This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2015-0007283, filed on Jan. 15, 2015, the disclosure which is hereby incorporated by reference in its entirety.
1. Field
The present disclosure relates to a gate driving circuit and a display apparatus having the same. More particularly, the present disclosure relates to a gate driving circuit capable of improving a display quality and a display apparatus having the gate driving circuit.
2. Description of the Related Art
A display apparatus includes gate lines, data lines, and pixels that are connected to the gate lines and the data lines. The display apparatus includes a gate driving circuit to apply gate signals to the gate lines and a data driving circuit to apply data signals to the data lines.
The gate driving circuit includes a shift register including a plurality of driving stages. The driving stages output the gate signals respectively corresponding to the gate lines. Each of the driving stages includes transistors that are connected to each other.
The present disclosure provides a gate driving circuit capable of preventing a leakage current through a first node when the gate driving circuit employs an oxide semiconductor transistor.
The present disclosure provides a display apparatus capable of improving a driving quality of the gate driving circuit in a low power driving mode.
According to one embodiments of the present disclosure, a gate driving circuit includes a plurality of driving stages applying gate signals to gate lines of a display panel. Among the plurality of driving stages, a k-th (k being a natural number equal to or greater than 2) driving stage includes a first node, an output part that is connected to the first node and outputs a k-th gate signal in response to a voltage of the first node, a control part that controls an electric potential of the first node, an inverter part that outputs a k-th switching signal, and a pull-down part that receives a (k−1)th switching signal from a (k−1)th driving stage of the plurality of driving stages and lowers a voltage of the output part in response to the (k−1)th switching signal.
According to one embodiment of the present disclosure, a display apparatus includes a display panel including a plurality of pixels displaying an image, a plurality of gate lines receiving gate signals to drive the plurality of pixels, and a plurality of data lines receiving data signals, a gate driving circuit disposed on the display panel and applying the gate signals to the gate lines, and a data driving circuit applying the data signals to the plurality of data lines.
The gate driving circuit includes a plurality of driving stages applying the gate signals to the gate lines. Among the plurality of driving stages, a k-th (k being a natural number equal to or greater than 2) driving stage includes a first node, an output part that is connected to the first node and outputs a k-th gate signal in response to a voltage of the first node, a control part that controls an electric potential of the first node, an inverter part that outputs a k-th switching signal, and a pull-down part that receives a (k−1)th switching signal from a (k−1)th driving stage of the plurality of driving stages and lowers a voltage of the output part in response to the (k−1)th switching signal.
According to the above, the electric potential of the k-th gate signal and the first node is lowered by the (k−1)th switching signal that provided from the inverter part of the (k−1)th driving stage, and the circuit configuration of the gate driving circuit is simplified.
In addition, a carry signal or a gate signal of each driving stage is fedback to a connection node of two transistors that is connected to an input terminal and a control terminal of the corresponding driving stage in series, therefore one of the two transistors may be prevented from burning or deteriorating and a condition of withstanding voltage (Vds) of the two transistors may be relieved.
Further, since the current leakage of the first node is reduced, a margin in high temperature is expanded, and the capacitance of a boosting capacitor is reduced, an overall size of the gate driving circuit may be reduced.
The above and other advantages of the present disclosure will become readily apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings wherein:
It will be understood that when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the present disclosure.
Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting of the present disclosure. As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “includes” and/or “including,” when used in this specification, specify the presence of stated feature(s), integer(s), step(s), operation(s), element(s), and/or component(s), but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. Hereinafter, the present disclosure will be explained in detail with reference to the accompanying drawings.
The display panel DP includes a first substrate DS1, a second substrate DS2 spaced apart from the first substrate DS1, and a liquid crystal layer disposed between the first and second substrates DS1 and DS2. When viewed in a plan view, the display panel DP includes a display area DA in which a plurality of pixels PX11 to PXnm are arranged and a non-display area NDA surrounding the display area DA.
The display panel DP includes a plurality of gate lines GL1 to GLn disposed on the first substrate DS1 and a plurality of data lines DL1 to DLm that cross the gate lines GL1 to GLn. The gate lines GL1 to GLn are connected to the gate driving circuit 100. The data lines DL1 to DLm are connected to the data driving circuit 200.
