Number | Date | Country | Kind |
---|---|---|---|
198 33 087 | Jul 1998 | DE |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/DE99/01727 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO00/05573 | 2/3/2000 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4199425 | Sinkevitch | Apr 1980 | A |
4541905 | Kuwana et al. | Sep 1985 | A |
4863583 | Kurachi et al. | Sep 1989 | A |
5326597 | Sawada et al. | Jul 1994 | A |
5380424 | Friese et al. | Jan 1995 | A |
5423973 | Friese et al. | Jun 1995 | A |
Number | Date | Country |
---|---|---|
2304464 | Aug 1974 | DE |
40 04 172 | Aug 1990 | DE |
41 00 106 | May 1992 | DE |
41 31 503 | Apr 1993 | DE |
44 08 504 | Sep 1995 | DE |
197 00 700 | Jul 1998 | DE |
0 331 050 | Sep 1989 | EP |
0 372 425 | Jun 1990 | EP |
0466020 | Jan 1992 | EP |
2 066 478 | Jul 1981 | GB |
Entry |
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“Electroplating”, Kirk-Othmer Encyclopedia of Chemical Technology, 4th Edition, vol. 9, pp. 277-290, Feb. 1994. |