Patent Application
20170038010
This application claims priority under 35 U.S.C. §119 to Chinese Patent Application No. 201510483876.0, filed Aug. 7, 2015. The entire teachings of the above application are incorporated herein by reference.
The present disclosure relates to the field of lamps, and more particularly relates to a gas-filled LED (Liquid Emitting Diode) bulb.
The light source component of a general LED bulb includes a LED and a PCB (Printed Circuit Board). The LED is mounted to or inserted in the PCB and electrically connected to the PCB. However, a soldering flux employed by the conventional binding or inserting technology may be left on the light source component. The residue may volatilize in a hermetically sealed chamber of the LED bulb, contaminating the gas in the LED bulb, therefore, a luminance decrease occurs easily.
Therefore, heretofore unaddressed needs exist in the art to address the aforementioned deficiencies and inadequacies.
Therefore, it is necessary to provide a gas-filled LED bulb to overcome the above shortcomings.
A gas-filled LED bulb includes a shell, a holder, and a filament assembly. The shell defines a chamber therein, and the chamber is filled with thermally conductive gas. The holder is secured in the chamber. The filament assembly is positioned in the chamber. The filament assembly includes a plurality of LEDs in a Surface Mount Device (SMD) or a Chip Scale Package (CSP) and a plurality of metallic wires. The LEDs and the metallic wires are alternatively connected to each other to form a chain. Opposite ends of the filament assembly are fixed to the holder.
These and other aspects of the present disclosure will become apparent from the following description of the preferred embodiment taken in conjunction with the following drawings, although variations and modifications therein may be effected without departing from the spirit and scope of the novel concepts of the disclosure.
These and other features of the present invention will become readily apparent upon further review of the following specification and drawings. In the drawings, like reference numerals designate corresponding parts throughout the views. Moreover, components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure.
Embodiments of the gas-filled LED bulb are described more fully hereinafter with reference to the accompanying drawings. The various embodiments of the gas-filled LED bulb may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the gas-filled LED bulb to those skilled in the art. Elements that are identified using the same or similar reference characters refer to the same or similar elements.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Referring to
The holder 200 is secured within the chamber 120. In an embodiment, the holder 200 and the shell 100 can be connected by sintering, and are sintered to form an integrated body, such that the process is simple and the two elements can be firmly jointed. The filament assembly 300 is positioned in the chamber 200. The filament assembly 300 includes a LED 320 in a SMD or a CSP and a metallic wire 340. SMD is an acronym for “Surface Mounted Devices”. CSP is an acronym for “Chip Scale Package”. There can be can be more than two LEDs 320 and more than two metallic wires 340 (i.e., plurality of LEDs and plurality of metallic wires). The plurality of LEDs 320 and the plurality of metallic wires 340 are alternatively connected to form a chain. In an embodiment, the LED 320 and the metallic wire 340 are connected to each other by welding. Opposite ends of the filament assembly 300 are fixed to the holder 200.
In the gas-filled LED bulb 10, according to the present embodiment, no PCB is required for the LED 320 to be mounted on, and on the contrary, the LED 320 can be connected to the metallic wire 340 directly. The LED 320 and the metallic wires 340 can be connected by welding, thus a soldering flux is not required, thereby avoiding contaminating the thermally conductive gas and avoiding a luminance decrease. Because the PCB is not required to connect with the metallic wire 340, the manufacturing process is simple, the PCB and the solder is omitted, thus greatly reducing the cost of production. In addition, the LED 320 in a SMD or a CSP exhibits a high reliability and a high shock resistance. The individually encapsulated LED 320 is connected to the metallic wire 340, thus the structure thereof is reliable and can improve a yield rate. Because the metallic wire 340 can be bent and shaped, the filament assembly 300 can be bent for shaping according to a requirement, thereby realizing a luminance in whole view angle, and in addition, the filament assembly 300 is difficult to be damaged during the manufacturing process, reducing processing difficulties and enhancing yield.
The gas-filled LED bulb 10 further includes a bulb base 400 and a circuit board 500. The bulb base 400 is assembled to the shell 100 and positioned outside the chamber 120. The circuit board 500 is positioned in the bulb base 400 and is electrically connected to the filament assembly 300. In an embodiment, the gas-filled LED bulb 10 further includes a connecting conductive wire 600. At least part of the connecting conductive wire 600 is positioned in the holder 200. The circuit board 500 is electrically connected to the filament assembly 300 via the connecting conductive wire 600. In the embodiment shown in
In the embodiment shown in
It should be noted that the connection between the bulb base 400 and the connecting socket of the LED bulb 10 is not limited to connecting with the threaded coupling and can also adopt a connection of a latching coupling or other types of standard interfaces. Also, referring to
Referring to
Also, referring to
In an embodiment as shown in
Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201510483876.0 | Aug 2015 | CN | national |
