This application claims all benefits accruing under 35 U.S.C. § 119 from China Patent Application No. 202311829707.9, filed on Dec. 27, 2023, in the China National Intellectual Property Administration, the contents of which are hereby incorporated by reference.
The disclosure relates to the technical field of surface acoustic wave devices, and in particular to a gallium nitride (GaN) surface acoustic wave resonator.
Surface acoustic wave (SAW) devices are widely used not only in the field of circuit filters, but also in mass sensing, temperature sensing, gas sensing, biochemical sensing, humidity sensing, and air pressure sensing due to their high operating frequency, high frequency quality factor, high sensitivity, and high stability. The quality factor of SAW devices is their most important technical indicator. The higher the quality factor of SAW devices as filters, the better the roll-off characteristics of the filter and the greater the out-of-band suppression. The higher the quality factor of SAW devices as sensors, the higher the sensor sensitivity.
Material properties set on a substrate have a greater impact on the quality factor of surface acoustic wave devices.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures, wherein:
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “another,” “an,” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts have been exaggerated to illustrate details and features of the present disclosure better.
Several definitions that apply throughout this disclosure will now be presented.
The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature which is described, such that the component need not be exactly or strictly conforming to such a feature. The term “comprise,” when utilized, means “comprise, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like. The term of “first”, “second” and the like, are only used for description purposes, and should not be understood as indicating or implying their relative importance or implying the number of indicated technical features. Thus, the features defined as “first”, “second” and the like expressly or implicitly comprise at least one of the features. The term of “multiple times” means at least two times, such as two times, three times, etc., unless otherwise expressly and specifically defined.
Referring to
The substrate 100 comprises an epitaxial growth surface 101, which is a molecularly smooth surface and has impurities such as oxygen or carbon removed. A material of the substrate 100 can be GaAs, GaN, Si, SOI, AlN, SiC, MgO, ZnO, LiGaO2, LiAlO2 or Al2O3, etc. In one embodiment, the substrate 100 is a sapphire substrate.
The carbon nanotube layer 102 is a continuous integral structure comprising a plurality of carbon nanotubes. The plurality of carbon nanotubes in the carbon nanotube layer 102 extend in a direction substantially parallel to a surface of the carbon nanotube layer 102. When the carbon nanotube layer 102 is disposed on the epitaxial growth surface 101 of the substrate 100, the extension direction of the plurality of carbon nanotubes in the carbon nanotube layer 102 is substantially parallel to the epitaxial growth surface 101 of the substrate 100. In one embodiment, a thickness of the carbon nanotube layer is ranged from 1 nanometer to 100 micrometers. In another embodiment, a thickness of the carbon nanotube layer is ranged from 1 nanometer to 1 micrometer. In yet another embodiment, a thickness of the carbon nanotube layer is ranged from 1 nanometer to 200 nanometers. In the present embodiment, the thickness of the carbon nanotube layer is ranged from 10 nanometers to 100 nanometers.
The carbon nanotube layer 102 is a patterned structure, that is, the carbon nanotube layer 102 has a plurality of holes 105, and the plurality of holes 105 penetrate the carbon nanotube layer 102 from a thickness direction of the carbon nanotube layer 102. When the carbon nanotube layer 102 is disposed to cover the epitaxial growth surface 101 of the substrate 100, a portion of the epitaxial growth surface 101 of the substrate 100 corresponding to the hole 105 is exposed to facilitate the growth of the gallium nitride layer 104. The hole 105 can be a micropore or a gap. A size of the hole 105 is ranged from 10 nanometers to 500 micrometers. The size of the hole 105 is 10 nanometers to 300 micrometers, or 10 nanometers to 120 micrometers, or 10 nanometers to 80 micrometers, or 10 nanometers to 10 micrometers. The smaller the size of the hole 105, the more conducive it is to reduce the generation of dislocation defects in the process of growing the gallium nitride layer to obtain a high-quality gallium nitride layer 104. Preferably, the size of the hole 105 is 10 nanometers to 10 micrometers. Further, a duty ratio of the carbon nanotube layer 102 is 1:100 to 100:1, or 1:10 to 10:1, or 1:2 to 2:1, or 1:4 to 4:1. Preferably, the duty ratio is 1:4 to 4:1. The duty ratio refers to an area ratio of the portion of the epitaxial growth surface 101 occupied by the carbon nanotube layer 102 to the portion exposed through the hole 105 after the carbon nanotube layer 102 is arranged on the epitaxial growth surface 101 of the substrate 100.
