. or less can suppress excessive flow of the low melting point metal and prevent erosion of the high melting point metal by melted low melting point metal, which can prevent fluctuations in blowout properties caused by fluctuations in resistance.
It should be noted that the volume of the low melting point metal layer 2 is preferably greater than the volume of the high melting point metal layer 3 in the fuse element 1. A greater volume of the low melting point metal layer 2 of the fuse element 1 reduces blowout times due to effective erosion of the high melting point metal layer 3.
Fuse Device
Next, a fuse device using the above-described fuse element 1 will be explained. A fuse device 20 according to the present disclosure, as illustrated in
The fuse element 1 has a pair of terminal portions 5a, 5b which are led to the exterior of the device housing 28 formed by joining the insulating substrate 21 and the cover member 22, and the fuse element 1 can be connected with connecting electrodes of an external circuit via the terminal portions 5a, 5b.
The insulating substrate 21, for example, is a rectangular member that is electrically insulating and made of an engineering plastic such as liquid-crystal polymer, alumina, glass ceramics, mullite, or zirconia. In addition, as the insulating substrate 21, materials used in printed circuit boards such as glass epoxy substrates or phenol substrates, among others, may be used.
The cover member 22, as in the insulating substrate 21, can be an electrically insulating member made of any of a variety of engineering plastics, ceramics, or other material and is connected to the insulating substrate 21 via, for example, an electrically insulating adhesive agent. In the fuse device 20, by covering the fuse element 1 with the cover member 22, even in the case of arc-discharge accompanying self-heating and interruption due to an overcurrent, melted metal is trapped by the cover member 22 which prevents scattering to the surroundings.
A groove 23 is formed on a surface 21a for mounting the fuse element 1 on the insulating substrate 21. Furthermore, a groove 29 facing the groove 23 is formed in the cover member 22. The grooves 23, 29 are spaces at which the fuse element 1 blows and is interrupted; a portion of the fuse element 1 corresponding to locations of the grooves 23, 29 contacts air which is a poor thermal conductor and serves as a blowout portion 1a which is more prone to temperature increase and blowout than other portions of the fuse element 1 in contact with the insulating substrate 21 and cover member 22.
It should be noted that an electrically conductive adhesive or solder may be interposed between the insulating substrate 21 and the fuse element 1 as appropriate. In the fuse device 20, by connecting the insulating substrate 21 and fuse element 1 via an adhesive or solder, close contact is improved so that heat can be more efficiently transmitted to the insulating substrate 21 and relatively heat and blow the blowout portion 1a.
Moreover, as illustrated in
The first and second electrodes 24, 25 may be connected with the fuse element 1 via a connection-use solder. Connecting the fuse element 1 to the first and second electrodes 24 and 25 increases heat transmission in portions excluding the blowout portion 1a so that heating and blowout of the blowout portion 1a is more effective.
It should be noted that, in the configuration illustrated in
Moreover, in the fuse device 20, instead of providing the fuse element 1 with the terminal portions 5a, 5b, or, as illustrated in
It should be noted that in the fuse device 20 illustrated in
Furthermore, in the fuse device 20, to prevent oxidation of the high melting point metal layer 3 or the low melting point metal layer 2 as well as to remove oxides during blowout and improve flow of the solder, a top surface and/or bottom surface of the fuse element 1 may be coated with a flux not illustrated in the drawings.
By coating with the flux, even in the case of forming an antioxidation layer such as a Pb-free solder having Sn as a primary constituent on a surface of an outer layer of the high melting point metal layer 3, it is possible to remove oxides of the antioxidation layer and effectively prevent oxidation of the high melting point metal layer 3 to maintain and improve blowout properties.
Circuit Configuration
Such a fuse device 20 has a circuit configuration as illustrated in
During this, due to the low melting point metal layer 2 having a melting point lower than that of the high melting point metal layer 3 being laminated in the fuse element 1 as described above, melting starts from the melting point of the low melting point metal layer 2 due to self-generated heat caused by the overcurrent, and erosion of the high melting point metal layer 3 begins. Thus, erosive action of the low melting point metal layer 2 on the high melting point metal layer 3 can be used to melt the high melting point metal layer 3 at a temperature lower than its melting point so that the fuse element 1 can be rapidly blown.
Protective Device
Hereinafter, a protective device using the fuse element 1 will be described. In the following description, the same members as those of the above-described fuse device 20 are denoted by the same reference numerals, and redundant explanation will be omitted. As illustrated in
The insulating substrate 31, as in the insulating substrate 21 described above, is a rectangular member that is electrically insulating and made of an engineering plastic such as liquid-crystal polymer, alumina, glass ceramics, mullite, or zirconia. In addition, as the insulating substrate 31, a material used for a printed wiring board such as glass epoxy substrates or phenol substrates, among others, may be used.