The gate driving circuit 100 and the data driving circuit 200 receive control signals from a signal controller SC, e.g., a timing controller. The signal controller SC is mounted on a main circuit board MCB. The signal controller SC may receive image data and the control signals from an external graphic controller (not shown). The control signals may include, but are not limited to, a vertical synchronization signal as a frame distinction signal, a horizontal synchronization signal as a row distinction signal, a data enable signal maintained at a high level during a data input period, and a main clock signal.
The signal controller SC converts the image data in accordance with the specification of the data driving circuit 200 and applies the converted image data to the data driving circuit 200. The signal controller SC generates a gate control signal and a data control signal based on the control signals. The signal controller SC applies the gate control signal to the gate driving circuit 100 and applies the data control signal to the data driving circuit 200.
The gate driving circuit 100 generates gate signals GS1 to GSn in response to the gate control signal and applied the gate signals GS1 to GSn to the gate lines GL1 to GLn. The gate driving circuit 100 may be substantially and simultaneously formed with the pixels PX11 to PXnm through a thin film process. For example, the gate driving circuit 100 may be directly formed in the non-display area NDA in the form of an amorphous silicon TFT gate driver circuit or an oxide semiconductor TFT gate driver circuit.
The data driving circuit 200 generates grayscale voltages corresponding to the image data provided from the signal controller SC in response to the data control signal from the signal controller SC. The data driving circuit 200 applies the grayscale voltages to the data lines DL1 to DLm as data voltages.
The data voltages include positive polarity (+) data voltages having a positive value with respect to a reference voltage and/or negative polarity (−) data voltages having a negative value with respect to the reference voltage. The polarity of the data voltages is inverted every frame period; a portion of the data voltages has the positive polarity in a particular frame period, and the other portion of the data voltages has the negative polarity in the particular frame period.
As illustrated in
In
Referring to
The pixel transistor TR is electrically connected to an i-th gate line GLi and a j-th data line DLj. The pixel transistor TR outputs a pixel voltage corresponding to the data signal provided through the j-th data line DLj in response to the gate signal provided through the i-th gate line GLi.
The liquid crystal capacitor Clc is charged with the pixel voltage that is output from the pixel transistor TR. An alignment of liquid crystal molecules included in the liquid crystal layer LCL (refer to
The storage capacitor Cst is connected to the liquid crystal capacitor Clc in parallel. The storage capacitor Cst maintains the alignment of the liquid crystal molecules for a predetermined period.
As shown in
The liquid crystal capacitor Clc includes a pixel electrode PE and a common electrode CE. The storage capacitor Cst includes the pixel electrode PE and a portion of a storage line STL that is overlapped with the pixel electrode PE.
The i-th gate line GLi and the storage line STL are disposed on a surface of the first substrate DS1. The control electrode GE is branched from the i-th gate line GLi. The i-th gate line GLi and the storage line STL may be made of aluminum (Al), silver (Ag), copper (Cu), molybdenum (Mo), chromium (Cr), tantalum (Ta), titanium (Ti), or an alloy thereof. Each of the i-th gate line GLi and the storage line STL may have a multi-layer structure including a titanium layer and a copper layer.
A first insulating layer 10 is disposed on the first substrate DS1 to cover the i-th gate line GLi, the control electrode GE, and the storage line STL. The first insulating layer 10 may be an organic layer or an inorganic layer. The first insulating layer 10 may have a multi-layer structure including a silicon nitride layer and a silicon oxide layer.
The active part AL is disposed on the first insulating layer 10 to overlap the control electrode GE. The active part AL includes a semiconductor layer and an ohmic contact layer that are sequentially disposed on the first insulating layer 10.
The semiconductor layer may be made of amorphous silicon, polysilicon, or metal oxide semiconductor. The ohmic contact layer may be more highly doped than the semiconductor layer and may be divided into two portions spaced apart from each other.
