The present invention relates to a gas sensor, and particularly to a gas sensor having low manufacturing costs and a simple manufacturing process.
A gas sensor commonly refers to a device for detecting physical or chemical properties of a gas, and is extensively applied in fields of medicine, industry, technology and environment protection.
For example, the U.S. Pat. No. 9,125,590 B2 discloses a medical ventilator capable of early detecting and recognizing types of pneumonia. The above disclosure includes an aspiration pipeline and a gas recognizing device. The gas recognizing device uses a gas recognition chip to analyze a gas aspired by a patient from the aspiration pipeline to identify the type of pneumonia. The gas recognition chip includes a sensor array, a sensor interface circuit, a stochastic neural network chip, a memory and a microcontroller. The microcontroller is connected to the sensor interface circuit, the stochastic neural network chip and the memory to control operations of these circuits. Thus, the type of pneumonia can be early detected and identified to provide more effective treatments.
However, in the above known technology, the manufacturing of the sensor array is implemented by a semiconductor fabrication process. In general, such type of sensor array has a complicated structure and production costs of the semiconductor fabrication process are high, hence disfavoring commercial promotion of such sensor array.
The primary object of the present invention is to solve issues of a complicated structure of a sensor array of a conventional gas sensor as well as large amounts of manufacturing time and high production costs of a semiconductor fabrication process of the sensor array.
To achieve the above object, the present invention provides a gas sensor. The gas sensor includes: a substrate; a heating layer on the substrate; an insulation layer on the heating layer; and a plurality of detection units on the insulation layer, each of the detection units including a detecting electrode, a separating portion surrounding the detecting electrode, and a reaction sensing film. The detecting electrode includes a first electrode and a second electrode. The first electrode includes a first strip-like electrode, and a first finger-like electrode extending from the first strip-like electrode. The second electrode includes a second strip-like electrode, and a second finger-like electrode extended from the second strip-like electrode. The first finger-like electrode and the second finger-like electrode are alternately arranged. The reaction sensing film is in an accommodating space in the separating portion and in contact with the detecting electrode. The reaction sensing film comes into contact with a gas under test to produce an electrochemical reaction to cause the detecting electrode to generate a recognition signal corresponding to the gas under test.
To achieve the above object, the present invention provides a manufacturing method of a gas sensor. The manufacturing method includes steps of: providing a substrate; forming a heating layer on the substrate; forming an insulation layer on the heating layer; forming at least one detecting electrode on the insulation layer, the detecting electrode including a first electrode and a second electrode, the first electrode including a first strip-like electrode and a first finger-like electrode extending from the first strip-like electrode, the second electrode including a second strip-like electrode and a second finger-like electrode extending from the second strip-like electrode, the first finger-like electrode and the second finger-like electrode alternately arranged; forming a separating portion on the insulation layer, the separating portion surrounding the detecting electrode, and forming an accommodating space on the detecting electrode; and filling a macromolecular material into the accommodating space in the separating portion, and forming a reaction sensing film to obtain the gas sensor.
It is known from the above that, compared to the prior art, the present invention achieves following effects. The gas sensor of the present invention has a simple structure and a convenient fabrication process without involving a semiconductor apparatus or fabrication process, and is suitable for mass production at lower costs.
Details and technical contents of the present invention are given with the accompanying drawings below.
The detection units 40 are on the insulation layer, and are arranged in an array or a pattern. In the embodiment, the detection units 40 may be arranged in an 8×4 array, and are preferably spaced by 100 μm from one another. Each of the detection units 40 includes at least one detecting electrode 401, a separating portion 402 and a reaction sensing film 403. In the present invention, the reaction sensing film 403 may be made of at least one material selected from the group consisting of carboxymethyl cellulose ammonium salt (CMC—NH4), polystyreine (PS), poly(ethylene adipate), poly(ethylene oxide) (PEO), polycaprolactone, poly(ethylene glycol) (PEG), poly(vinylbenzyl chloride) (PVBC), poly(methylvinyl ether-alt-maleic acid), poly(4-vinylphenol-co-methyl methacrylate), ethyl cellulose (EC), poly(vinylidene chloride-co-acrylonitrile) (PVdcAN), polyepichlorohydrin (PECH), polyethyleneimine, beta-amyloid(1-40), human galectin-1 or human albumin, styrene/allyl alcohol (SAA) copolymer, poly(ethylene-co-vinyl acetate), polyisobutylene (PIB), poly(acrylonitrile-co-butadiene), poly(4-vinylpyridine), hydroxypropyl methyl cellulose, polyisoprene, poly(alpha-methylstyrene), poly(epichlorohydrin-co-ethylene oxide), poly(vinyl butyral-co-vinyl alcohol-vinyl acetate), polystyrene (PS), lignin, acylpeptide, poly(vinyl proplonate), poly(vinyl pyrrolidone) (PVP), poly(dimer acid-co-alkyl polyamine), poly(4-vinylphenol), poly(2-hydroxyethyl methacrylate), poly(vinyl chloride-co-vinyl acetate), cellulose triacetate, poly(viny stearate), poly(bisphenol A carbonate) (PC), poly(vinylidene fluoride (PVDF). In the embodiment, the number of the detecting electrodes 401 in each of the detection units 40 may be four, and the detecting electrodes 401 are preferably spaced by 30 μm from one another. As such, the number of the detecting electrodes 401 may be 128. However, the number of the detecting electrodes 401 may be modified according to different application requirements, and is not limited to the example in this embodiment.
Each of the detecting electrodes 401 includes a first electrode 4011 and a second electrode 4012. The first electrode 4011 includes a first strip-like electrode 4011a and a first finger-like electrode 4011b. The second electrode 4012 includes a second strip-like electrode 4012a and a second finger-like electrode 4012b. The first strip-like electrode 4011a and the second strip-like electrode 4012a extend along a first axial direction and are parallel. The first finger-like electrode 4011b extends from the first strip-like electrode 4011a towards the second strip-like electrode 4012a along a second axial direction. The second finger-like electrode 4012b extends from the second strip-like electrode 4012a towards the first strip-like electrode 4011a along the second axial direction. The first finger-like electrode 4011b and the second finger-like electrode 4012b are parallel and are alternately arranged, as shown in
As show in
As shown in
As shown in
After the detecting electrode 401 is formed, a separating portion 402 is formed on the insulation layer 30. The separating portion 402 surrounds the detecting electrode 401, and includes a plurality of separating walls 4021 away from the insulation layer 30 and extending upwards. The separating walls 4021 surround the detecting electrode 401 to form an accommodating space 4022 on the detecting electrode 401.
As shown in
In conclusion, the gas sensor obtained by the method of the present invention is advantaged by having a simple structure. Further, the foregoing steps may be performed by a thick film process, e.g., roll-to-roll processing, without involving semiconductor fabrication processes or thin film technologies. Therefore, the present invention can be readily manufactured at lower costs, and is suitable for mass production.
Number | Date | Country | Kind |
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104141667 | Dec 2015 | TW | national |