On a surface 31a of the insulating substrate 31, the first and the second electrodes 34, 35 are formed on mutually opposite ends. Wettability of the first and the second electrodes 34, 35 causes the melted fuse element 1 to gather when energizing the heat generator 33 to generate heat so that blowout occurs between the terminal portions 5a, 5b.
The heat generator 33 generates heat when energized and is made of an electrically conductive material such as nichrome, W, Mo, Ru, or a material containing these. The heat generator 33 can be formed by mixing a powdered alloy or composition/compound of these materials with a resin binder to make a paste used to form a pattern on the insulating substrate 31, for example, by using screen printing techniques and baking.
Moreover, in the protective device 30, the heat generator 33 is covered by the electrically insulating member 32, and a heat generator lead electrode 36 is formed to face the heat generator 33 via the electrically insulating member 32. The fuse element 1 is connected to the heat generator lead electrode 36, thereby, the heat generator 33 is overlapped by the fuse element 1 via the electrically insulating member 32 and the heat generator lead electrode 36. The electrically insulating member 32 is provided not only to electrically insulate and protect the heat generator 33 but also to efficiently convey heat from the heat generator 33 to the fuse element 1 and may be a glass layer.
Furthermore, the heat generator 33 may be formed in an inner portion of the electrically insulating member 32 laminated on the insulating substrate 31. Moreover, the heat generator 33 may be formed on a back surface 31b of the insulating substrate 31 opposite the surface 31a on which the first and second electrodes 34, 35 are formed, or may be formed adjacent to the first and second electrodes 34, 35 on a surface 31a of the insulating substrate 31. Furthermore, the heat generator 33 may be formed in the interior of the insulating substrate 31.
The heat generator 33 is connected on one end to the heat generator lead electrode 36 via a first heat generator electrode 38 formed on the surface 31a of the insulating substrate 31 and connected on the other end to a second heat generator electrode 39 formed on the surface 31a of the insulating substrate 31. The heat generator lead electrode 36 is connected to the first heat generator electrode 38 laminated above the electrically insulating member 32 facing the heat generator 33 and connected to the fuse element 1. Thus, the heat generator 33 is electrically connected to the fuse element 1 via the heat generator lead electrode 36. It should be noted that positioning the heat generator lead electrode 36 to face the heat generator 33 via the electrically insulating member 32 not only allows the fuse element 1 to be melted but can also promote gathering of melted conductor.
Furthermore, the second heat generator electrode 39 is formed on the surface 31a of the insulating substrate 31 and is continuous with heat generator supply electrode 39a formed on the back surface of the insulating substrate 31 via a castellation (refer to
In the protective device 30, the fuse element 1 is connected to the first electrode 34 and the second electrode 35 as well as the heat generator lead electrode 36 between the first and second electrodes 34, 36. The fuse element 1 is connected to the first and second electrodes 34, 35 and onto the heat generator lead electrode 36 via a connective material such as connection-use solder.
Flux
Furthermore, in the protective device 30, to prevent oxidation of the high melting point metal layer 3 or the low melting point metal layer 2 as well as to remove oxides during blowout and improve flow of solder, a top surface and/or bottom surface of the fuse element 1 may be coated with a flux 27. Coating with the flux 27 not only improves wettability of the low melting point metal layer 2 (for example solder) but also removes oxides generated while the low melting point metal is melted and improves blowout properties by making use of erosive action on the high melting point metal (for example Ag) during operation of the protective device 30.
Furthermore, by coating with the flux 27, even in the case of forming an antioxidation layer of, for example, Pb-free solder having Sn as a primary constituent on a surface of an outer layer of the high melting point metal layer 3, oxides of the antioxidation layer can be removed and oxidation of the high melting point metal layer 3 can be effectively prevented and blowout properties can be maintained and improved.
It should be noted that the first and second electrodes 34, 35, the heat generator lead electrode 36, and the first and second heat generator electrodes 38, 39 are formed by a conductive pattern such as of Ag or Cu, and a protective layer of Sn plating, Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or other plating is preferably formed as appropriate on their surfaces. This prevents oxidation of these surfaces and suppresses erosion of the first and second electrodes 34, 35 as well as the heat generator lead electrode 36 caused by connective material such as solder used to connect the fuse element 1.
Cover Member
Furthermore, the protective device 30 is provided with a cover member 37 for protecting the interior and for preventing scattering of melted material from the fuse element 1 attached above the surface 31a of the substrate 31 provided with the fuse element 1. The cover member 37 can be an electrically insulating member made of any of a variety of engineering plastics, ceramics, or other material. Because the fuse element 1 is covered by the cover member 37 in the protective device 30, melted metal is trapped by the cover member 37 and prevented from scattering to the surroundings.