The output electrode DE and the input electrode SE are disposed on the active part AL. The output electrode DE and the input electrode SE are spaced apart from each other, and each of the output electrode DE and the input electrode SE is partially overlapped with the control electrode GE.
A second insulating layer 20 is disposed on the first insulating layer 10 to cover the active part AL, the output electrode DE, and the input electrode SE. The second insulating layer 20 may be an organic layer or an inorganic layer. The second insulating layer 20 may have a multi-layer structure including a silicon nitride layer and a silicon oxide layer.
A third insulating layer 30 is disposed on the second insulating layer 20. The third insulating layer 30 provides a flat plane surface. The third insulating layer 30 may be made of an organic material.
The pixel electrode PE is disposed on the third insulating layer 30. The pixel electrode PE is connected to the output electrode DE through a contact hole CH formed through the second and third insulating layers 20 and 30. A lower alignment layer (not shown) may be disposed on the third insulating layer 30 to cover the pixel electrode PE.
A color filter layer CF is disposed on a surface of the second substrate DS2. The common electrode CE is disposed on the color filter layer CF. The common electrode CE is applied with a reference voltage. The reference voltage may have a value different from that of the pixel voltage. An upper alignment layer (not shown) is disposed on the common electrode CE to cover the common electrode CE. An overcoating layer (not shown) may be disposed between the color filter layer CF and the common electrode CE to provide a flat plane surface.
The pixel electrode PE and the common electrode CE that are disposed to face each other such that the liquid crystal layer LCL that is disposed between the pixel electrode PE and the common electrode CE form the liquid crystal capacitor Clc. In addition, the pixel electrode PE and a portion of the storage line STL that are disposed to face each other such that the first, second, and third insulating layer that are disposed between the pixel electrode PE and the portion of the storage line STL form the storage capacitor Cst. The storage line STL may receive a storage voltage having an electric potential different from that of the pixel voltage. The storage voltage may have the same electric potential as the reference voltage.
According to one embodiment, at least one of the color filter layer CF and the common electrode CE may be disposed on the first substrate DS1. In other words, the liquid crystal display panel may include a vertical alignment (VA) mode, a patterned vertical alignment (PVA) mode, an in-plane switching (IPS) mode, a fringe-field switching (FFS) mode, or a plane-to-line switching (PLS) mode pixel.
The driving stages SRC1 to SRCn are connected to the gate lines GL1 to GLn to apply the gate signals to the gate lines GL1 to GLn, respectively. The dummy stage SRC_D is connected to a dummy gate line GL_D to apply a dummy gate signal to the dummy gate line GL_D.
Each of the driving stages SRC1 to SRCn includes an output terminal OUT, a carry terminal CR, an input terminal IN, a control terminal CT, an inverter terminal INV, a clock terminal CK, a first voltage input terminal V1, and a second voltage input terminal V2. The dummy stage SRC_D has the same circuit configuration as the driving stages SRC1 to SRCn and includes the same input/output terminals as those of the driving stages SRC1 to SRCn. Hereinafter, the driving stages SRC1 to SRCn will be described in detail and detailed description of the dummy stage SRC_D will be omitted.
The output terminal OUT of each of the driving stages SRC1 to SRCn is connected to a corresponding gate line of the gate lines GL1 to GLn. The gate signals generated by the driving stages SRC1 to SRCn are applied to the gate lines GL1 to GLn through the output terminals OUT.
The carry terminal CR of each of the driving stages SRC1 to SRCn is electrically connected to the input terminal IN of a next driving stage. The carry terminal CR of each of the driving stages SRC1 to SRCn outputs a carry signal.
The input terminal IN of each of the driving stages SRC1 to SRCn receives the carry signal of a previous driving stage. For instance, the input terminal of a third driving stages SRC3 receives the carry signal of a second driving stage SRC2. Among the driving stages SRC1 to SRCn, the input terminal IN of a first driving stage SRC1 receives a dummy carry signal output from the carry terminal CR of the dummy stage SRC_D. The input terminal IN of the dummy stage SRC_D receives the vertical start signal STV starting the drive of the gate driving circuit 100. The vertical start signal STV is included in the gate control signal that is applied to the gate driving circuit 100 from the signal controller SC. The control terminal CT of each of the driving stages SRC1 to SRCn is electrically connected to the inverter terminal INV of the previous driving stage. The inverter terminal INV of each of the driving stages SRC1 to SRCn outputs a switching signal.