The carbon nanotube layer 102 can also be directly grown on the epitaxial growth surface 101 of the substrate 100 by a chemical vapor deposition (CVD) method. In another embodiment, the carbon nanotube layer 102 can also be first grown on the surface of the silicon substrate and then transferred to the epitaxial growth surface 101 of the substrate 100.
Specifically, the carbon nanotube layer 102 can comprise a carbon nanotube film or a carbon nanotube wire. The carbon nanotube layer 102 can be a single-layer carbon nanotube film or comprises a plurality of stacked carbon nanotube films. The carbon nanotube layer 102 can also comprise a plurality of parallel carbon nanotube wires or a plurality of cross-arranged carbon nanotube wires. When the carbon nanotube layer 102 is a plurality of stacked carbon nanotube films, layers of carbon nanotube films should not be less than 100 layers. When the carbon nanotube layer 102 comprises a plurality of parallel carbon nanotube wires, a distance between two adjacent carbon nanotube wires is ranged from 0.1 micrometers to 200 micrometers, preferably, 10 micrometers to 100 micrometers. The space between the two adjacent carbon nanotube wires constitutes the hole 105 of the carbon nanotube layer 102. The gap length between the two adjacent carbon nanotube wires can be equal to the length of the carbon nanotube wire. The carbon nanotube film or carbon nanotube wire can be directly laid on the epitaxial growth surface 101 of the substrate 100 to form the carbon nanotube layer 102. By controlling layers of the carbon nanotube films or the distances between the carbon nanotube wires, the size of the hole 105 in the carbon nanotube layer 102 can be controlled.
The carbon nanotube film is a self-standing structure composed of a plurality of carbon nanotubes. The plurality of carbon nanotubes are preferably oriented and extended in a same direction. The preferred orientation means that the overall extension direction of most carbon nanotubes in the carbon nanotube film is basically in the same direction. Moreover, the overall extension direction of most carbon nanotubes is basically parallel to the surface of the carbon nanotube film. Furthermore, most of the carbon nanotubes in the carbon nanotube film are connected end to end by van der Waals force. Specifically, each carbon nanotube in the majority of carbon nanotubes extending in the same direction in the carbon nanotube film is connected end to end with the adjacent carbon nanotube in the extension direction by van der Waals force. There are a few randomly arranged carbon nanotubes in the carbon nanotube film, and these carbon nanotubes will not have a significant impact on the overall orientation arrangement of most carbon nanotubes in the carbon nanotube film. The self-standing carbon nanotube film does not require a large area of carrier support, but can be suspended as a whole and maintain its own film state as long as the supporting force is provided on both sides. That is, when the carbon nanotube film is placed (or fixed) on two supports set at a specific distance, the carbon nanotube film located between the two supports can be suspended and maintain its own film state. The self-standing is mainly achieved by the presence of continuous carbon nanotubes in the carbon nanotube film that are connected end to end by van der Waals force and extend.
Specifically, the majority of carbon nanotubes extending in the same direction in the carbon nanotube film are not absolutely straight and can be bent appropriately; or they are not arranged completely in the extension direction and can be appropriately deviated from the extension direction. Therefore, it cannot be ruled out that the carbon nanotubes in the majority of carbon nanotubes extending in the same direction in the carbon nanotube film can be partially in contact with each other.
Please refer to
When the carbon nanotube layer comprises a plurality of stacked carbon nanotube films, the extension directions of the carbon nanotubes in two adjacent carbon nanotube films form a cross angle, and the cross angle is greater than or equal to 0 degrees and less than or equal to 90 degrees.
