Embodiments of the invention relate to a gemstone machining center and/or method, in particular for performing substantial automatic machining
Machining facets on gemstones such as diamonds requires attention to various aspects. For example, the hardness of the diamond and a diamond's grain should be taken into consideration, where grain dictates that e.g. a facet should be presented to a scaife in such a way that the direction of movement of the scaife forms an appropriate angle with a given crystallographic or grain direction in that facet.
Typically when working facets a machining member contacts the gemstone being worked in a working plane, where such machining member may be a polishing member in the form of a wheel or disc of a scaife made of thick cast iron. A gemstone polishing member includes measures for holding and driving a moving machining member and at least one polishing machine.
While working facets of a gemstone, the stone is typically held in a relative long-shaped holder with an axis normally parallel with that of the stone. Thus when working a facet, the holder may have its axis inclined to the working plane at an angle that defines the angle of the facet.
GB2037196 describes a gemstone polishing machine that has a rotatable grain shaft for mutually orientating a gemstone and a rotating scaife. A signal dependent on drag between the stone and scaife is generated and a drive rotates the grain shaft to orientate the stone so as to give a high drag. Drag is generally related to polishing efficiency and the stone can thus be polished efficiently. In an arrangement a signal dependent on the rate of stone feed is generated to confirm efficient polishing.
The following embodiments and aspects thereof are described and illustrated in conjunction with systems, tools and methods which are meant to be exemplary and illustrative, not limiting in scope.
In an embodiment there is provided a gemstone machining center comprising: a set-up station adapted to deliver onwards loaded-dops each comprising a dop holder and a gemstone bonded to the dop holder, a bruting/cutting station for receiving loaded-dops from the set-up station, and at least one polishing station for receiving gemstones after being detached from their dop holders.
The set up station may include automatic and/or manual steps for setting up a gemstone on a dop holder, and may include moving dop holders with gemstones upon a conveyor between various stations, such as curing stations, where the gemstones bond to their respective dop holders to form loaded-dops.
In an embodiment there is also provided a capsule for securing a gemstone for use in a gemstone machining center, comprising a dop-holder and a gemstone secured to an upper tip of the holder.
Such capsule may be formed in the set up station, and may function to house the loaded dop until transferred for further machining of its gemstone in a machining center, possibly of a transfer type.
In an embodiment there is also provided a method for transferring a gemstone between machining/polishing stations comprising the steps of: providing a source machining/polishing station initially holding onto a gemstone, providing a destination machining/polishing station comprising a dedicated seat arranged for receiving the gemstone, urging at least one of the source and destination machining/polishing stations towards each other to bring the gemstone into contact with the dedicated seat, and applying suction at the dedicated seat to at least temporarily hold onto the gemstone.
Such handling and transferring ay permit moving a gemstone between various machining stations and forming preferably automatically required shapes I the gemstone.
In addition to the exemplary aspects and embodiments described above, further aspects and embodiments will become apparent by reference to the figures and by study of the following detailed descriptions.
Exemplary embodiments are illustrated in referenced figures. It is intended that the embodiments and figures disclosed herein are to be considered illustrative, rather than restrictive. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying figures, in which:
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated within the figures to indicate like elements.
While machining e.g. facets on gemstones, substantial difficulties may be encountered with diamonds in particular due to their extreme hardness, mechanical, physical and/or chemical properties. Thus, despite being related to gemstones in general, the various embodiments herein at least in certain cases may be described with reference to diamonds, since machining techniques used for diamonds typically can be used for any other (natural or synthetic) gemstones.
Attention is first drawn to
Attention is drawn to
Sleeve 28 may be assembled over dop holder 22 in order to surround the gemstone. Sleeve 28 in one example may be arranged to include windows 281 extending sideways through the sleeve to permit viewing and/or physical access to the gemstone from the outside. Retaining cap mechanism 30 may be assembled on top of the sleeve and may be arranged to include an abutment member (or plunger) 301 for securing the gemstone within the capsule. In this example, the abutment member may be spring biased downwards to bear against the gemstone from above in order to support the gemstone against dop holder 22 at least during a curing process within station 18.