The control terminal CT of each of the driving stages SRC1 to SRCn receives the switching signal of the previous driving stage. For instance, the control terminal CT of the third driving stage SRC3 receives a second switching signal output from the inverter terminal INV of the second driving stage SRC2. The control terminal CT of the first driving stage SRC1 receives a dummy switching signal output from the inverter terminal of the dummy stage SRC_D.
The clock terminal CK of each of the driving stages SRC1 to SRCn receives a first clock signal CKV or a second clock signal CKVB. Among the driving stages SRC1 to SRCn, the clock terminals CK of odd-numbered driving stages SRC1 and SRC3 receive the first clock signal CKV whereas the clock terminals CK of even-numbered driving stages SRC2 and SRCn receive the second clock signal CKVB. The first clock signal CKV and the second clock signal CKVB may have different phases from each other.
The first voltage input terminal V1 of each of the driving stages SRC1 to SRCn receives a first discharging voltage VSS1 whereas the second voltage input terminal V2 of each of the driving stages SRC1 to SRCn receives a second discharging voltage VSS2. In one embodiment, the second discharging voltage VSS2 has a voltage level lower than that of the first discharging voltage VSS1.
In some embodiments, one or more of the output terminal OUT, the input terminal IN, the carry terminal CR, the control terminal CT, the inverter terminal INV, the clock terminal CK, the first voltage input terminal V1, and the second voltage input terminal V2 of each of the driving stages SRC1 to SRCn may be omitted or additional terminals may be added to each of the driving stages SRC1 to SRCn. For instance, one of the first and second voltage input terminals V1 and V2 may be omitted. In addition, the connectivity between the driving stages SRC1 to SRCn may be changed in various ways as described in detail with reference to
Referring to
As shown in
Referring to
The first control transistor TR3_1 applies a first control signal to control an electric potential of the first node NQ to a second node NA before the third gate signal GS3 is output. The first control transistor TR3_1 includes a control electrode and an input electrode that are connected to the input terminal IN to commonly receive the second carry signal CRS2 of the second driving stage SRC2. The first control transistor TR3_1 includes an output electrode connected to the second node NA. In the present exemplary embodiment, the first control signal may be the second carry signal CRS2.
The second control transistor TR3_2 is substantially simultaneously turned on with the first control transistor TR3_1 to apply the first control signal output from the first control transistor TR3_1 to the first node NQ. The second control transistor TR3_2 includes an input electrode connected to the second node NA, a control electrode receiving the second carry signal CRS2 of the second driving stage SRC2 from the input terminal IN, and an output electrode connected to the first node NQ.
The third control transistor TR10 applies the second control signal to the second node NA. The third control transistor TR10 is diode-connected between the output electrode of the second output transistor TR2 and the second node NA such that a current path is formed between the output electrode of the second output transistor TR2 and the second node NA. The third control transistor TR10 includes a control electrode and an input electrode that are commonly connected to the output electrode of the second output transistor TR2 and an output electrode connected to the second node NA. The second control signal may be the same as the third carry signal CRS3. The capacitor Cb is connected between the output electrode of the first output transistor TR1 and the control electrode (i.e., the first node NQ) of the first output transistor TR1.
Referring to
As shown in
The second carry signal CRS2 has the low level in the third scanning period H3 that corresponds to an electric potential of the second discharging voltage VSS2. When the second discharging voltage VSS2 has the voltage level of about −10 volts, a difference in electric potential between the input terminal IN of the third driving stage SRC3 and the first node NQ of the third driving stage SRC3 is about 40 volts. When the first and second control transistors TR3_1 and TR3_2 have the same channel size, the second node NA has the electric potential of about 20 volts corresponding to a half of the electric potential difference of about 40 volts. However, although the first and second control transistors TR3_1 and TR3_2 have the same channel size, the electric potential of the second node NA falls down to the electric potential of about −10 volts. As a result, a gate-source voltage Vgs of the second control transistor TR3_2 increases, and a leakage current of the second control transistor TR3_2 increases in the third scanning period H3.