The carbon nanotube wire can be a non-twisted carbon nanotube wire or a twisted carbon nanotube wire. Both the non-twisted carbon nanotube wire and the twisted carbon nanotube wire are self-standing structures. Specifically, referring to
The twisted carbon nanotube wire is obtained by twisting the two ends of the carbon nanotube film in opposite directions using a mechanical force. Please refer to
In this embodiment, please refer to
The gallium nitride layer 104 is located on the epitaxial growth surface 101 of the substrate 100, covers the carbon nanotube layer 102, and is disposed in a plurality of holes 105 of the carbon nanotube layer 102 in contact with the epitaxial growth surface 101 of the substrate 100, that is, the gallium nitride layer 104 is grown in the plurality of holes 105 of the carbon nanotube layer 102. The gallium nitride layer 104 and the carbon nanotube layer 102 covered by it are arranged at intervals at a microscopic level, that is, a plurality of holes 103 are formed on the surface of the gallium nitride layer 104 in contact with the substrate 100, and the carbon nanotube layer 102 is disposed in the holes 103. Specifically, the carbon nanotubes in the carbon nanotube layer 102 are respectively disposed in the plurality of holes 103. The holes 103 are formed on the surface of the gallium nitride layer 104 in contact with the substrate 100, and the holes 103 are all blind holes in the thickness direction of the gallium nitride layer 104. In each hole 103, the carbon nanotubes are basically not in contact with the gallium nitride layer 104.
A method for growing the gallium nitride layer 104 can be molecular beam epitaxy (MBE), chemical beam epitaxy (CBE), reduced pressure epitaxy, low temperature epitaxy, selective epitaxy, liquid phase deposition epitaxy (LPE), metal organic vapor phase epitaxy (MOVPE), ultra vacuum chemical vapor deposition (UHVCVD), hydride vapor phase epitaxy (HVPE), or metal organic chemical vapor deposition (MOCVD).
Please refer to
According to measurement and calculation, the quality of the gallium nitride layer manufactured on the sapphire substrate with the carbon nanotube layer of this embodiment has been significantly improved. The gallium nitride surface acoustic wave resonator manufactured on the sapphire substrate with the carbon nanotube layer of this embodiment has a quality factor improved by 33% compared with the gallium nitride surface acoustic wave resonator manufactured on the sapphire substrate. This shows that the introduction of the carbon nanotube layer improves the quality of the crystalline gallium nitride, thereby improving the performance of the gallium nitride surface acoustic wave resonator. When the gallium nitride surface acoustic wave resonator manufactured on the sapphire substrate with the nanotube layer is applied to various electronic devices, the performance of various electronic devices will be greatly improved.
The present disclosure uses a carbon nanotube layer as a mask and is arranged on the epitaxial growth surface of the substrate to grow a gallium nitride layer. Since the carbon nanotube layer is a patterned structure, the patterned carbon nanotube layer has multiple openings so that the epitaxial growth surface of the substrate is partially exposed through the multiple openings. When the substrate is used to grow a gallium nitride layer, the gallium nitride layer can only grow from the exposed epitaxial growth surface and then grow epitaxially laterally to form an integral whole, thereby reducing the contact area between the growing gallium nitride layer and the substrate, thereby reducing the stress between the gallium nitride layer and the substrate during the growth process. At the same time, the patterned carbon nanotube layer can effectively inhibit the extension of dislocation defects to the epitaxial surface, thereby reducing the defects of the gallium nitride layer, and can further improve the quality of the gallium nitride layer.
It is to be understood that the above-described embodiments are intended to illustrate rather than limit the present disclosure. Variations can be made to the embodiments without departing from the spirit of the present disclosure as claimed. Elements associated with any of the above embodiments are envisioned to be associated with any other embodiments. The above-described embodiments illustrate the scope of the present disclosure but do not restrict the scope of the present disclosure.
Depending on the embodiment, certain of the steps of a method described can be removed, others can be added, and the sequence of steps can be altered. The description and the claims drawn to a method may comprise some indication in reference to certain steps. However, the indication used is only to be viewed for identification purposes and not as a suggestion as to an order for the steps.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202311829707.9 | Dec 2023 | CN | national |