With attention drawn back to
From loading section 181 the capsules are accordingly carried towards and through curing section 182 where the adhesive/cement attaching each gemstone to its dop holder undergoes hardening. Capsules exiting the curing section may then be arranged to pass via first, second and possibly third manipulators 32, 34, 35. The first manipulator 32 may be arranged to remove the retaining cap mechanism 30 and sleeve 28 off each capsule 20 into a sleeve collection tray 11, the second manipulator 34 may be arranged to remove each dop holder 22 with its attached gemstone off the base of the capsule and the third manipulator 35 may be arranged to remove the base of the capsule 26 off the conveyor into a base collection tray 15. Conveyer 17 may then continue to advance its empty chain-links/elements/pockets back towards the loading section 181 where new capsules 20 may be loaded into the station. From hereon a dop holder with a gemstone attached/cemented to it (either by the method discussed in relation to system 18 or any other method)—may be referred to herein as a loaded-dop.
Attention is drawn to
Provision of loading hub 38 may be useful, inter alia, in serving as a so-called buffer zone for storing at least momentarily loaded-dops until machining means within bruting station 36 become available. Since, gemstones on different dops may be different and/or require different machining—the timing of the machining process of each gemstone may be different—thus making hub 38 useful in providing a zone where loaded-dops can be arranged to await in queue for machining cycle.
Bruting/cutting station 36 in addition includes a holder center 40 possibly functioning as an automatic gemstone centering and driving mechanism. Bruting/cutting station 36 in addition includes a number of bruting/cutting stations, as desired. In the presented example, a first girdle bruting/cutting station 42 and a second pavilion bruting station 44 are located about holder center 40. Holder center 40 may be arranged to rotate about an axis R by possibly being placed on a servo-driven rotary table 401. Holder center 40 includes a pneumatic or hydraulic operated dead-length collet block 402 for clamping loaded-dops. The dead-length collet block may be arranged to generally clamp loaded-dops about a holder axis H, which may be generally perpendicular to axis R of rotation.
Holder 40 may include a rotary union 37 (see indicated in
Holder 40 also includes a sensor 403 located here above a location where the gemstone is arranged to be placed when its dop is clamped within holder 40. Sensor 403 may be an optical sensor such as a CCD camera (or the like) for viewing and/or sensing the gemstone's position and/or orientation.
Sensor 403 may be arranged to provide sensed data that can be used for computing geometrical data (in 2D or 3D) of the gemstone's position and/or orientation when it is being held in the collet and/or during its machining/bruting process. Data gathered by sensor 403 may assist to determine when an axis of symmetry of a target shape of the current gemstone is generally aligned with axis H. Such alignment may be needed since a rough gemstone to be machined may fitted in-accurately to its dop, e.g. due to it being fitted manually to the dop—so that the axis of symmetry of the target shape of such gemstone may not necessary be aligned with the dop's axis of symmetry. Data gathered by sensor 403 may also assist to determine when a target shape in a certain area of the gemstone being machined has been obtained and by that e.g., stop the machining of that operation.
Sensor 403 may also be used for monitoring presence of the gemstone during machining—to ensure e.g., that it did not unintentionally detach from its dop. Since sensor 403 in the examples illustrated is located above the gemstone 24, at least in the top views provided in
Attention is drawn to the enlarged view at the upper side of
Pneumatic and/or hydraulically operated dead-length collet block 402 may be coupled via a manifold cylinder-block 401 with a widening 1 at a rear side to a centering hub 404. Centering hub 404 in this example includes a shoulder 2 at its forward side and a disk 4 may be arranged to bear forwardly against widening 1 of manifold cylinder-block 401 in order to press its widening 1 against shoulder 2 and by that lock the location and orientation of manifold cylinder-block 401 and consequently of the dead-length collet block and loaded-dop relative to centering hub 404—within holder center 40. Forward bearing at the disk 4 against chassis 401 in the illustrated example may be obtained by a hydraulic piston 406.
The single acting hydraulic piston 406 may be arranged to urge forwardly and rearwardly disk 4 at a rear side of a possible series of Belleville washers/coned-disc springs, here illustrated by one Belleville washer 3 and by that urge loading and ease of loading of Belleville washer 3 by reducing and increasing respectively a spacing 6 formed between disk 4 and a disk 7 pressed by Belleville washer 3 against a rear side of chassis 401. During a centering operation piston 406 may be retracted backwards, and by that spacing 6 may be increased resulting in unloading of Belleville spring 3 while still maintaining sufficient pressing force against disk 7 and by that formation of friction force between widening 1 and shoulder 2 to temporary hold substantially in place manifold cylinder-block 401 against centering hub 404. A peripheral spacing 5 present between an outer periphery of widening 1 and an inner face of centering hub 404—may permit urging relative movements between manifold cylinder-block 401 and centering hub 404.