However, as shown in
The pull-down part 130 lowers the electric potential of the third carry signal CSR3 and the third gate signal GS3 in response to the switching signal (i.e., a second switching signal SS2) of the previous driving stage (i.e., the second driving stage SRC2). The pull-down part 130 includes first and second pull-down transistors TR4 and TR11 to respectively lower the electric potential of the output terminal OUT and the carry terminal CR in response to the second switching signal SS2.
The first pull-down transistor TR4 includes an input electrode connected to the first voltage input terminal V1, a control electrode connected to the control terminal CT, and an output electrode connected to the output electrode of the first output transistor TR1. The second pull-down transistor TR11 includes an input electrode connected to the second voltage input terminal V2, a control electrode connected to the control terminal CT, and an output electrode connected to the output electrode of the second output transistor TR2. The control terminal CT is connected to the inverter terminal INV of the second driving stage SRC2 to receive the second switching signal SS2.
The inverter part 140 of the third driving stage SRC3 applies the third switching signal SS3 to the inverter terminal INV. The inverter part 140 includes first, second, third, and fourth inverter transistors TR6, TR7, TR8, and TR9. The first inverter transistor TR6 includes input and control electrodes that are commonly connected to the clock terminal CK and an output electrode connected to a control electrode of the second inverter transistor TR7. The second inverter transistor TR7 includes an input electrode connected to the clock terminal CK and an output electrode connected to the inverter terminal INV.
The third inverter transistor TR8 includes an output electrode connected to the output electrode of the first inverter transistor TR6, a control electrode connected to the first node NQ, and an input electrode connected to the second voltage input terminal V2. The fourth inverter transistor TR9 includes an output electrode connected to the inverter terminal INV, a control electrode connected to the first node NQ, and an input electrode connected to the second voltage input terminal V2. In one embodiment, the input electrode of the third and fourth inverter transistors TR8 and TR9 is connected to the first voltage input terminal V1.
The first and second inverter transistors TR6 and TR7 are turned on in the high period of the first clock signal CKV to output the first clock signal CKV. The third and fourth inverter transistors TR8 and TR9 are driven depending on the electric potential of the first node NQ. As shown in
Referring to
Referring to
In some embodiments, one of the first and second discharging transistors TR5_1 and TR5_2 of the discharge part 150 may be omitted. In addition, the first and second discharging transistors TR5_1 and TR5_2 may be connected to the first voltage input terminal V1 other than the second voltage input terminal V2.
The third control transistor TR10 is diode-connected between the third node NB and the carry terminal CR. Accordingly, when the electric potential of the third carry signal CRS3 increases, the third control transistor TR10 is turned on, and the third carry signal CRS3 is applied to the third node NB.
For example, the electric potential of the first node NQ is boosted to the voltage level of about 30 volts, and the second discharging voltage VSS2 has the voltage level of about −10 volts in the third scanning period H3. In this case, a difference in electric potential between the second voltage input terminal V2 and the first node NQ is about 40 volts. When the first and second discharging transistors TR5_1 and TR5_2 have the same channel size, the third node NB has the electric potential of about 20 volts corresponding to a half of the electric potential difference of about 40 volts. However, although the first and second discharging transistors TR5_1 and TR5_2 have the same channel size, the electric potential of the third node NB may fall down to the electric potential of about −10 volts. As a result, a gate-source voltage Vgs of the first discharging transistor TR5_1 increases, and a leakage current of the first discharging transistor TR5_1 increases in the third scanning period H3.
However, as shown in
As described above, the electric potential of a k-th gate signal, a k-th carry signal, and the first node NQ is lowered or discharged by the (k−1)th switching signal from the inverter part of the previous driving stage, thus the lowered or discharged state is stably maintained.
The driving stage SRC3′ shown in
According to one embodiment, the input electrode of the third control transistor TR10 may be connected to the output terminal OUT, and the control electrode of the third control transistor TR10 may be connected to the carry terminal CR. According to another embodiment, the input electrode of the third control transistor TR10 may be connected to the carry terminal CR, and the control electrode of the third control transistor TR10 may be connected to the output terminal OUT.
