| Number | Date | Country | Kind |
|---|---|---|---|
| 198 33 087 | Jul 1998 | DE |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/DE99/01727 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO00/05573 | 2/3/2000 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4199425 | Sinkevitch | Apr 1980 | A |
| 4541905 | Kuwana et al. | Sep 1985 | A |
| 4863583 | Kurachi et al. | Sep 1989 | A |
| 5326597 | Sawada et al. | Jul 1994 | A |
| 5380424 | Friese et al. | Jan 1995 | A |
| 5423973 | Friese et al. | Jun 1995 | A |
| Number | Date | Country |
|---|---|---|
| 2304464 | Aug 1974 | DE |
| 40 04 172 | Aug 1990 | DE |
| 41 00 106 | May 1992 | DE |
| 41 31 503 | Apr 1993 | DE |
| 44 08 504 | Sep 1995 | DE |
| 197 00 700 | Jul 1998 | DE |
| 0 331 050 | Sep 1989 | EP |
| 0 372 425 | Jun 1990 | EP |
| 0466020 | Jan 1992 | EP |
| 2 066 478 | Jul 1981 | GB |
| Entry |
|---|
| “Electroplating”, Kirk-Othmer Encyclopedia of Chemical Technology, 4th Edition, vol. 9, pp. 277-290, Feb. 1994. |