In such a protective device 30, a conductive path to the heat generator 33 is formed which includes the heat generator supply electrode 39a, the second heat generator electrode 39, the heat generator 33, the first heat generator electrode 38, the heat generator lead electrode 36, and the fuse element 1. Furthermore, in the protective device 30, the second heat generator electrode 39 is connected to an external circuit energizing the heat generator 33 via the heat generator supply electrode 39a, and the external circuit controls current passing through the second heat generator electrode 39 and fuse element 1.
In the protective device 30, by connecting the fuse element 1 and the heat generator lead electrode 36, the fuse element 1 constitutes part of the conductive path to the heat generator 33. Accordingly, in the protective device 30, when the fuse element 1 melts and interrupts the connection with the external circuit, because this also interrupts the conductive path to the heat generator 33, heating can be stopped.
Circuit Diagram
A protective device 30 according to the present disclosure has a circuit configuration such as illustrated in
Blowout Process
When the protective device 30 with such a circuit configuration needs to interrupt the current path of the external circuit, the current control element provided in the external circuit energizes the heat generator 33. Thereby, in the protective device 30, heat generated by the heat generator 33 melts the fuse element 1 installed in the current path of the external circuit and the highly wettable heat generator lead electrode 36 and first and second electrodes 34, 35 attract melted conductor of the fuse element 1 to blow out the fuse element 1. Thus, the fuse element 1 can be reliably blown between the terminal portion 5a and the heat generator lead electrode 36 and between the heat generator lead electrode 36 and the terminal portion 5b (
During this, heating of the heat generator 33 starts to melt the fuse element 1 from the melting point of the low melting point metal layer 2 having a melting point lower than that of the high melting point metal layer 3 and the low melting point metal layer 2 begins to erode the high melting point metal layer 3. Thus, in the fuse element 1, the erosive action on the low melting point metal layer 2 on the high melting point metal layer 3 can be used to melt the high melting point metal layer 3 at a temperature lower than its melting point so that the current path of the external circuit can be rapidly interrupted.
It should be noted that, in the protective device 30, instead of providing the terminal portions 5a, 5b in the fuse element 1, or, as illustrated in
Hereinafter, examples according to the present disclosure will be described. In these examples, rectangular plate-shaped laminated bodies of laminated high melting point metal and low melting point metal were heat-treated at a predetermined temperature/time before forming fuse elements having bent portions formed by bending into a concave/convex pattern as illustrated in
The fuse elements used in Examples and Comparative Examples had a 200 μm-thick Sn—Ag—Cu-containing solder foil (Sn:Ag:Cu=96.5:3.0:0.5 wt %) as a low melting point metal constituting an inner layer on which a 13 μm-thick Ag plating was formed by electrolytic plating to laminate a high melting point metal layer.
In Example 1, laminated bodies of low melting point metal and high melting point metal were heat-treated at 120° C. for 60 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed reduced cracking in comparison with Comparative Example 1 described below.
In Example 2, laminated bodies of low melting point metal and high melting point metal were heat-treated at 130° C. for 15 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed reduced cracking in comparison with Comparative Example 1 described below.
Furthermore, measuring the fuse element of Example 2 as a sample with X-ray diffraction produced an X-ray diffraction spectrum which was analyzed for the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.135 degrees for the {111} planes and 0.060 degrees for the {200} planes; the ratio of peak intensities for the {111} and {200} planes (200 planes/111 planes) was 8.280.
In Example 3, laminated bodies of low melting point metal and high melting point metal were heat-treated at 150° C. for 15 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed that cracks were absent.
Furthermore, measuring the fuse element of Example 3 as a sample with X-ray diffraction produced an X-ray diffraction spectrum which was analyzed for the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.077 degrees for the {111} planes and 0.070 degrees for the {200} planes; the ratio of peak intensities of the {111} and {200} planes (200 planes/111 planes) was 7.833.
In Example 4, laminated bodies of low melting point metal and high melting point metal were heat-treated at 150° C. for 60 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the absence of cracks.
In Example 5, laminated bodies of low melting point metal and high melting point metal were heat-treated at 200° C. for 15 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the absence of cracks.
Furthermore, measuring the fuse element of Example 5 as a sample with X-ray diffraction produced an X-ray diffraction spectrum which was analyzed for the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.068 degrees for the {111} planes and 0.071 degrees for the {200} planes; the ratio of peak intensities of the {111} and {200} planes (200 planes/111 planes) was 5.073.
In Example 6, laminated bodies of low melting point metal and high melting point metal were heat-treated at 200° C. for 60 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the absence of cracks.
