The invention relates to fusible alloy elements, in particular for the use in thermal fuses, in order to protect modules, in particular control units in high current applications against overheating.
In order to protect electric modules against overheating irreversible thermal fuses are required, which interrupts (trigger) a current conducting conductor at a too high ambient temperature. The thermal fuses are thereby so construed, that the trigger temperature is not reaches due to a possibly occurring current floe, so that it is ensured that they can be triggered not by a too high current, but exclusively by a too high ambient temperature. Thus a thermal fuse serves for providing an independent switch-off path for electric modules, which securely interrupts the current flow at improperly high temperatures in the module, for example due to failures of components, shorts, for example by external influences, malfunctioning of isolation materials and such alike.
Usual thermal fuses are mostly based on the concept of a fixed spring (for example a soldered leaf spring), whereby the thermal fuse is opened by the spring force. But also in normal operation, which means in closed state of the thermal fuse, a mechanic force exerts on the connection point, which can cause quality issues, especially at long operating times in the automotive field, for example to a disruption of the solder point.
An alternative embodiment of a thermal fuse uses a conductive fusible material, which begins to melt at a triggering temperature and interrupts thereby a connection.
At thermal fuses, which use a fusible material, it has to be paid attention to the danger that it is for example at least partially melted when soldering the fusible alloy element already during the mounting of the thermal fuse, so that the current path is interrupted. Thereby the thermal fuse would already become useless before using it.
Therefore it has either to be ensured at a soldering process for attaching such a fusible alloy element that the fusible alloy element is only melted locally, which requires a very accurate controlling of the soldering process. At a local melting of the fusible alloy element for attaching at connection points furthermore cold soldering points can develop, which significantly impact the process security and the quality of the electric connection. Or a suitable solder with a melting temperature below the melting temperature of the fusible alloy element is used, in order to solder the fusible alloy element. But that requires a special solder, whose possible triggering temperature has to lie significantly below the melting temperature of the fusible alloy element.
It is the task of the invention to provide a thermal fuse and a fusible alloy element, which securely interrupts the current flow by melting at improperly high temperatures due to failures of components, malfunctioning of isolation material, whereby the triggering mechanism shall thereby basically depend on the ambient temperature and not on the current, so that even failures, which only cause currents, which are lower than the permissible maximum currents, can be securely detected. In particular it shall be ensured that the thermal fuse can be easily created by equipping a punched grid with a fusible alloy element, without already causing a complete or partial melting of the fusible alloy element at the processing during the production.
This task is solved by the fusible alloy element according to claim 1, the thermal fuse, the use of the fusible alloy element as well as by the procedure for producing of a thermal fuse according to the subordinate claims.
Further advantageous configurations of the invention are stated in the dependant claims.
According to a first aspect a fusible alloy element is provided in particular for producing a thermal fuse. The fusible alloy element comprises a fusible element consisting of a material that melts at a triggering temperature; and a support layer on a surface at least in one of the contacting areas of the fusible alloy element. A melting temperature of the material of the support layer is higher than the triggering temperature, whereby the material of the support layer is so selected that it dissolved in solid state in the melted material of the fusible element.
A fusible alloy element can be produced thereby, which can be mounted in more simple and reliable, because it provides an increased resistance against high temperatures during soldering or another mounting process. The process temperature during mounting of the fusible alloy element does not immediately cause a melting of the fusible alloy element, because contracting of the material of the fusible element that melted at the process temperature is prevented by reducing the surface tension. With other words, a contracting of the melted material of the fusible element causes no production of energy due to its surface tension when providing the support layer. The support layer is furthermore so construed that it does not permanently obstruct the melting of the fusible alloy element, because the material of the support layer can dissolve in the material of the fusible element.
Furthermore the material of the fusible element can contain tin and the material of the support layer copper.
According to an embodiment the fusible element is construed in the form of a rectangular to provide a defined current distribution when using it as thermal fuse.
Furthermore the support layer is construed continuously on the surface. The support layer can in particular be construed on the surface and an opposite surface of the fusible element and especially completely enclose the fusible element.
According to an embodiment the thickness and the material of the support layer can be so selected, in order not to melt completely in the melted material of the fusible element at a melted material of the fusible element before a certain period of time.
Furthermore one or several additional layers can be provided on the surface, which comprise at least one of the layers: soldering layer, corrosion layer and adhesion-improving layer.
According to a further aspect a thermal fuse is provided with a connection point on a punched grid and with the above fusible alloy element, which is attached, in particular soldered to the surface at the connection point.
Furthermore it is provided to use the fusible alloy element in a current path of a thermal fuse.
According to a further aspect a procedure for producing a thermal fuse is provided with the steps of placing a contact material, in particular a solder on a connection point; the placing of the above fusible alloy element, so that at least one area of the support layer lies on the contacting material; the heating of the contact material on and above its melting point, so that the contact material connects with the material of the support layer and the connection point, for a period of time after which the material of the support layer is completely dissolved in the melted material of the fusible element and the contact material.
Preferred embodiments of the invention are subsequently explained with the aid of the attached drawings. It is shown in:
a to 1e embodiments for fusible alloy elements according to different embodiments of the present invention;
a to 3b an illustration of the procedure for attaching the fusible alloy element on a punched grid
c an illustration of the thermal fuse in a state after triggering.