A centering operation cycle may include several optional steps including the following. First a fixation mechanism 405 may be urged forward by possibly several peripheral single-acting hydraulic pistons 407—thereby urging cylinder-block 401 to be generally centered and concentric with centering hub 404. Attention is additionally drawn to
Once such centering is generally met—in the example illustrated—piston 406 may be manipulated to urge disk 4 to move forwardly and by that increase the friction force between widening 1 and shoulder 2, which now holds manifold cylinder-block 401 against centering hub 404 in a fixed place at its last position (where e.g. a gemstone target may now be centered). Monitoring and control of the incremental steps taking place in order to form the centering of the loaded-dop relative to axis H may be facilitated by, e.g. image processing of, information gathered by sensor 403 viewing/sensing the gemstone fitted to the loaded-dop (notably, besides vision other sensing technologies may be applied by sensor 403).
Attention is additionally drawn to
Once a loaded-dop is clamped within holder 40 and has been centered as described above, the mechanism may be rotated about axis R to the positions of different bruting/cutting sites/terminals Thanks to the combination of coordinated movement between servo-controlled rotation movement of gemstone 24 around H-axis and servo-controlled linear/rotational movements along/about respective axes B/S of the bruting stations, cutting/machining of a gemstone may be performed along a variety of profiles.
In the illustrated example, as seen in
Such sensing may also be via a laser or optic sensor. Possibly, bruting/machining process at such stations 42, 44 may be performed by altering machining RPM, such as by initially starting at a relative low RPM and once contact has been obtained—gradually increasing the RPM while possibly also gradually advancing the station along its axis B. Other means may be used for sensing such as acoustic & vibration sensors.
Attention is drawn to
The polishing station 48 here seen may be that illustrated e.g. in
Here the rails 77 are seen located above head section 54 however arrangements may be envisioned for supporting such linear movement along an axis parallel to Y e.g. from generally below head section 54. Polishing station head 54 may be arranged to include a cushioned restraining damper e.g. 771 that may be arranged to dampen/restrain its dedicated seat 52 for seating the gemstone until reaches its final desired position.
In the state seen in
The head section 54 of polishing station 48 may include fluid channels for activation of vacuum suction and/or pressurized air at a tip of dedicated seat 52 where the gemstone is adapted to be located. Activation and de-activation of such vacuum suction and/or pressurized air may be assisted by pressurized air arriving from pressurized air vessel source (not shown). Vacuum suction, possibly based on the Venturi effect, may be arranged to operate through a dedicated mechanism at the head section 54 for holding onto the gemstone being transferred.
Prior to turning attention to
In
The dedicated seat visualized in
Prior to discussing the hand-off procedure e.g., depicted in
Attention is now drawn to
In the position seen in
With attention momentarily drawn back to
Accordingly, vacuum suction applied at the bottom of dedicated seat 52 of polishing station 48 may be used to keep the gemstone safely attached at the dedicated seat in position and orientation until clamp 50 is urged to secure the gemstone at its table against the dedicated seat 52. This process may be applied by first distancing away head section 54 of polishing station 48 and its dedicated seat 52 now gripping onto the gemstone by vacuum suction (see
Attention is drawn to
An example of a possible guided ‘Mass-Spring-Damper’ (MSD) mechanisms 58 is accordingly seen in the enlarged section provided in
Upward movement of the polishing scaife/wheel 561 towards the gemstone may include a slow incremental upward crawling of the polishing scaife/wheel 561 as optionally described below.
Shear pin 610 may be urged to move upwards one incremental, pre-determined, distance by a possible linear servo-drive mechanism 57. Consequently, mid-frame 583 may be urged to move upwards, the same pre-determined distance, together with guided pillars 589, 587, stopper-column 585, dampers 581 and springs 582. The distance between the bottom of the mechanical stopper 600 and the top of the mid-frame plate 583 may be defined mainly by parameters of stopper-column 585 (e.g. its length) and mechanical stopper 600 (e.g. its thickness). As long as there is no external load on the polishing Scaife/wheel 561—the pre-loaded force of springs 582 holds in place polishing Scaife plate 580 against the mechanical stoppers 600 while maintaining springs 582 under a quasi-static load. Quasi-static load means a load applied substantially slowly so that the structure (springs 582 in our case) deforms also respectively slowly (generally at a substantially low strain rate) therefore resulting in an inertia force substantially small that can consequently be ignored. Guide pillars 589 and 587, guided by guide bushings 588 and 586 respectively, maintain eventually the geometric relations between the polishing Scaife 561 and the gemstone 24. This way the machine may advance slowly its polishing Scaife 561 towards the gemstone 24.