Furthermore, measuring the fuse element of Example 6 as a sample with X-ray diffraction produced an X-ray diffraction spectrum which was analyzed for the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.065 degrees for the {111} planes and 0.070 degrees for the {200} planes; the ratio of peak intensities of the {111} and {200} planes (200 planes/111 planes) was 5.794.
In Example 7, laminated bodies of low melting point metal and high melting point metal were heat-treated at 210° C. for 15 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the absence of cracks.
In Comparative Example 1, laminated bodies of low melting point metal and high melting point metal were not heat-treated before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the presence of cracks.
Furthermore, measuring the fuse element of Comparative Example 1 as a sample with X-ray diffraction produced an X-ray diffraction spectrum which was analyzed for the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.182 degrees for the {111} planes and 0.233 degrees for the {200} planes; the ratio of peak intensities of the {111} and {200} planes (200 planes/111 planes) was 0.047.
In Comparative Example 2, laminated bodies of low melting point metal and high melting point metal were heat-treated at 100° C. for 60 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the presence of cracks.
In Comparative Example 3, laminated bodies of low melting point metal and high melting point metal were heat-treated at 110° C. for 60 minutes before forming fuse elements having bent portions formed by bending into a concave/convex pattern at normal temperature. Visual inspection of the bent portions revealed the presence of cracks.
As represented in Table 1, in each of fuse elements of the Examples, the laminated bodies of high melting point metal and low melting point metal were heat-treated at 120° C. or more before forming bent portions so that crystallinity in the high melting point metal was improved and cracks were suppressed in bent portions of the fuse element.
In contrast, because bent portions of Comparative Example 1 were formed without heat treatment, cracks occurred. Moreover, because the heating temperatures in Comparative Examples 2 and 3 were lower than 120° C., crystallinity of the high melting point metal was low and cracks occurred.
As represented in Table 2, X-ray diffraction spectra of fuse elements of Examples 2, 3, 5, and 6 were used to analyze the full widths at half maximum of 2θ peaks for the {111} and {200} planes resulting in 0.15 degrees or less for the {111} and {200} planes while results were 0.18 degrees or greater for the full widths at half maximum for the {111} and {200} planes in Comparative Example 1. This revealed that, among peaks of the X-ray diffraction spectrum (2θ) of the surface of a high melting point metal layer, by at least one of the peaks having a full width at half maximum of 0.15 or less, good crystallinity could be achieved and cracks could be suppressed.
In contrast with the fuse element of Comparative Example 1 having a ratio of peak intensities (200 planes/111 planes=0.047) for the {111} and {200} planes, the fuse element of Examples 2, 3, 5, and 6 had a ratio of peak intensities (200 planes/111 planes) with an inverse relation for the {111} and {200} planes; this indicates that crystal orientation was changed by heat-treating at a temperature of 120° C. or higher and it was found that this improved crystallinity and contributed to crack suppression.
Moreover, improving crystallinity of the fuse elements of the Examples suppresses resistance increases otherwise caused by grain boundaries and lattice defects, which improves current ratings and can maintain desired blowout properties of achieving rapid blowout at a predetermined current value while avoiding blowout at or below the predetermined current value.
1 fuse element, 2 low melting point metal layer, 3 high melting point metal layer, 5 terminal portion, 6 bent portion, 7 open hole, 8 blind hole, 9 concave/convex portion, 20 fuse device, 21 insulating substrate, 22 cover member, 23 groove, 24 first electrode, 24a first external connection electrode, 25 second electrode, 25a second external connection electrode, 27 flux, 28 device housing, 30 protective device, 31 insulating substrate, 32 electrically insulating member, 33 heat generator, 34 first electrode, 34a first external connection electrode, 35 second electrode, 35a second external connection electrode, 36 heat generator lead electrode, 37 cover member, 38 first heat generator electrode, 39 second heat generator electrode, 41 through-hole
| Number | Date | Country | Kind |
|---|---|---|---|
| 2016-182381 | Sep 2016 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2017/030745 | 8/28/2017 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2018/051774 | 3/22/2018 | WO | A |
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| 20030001716 | Kaltenborn | Jan 2003 | A1 |
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| 20160172143 | Yoneda et al. | Jun 2016 | A1 |
| 20160240342 | Yoneda | Aug 2016 | A1 |
| 20170236673 | Yoneda | Aug 2017 | A1 |
| Number | Date | Country |
|---|---|---|
| 2015-65156 | Apr 2015 | JP |
| 2015072122 | May 2015 | WO |
| 2016047681 | Mar 2016 | WO |
| 2016143353 | Sep 2016 | WO |
| Entry |
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| Oct. 31, 2017 International Search Report issued in International Patent Application No. PCT/JP2017/030745. |
| Number | Date | Country | |
|---|---|---|---|
| 20190172673 A1 | Jun 2019 | US |