According to the invention the fusible alloy element 1 comprises basically a block in the form of a bar with a fusible alloy element 2 made of a fusible material. The fusible element 2 contains a metal or another electrically well conducting alloy or material, through which a current flows, if the fusible alloy element 1 is built into a thermal fuse (see
The melting point of the material of the fusible element 2 is so selected that the block melts at a temperature increase due to operating disturbances, for example failures of electronic components, malfunctioning of the isolation materials, shorts by external influences above a melting temperature and thereby interrupts a current path that exists in the fusible alloy element.
The fusible alloy element 1 is placed and for example soldered between two connection points that are electrically isolated from each other. When soldering the fusible alloy element 1 it has to be paid attention to the fact that the fusible alloy element 1 does not interrupt the current path already during the mounting, which can occur if a temperature would be applied thereby, which is equal to or higher than the melting temperature of the fusible element 2.
Therefore it has either be ensured that the fusible alloy element 1 is either only melted locally during the soldering process either when attaching and connecting with the connection points or soldered with the aid of a solder with a melting point, which is lower than the melting point of the fusible element 2.
In order to simplify the production process of a thermal fuse with such a fusible alloy element 1 a support layer 4 is provided, with which the fusible alloy element 1 is place or rather soldered on the connection points. The support layer 4 provides a high melting point, which is higher than the melting point of the fusible material 2 and the solder, which is used at the soldering process. The support layer 4 is furthermore made of a material, which slowly dissolves in the material of the fusible element 2, which can go into solution. Possible material systems for the fusible element 2 can be materials with a sufficient tin rate, for example more than 30%, more than 50%, more than 70% and in particular preferably more than 80%. The material of the support layer 4 can be copper or a copper alloy with a high copper rate, as for example more than 70%. Copper is advantageous, because it already dissolves in solid state in liquid tin, whose temperature corresponds with its melting temperature, with approximately 10 μm/min, whereby this value is doubled for each 10 K temperature increase above the melting temperature. Other material systems for the materials of the fusible element 2 and the support layer 4 are also possible.
When placing the fusible alloy element 1 on corresponding connection points a usual solder is therefore used, for example the same material as the material of the fusible element 2. The fusible element 2 of the fusible alloy element 1 melts thereby completely or partially and the material of the support layer 4 begins to melt in the material of the melted fusible element 2. The soldering process should be finished before the support layer is completely melted. As long as the support layer 4 is not yet completely melted in the melted fusible element it prevents the contracting of the fusible alloy element 1 on one or several of the connecting points by reducing the surface tension. The thickness of the support layer 4 and the duration of the soldering process for attaching the fusible alloy element 1 at the connection points have to be so selected that only one part of the support layer 4 melts, so that the current path is not interrupted despite a melting down or melting together of the fusible element 2.
In the case of a triggering the support layer 4 that remains after the soldering process during the mounting dissolves in the melted material of the fusible element 2 after the melting of the fusible alloy element 1 after the melting of the fusible alloy and the fusible alloy element 1 interrupts the current path thereby that parts of the melted material accumulate at the connection point for example in the form of drops due to the surface tension of the melted material.
The delay of the responding at a temperature above the melting temperature of the fusible element shall thereby be as short as possible in the end application.
In comparison with a soldering with a solder with a low melting point the advantage this invention is that the contacting of the fusible alloy element 1 can be created at the connection points with the same solder as the fusible alloy, so that also thermal fuses with low triggering temperatures can be selected thereby, because no temperature difference has to be provided between the melting temperature f the solder for attaching the fusible alloy element 1 at the connection points and the fusible material of the fusible element.
a to 1e show different configurations of the fusible alloy element 1. As it is shown in
Besides the embodiment of the fusible alloy element of
As it can be seen in the embodiments of
Furthermore it can be provided according to the embodiment in
e shows based on the embodiment in
The additional layer 5 can for example be a soldering layer, which makes an additional provision of a soldering paste and such alike for soldering the fusible alloy element 1 between the connection points redundant. A soldering of the fusible alloy element 1 can take place by placing the fusible alloy element 1 on the connection points and a corresponding heating.
Furthermore the additional layer 5 can be additionally or alternatively an oxidization layer for the support layer 4, in order to create a higher corrosion resistance. Possible materials therefore are for example Entec or SnAgCu.
The additional layer 5 can furthermore be alternatively or additionally an adhesion-improving layer, which for example provides Ni or Au, in order to simplify a gluing or bonding of the fusible alloy element 1 at the connection points at an alternative form of placing. Furthermore the additional layer or one f them can contain a soldering flux. Preferably the materials of the one or several additional layers are so selected that they also dissolve at the melting of the fusible element 2, or melt or evaporate due to the process temperature.
a and 3b show a mounting process for a thermal fuse.
This is made clear in
c shows a thermal fuse after a triggering, at which the fusible alloy is melted due to a high ambient temperature and the support layer 4 has dissolved in the melted fusible element 2. Due to the surface tension parts of the melted fusible alloy are pulled to the conducting areas 9, where they contract to drops due to its surface tension. Due to the surface tension and the affinity of the melted material of the fusible element 2 to contract on the conducting areas 9, the melted material of the fusible element 2 is pulled out of the area between the conducting areas 9 and there separated.
Number | Date | Country | Kind |
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102007 014 334.8 | Mar 2007 | DE | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP08/51244 | 2/1/2008 | WO | 00 | 3/23/2010 |