Referring to
The output terminal OUT of each of the driving stages SRC1 to SRCn is connected to a corresponding gate line of the gate lines GL1 to GLn. The gate signals generated by the driving stages SRC1 to SRCn are applied to the gate lines GL1 to GLn through the output terminals OUT.
The output terminal OUT of each of the driving stages SRC1 to SRCn is electrically connected to the input terminal IN of a next driving stage. Therefore, the input terminal IN of each of the driving stages SRC1 to SRCn receives the gate signal of a previous driving stage. For instance, the input terminal of the third driving stages SRC3 receives the second gate signal from the second driving stage SRC2. Among the driving stages SRC1 to SRCn, the input terminal IN of the first driving stage SRC1 receives a vertical start signal STV starting the operation of the gate driving circuit 101 instead of the gate signal of the previous driving stage.
The control terminal CT of each of the driving stages SRC1 to SRCn is electrically connected to the inverter terminal INV of the previous driving stage. The inverter terminal INV of each of the driving stages SRC1 to SRCn outputs the switching signal.
The control terminal CT of each of the driving stages SRC1 to SRCn receives the switching signal of the previous driving stage. For instance, the control terminal CT of the third driving stage SRC3 receives the second switching signal output from the inverter terminal INV of the second driving stage SRC2.
Referring to
The control part 120 includes a third control transistor TR10′ that has input and control electrodes commonly connected to the output terminal OUT. The output electrode of the third control transistor TR10′ is connected to the second and third nodes NA and NB. The third control transistor TR10′ is turned on in response to the third gate signal during the third scanning period to apply the third gate signal to the second and third nodes NA and NB. The electric potential of the second and third nodes NA and NB may be held to the high level of the third gate signal in the third scanning period. Therefore, the conditions of the withstanding voltage of the first and second control transistors TR3_1 and TR3_2 and the withstanding voltage of the first and second discharging transistors TR5_1 and TR5_2 may be relieved.
Compared to the pull-down part 130 shown in
Referring to
Referring to
The signal controller SC applies the low power signal RST to the gate driving circuit 103. In a low power mode, the gate driving circuit 103 is operated at a driving frequency lower than that of a normal mode. In the low power mode, the stop period, in which the gate driving circuit 103 is not operated, occurs, or a width of the stop period increases since the driving frequency is low. During the stop period, the low power signal RST controls the hold part 160 such that the electric potential of the output terminal OUT, the carry terminal CR, and the first node NQ is held to the first discharging voltage VSS1 or the second discharging voltage VSS2.
The first holding transistor TR12 is turned on in response to the low power signal RST to apply the first discharging voltage VSS1 to the output terminal OUT, and the second holding transistor TR13 is turned on in response to the low power signal RST to apply the second discharging voltage VSS2 to the carry terminal CR. Accordingly, the third gate signal and the third carry signal that are respectively applied to the output terminal OUT and the carry terminal CR may be held in the first and second discharging voltages VSS1 and VSS2, respectively, during the stop period.
When the hold part 160 is added to the driving stage SRC3″, from which the second output transistor TR2 is removed as shown in
The third holding transistor TR3 is turned on in response to the low power signal RST to apply the second discharging voltage VSS2 to the first node NQ. The second discharging voltage VSS2 has the voltage level lower than that of the first discharging voltage VSS1. When the electric potential of the first node NQ is lower than the electric potential of the output terminal OUT, a gate-source voltage Vgs of the first output transistor TR1 is low, thus an off-current of the first output transistor TR1 may be prevented from increasing. Therefore, the current leakage at the first node NQ may be reduced during the stop period.
Referring to
In
In
In addition, when the current leakage of the first node NQ is reduced, a margin in a high temperature environment expands, and a capacitance of the capacitor Cb (refer to
Although the exemplary embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these exemplary embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present disclosure.
Number | Date | Country | Kind |
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10-2015-0007283 | Jan 2015 | KR | national |