A gap may be opened between the mechanical stopper 600 and the polishing Scaife/wheel plate assembly 580 when polishing Scaife/wheel 561 touches a gemstone 24 since the gemstone thrust load/action on polishing Scaife/wheel 561 overcomes the springs pre-loaded force and thus creating a relative movement between itself and the rest of the members which keep moving upwards until they finish their pre-determined distance increment. This gap may be closed slowly since gemstone 24 is being polished by the polishing Scaife 561 and material is being removed both from the gemstone and the polishing Scaife 561. This relative movement between polishing scaife plate 580 and mid-frame plate 583 may be dampened by dampers 581. The presence of a Mass-damper-Spring mechanism elements enables to control and/or to optimize the response of the system to the incoming loads applied by gemstone 24 machining process.
The position of stopper 600 may be chosen so that small incremental polishing actions may be performed. Each time a limit set by stopper 600 is reached, the precise mechanical stopper may be re-positioned slightly upwards to permit an additional incremental polishing action of the gemstone. The system may be arranged to detect when a limit set by stopper 600 is reached e.g. by the closing of an electric circuit confirming that plate 580 and stopper 600 are once again in contact. The polishing station may also include a probe 59 (e.g. Renishaw probe—see marked in
Dedicated seat 52 extends along an axis G and is accordingly arranged to situate gemstone 24 at its free axial end. Dedicated seat 52 may also be rotated about axis G in relation to a body 62 of head section 54 and may include the procedure illustrated in
Once a planned machining action of the gemstone is complete, guided MSD mechanism 58 may retreat downwards and away from head section 54. If required, indexing of the gemstone about axis G may be then performed in order to place a new section of the gemstone facing downwards towards polishing Scaife/wheel 561. To permit such indexing, suction securing the gemstone to dedicated seat 52 may first be activated and then clamp 50 may be moved away from a position abutting the gemstone as illustrated in
Attention is additionally drawn to
A subsequent polishing action of a new facet of the gemstone may then be performed by incrementally lifting the grinding wheel towards head section 54 as previously described. Facet formation in the gemstone at polishing station 48 may also include formation, inter alia, of break facets and/or other desired geometry of facets.
Accordingly, several degrees of freedom (rotational and linear) within polishing station 48 may permit defining a variety of relative orientations between faces/sides of the gemstone and grinding section 56, in particular grinding wheel 561. These degrees of freedom may include tilt axis T permitting tilt of head section 54 about an axis T, which in this example is seen extending generally parallel to the ground face. Such tilting of the head section may be in relation to a housing 53 that is here seen coupled to rotating table mechanism 88. Rotating table mechanism 88 may rotate housing 53 about axis P. After desired orientation of gemstone 24 relative to scaife/grinding wheel 561 may be achieved and after polishing direction of current facet was found (as described below), rotating table mechanism 88 may oscillate linearly (e.g. along the T Axis direction in our embodiment) or along a radial/parabolic curve profile—consequently oscillating housing 53 and head section 54, resulting in scaife/grinding wheel 561 to wear evenly.
An additional rotational angle may permit defining different pan angles here of housing 53 (including head section that is secured to it) about an upright extending axis P. An additional rotational degree of freedom, already described above, may be that of seat 52 about axis G—while linear degrees of freedom/movements may be accordingly those along axis Y, along axis T and the up/down movement of the grinding section 56.
Diamonds typically have optimal polishing directions along which they can be polished most easily, which may sometimes be referred to as three crystallographic axes\directions of easy abrasion. In practice, such direction(s) is/are normally found by trial and error. In cases where the direction is known the trial and error process will be minimal. In embodiments discussed herein, trial an error of identifying such direction(s) along which polishing is adapted to take place—may be assisted by the above described degrees of freedom along and/or about e.g. axes P, G, Y and T.
Detection of optimal polishing directions may be performed by use of ‘means’ for detecting when material commences to be removed by polishing off of the gemstone. Such ‘means’ may take form of an electric circuit\sensor e.g. located within polishing scaife/wheel section 56 e.g. between stopper 600 and polishing scaife/wheel-plate 580. Successful removal by polishing of material from the gemstone—achieved when an optimal polishing direction is found—permits polishing scaife/wheel-plate 580 to rise upwards towards stopper 600 to be detected by said sensor e.g. closing an electric circuit confirming plate 580 and stopper 600 are once again in contact. Once proper orientation in relation to a polishing scaife/wheel 561 of a gemstone held within e.g. head section 54 has been obtained—the discussed degrees of freedom permitting the finding of the optimal polishing direction may be “locked” and polishing action of the gemstone may take place to form e.g. a facet in the gemstone.
Attention is drawn to
Attention is drawn to
Transfer of the gemstone from one polishing station 48 (delivering) to another polishing station 64 (receiving) may be performed as following.
A first possible step for executing the transfer may include a linear servo-controlled movement of at least a portion of the delivering polishing station 48, such as head section 54, towards a possible receiving polishing station 64. This may be facilitated by provision of servo motor driving a lead screw connected to head section 54 along linear rails 77 (see e.g.
Rails 77 are seen located above head section 54 however arrangements may be envisioned for supporting such linear movement along an axis parallel to Y e.g. from generally below head section 54. Polishing station head 54 may be arranged to include a cushioned restraining dampers until its dedicated seat 52 seating the gemstone reaches its final desired position, so that the meeting action between head sections of the two polishing stations 48, 64 occurring at the gemstone will be dampened to reduce possible damage to the gemstone and/or the machining utilities.
After such contact vacuum suction applied at dedicated seat 521 of receiving polishing station 64 may be used to keep the gemstone safely attached at the dedicated seat 521 in a new position and orientation. After such instance the suction of the dedicated seat 52 of delivering polishing station 48 may be de-activated.
In a subsequent possible step, distancing away of the head section of polishing station 48 may be activated while dedicated seat 521 may now be arranged for locating and seating the gemstone by vacuum suction (see
Polishing actions performed by the different polishing stations may be generally similar to those possibly performed and described with respect to the first polishing station as also illustrated in
Attention is drawn to
Station 66 may include a first manipulator 67, a gemstone grading machine 68, a second manipulator 69, a packaging element 63 and a packaging stand 65. In this example, first manipulator 67 may include a dedicated gripper mechanism including a dedicated seat 522 connected to a Mass-Spring-Damper (MSD) mechanism enabling a vacuum suction at the tip of dedicated seat 522, possibly in similarity to the descriptions already provided herein above. In this example, manipulator 69 may include a gripper in an optional form of an amorphous/adaptive gripper 691—here in form of a balloon filled with granular material that upon suction may be adapted to collapse and grip onto any amorphous object in contact therewith. Gripper 67, here by being arranged to rotate inter-alia about an axis Z1, may be used for removing gemstones from the last polishing station and placing them at grading machine 68.
After completion of grading of a gemstone, manipulator 69 with its amorphous gripper 691, here by being arranged to rotate inter-alia about an axis Z2, may be used for removing gemstones from the diamond grading machine 68 and placing them inside a receptacle (e.g. a Ziploc bag) waiting at packaging stand 65. After such instance packaging element 63 may be used to seal the receptacle (e.g. attaching the Ziploc bag). Possibly, a stamp including properties of the gemstone may then be stamped to the receptacle and buffer station 70 may subsequently be used to temporarily store finished gemstones prior to them leaving the machining system 10 for possible storage.
In the description and claims of the present application, each of the verbs, “comprise” “include” and “have”, and conjugates thereof, are used to indicate that the object or objects of the verb are not necessarily a complete listing of members, components, elements or parts of the subject or subjects of the verb.
Furthermore, while the present application or technology has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and non-restrictive; the technology is thus not limited to the disclosed embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art and practicing the claimed technology, from a study of the drawings, the technology, and the appended claims.
In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures can not be used to advantage.
The present technology is also understood to encompass the exact terms, features, numerical values or ranges etc., if in here such terms, features, numerical values or ranges etc. are referred to in connection with terms such as “about, ca., substantially, generally, at least” etc. In other words, “about 3” shall also comprise “3” or “substantially perpendicular” shall also comprise “perpendicular”. Any reference signs in the claims should not be considered as limiting the scope.
Although the present embodiments have been described to a certain degree of particularity, it should be understood that various alterations and modifications could be made without departing from the scope of the invention as hereinafter claimed.
Filing Document | Filing Date | Country | Kind |
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PCT/IB2019/058788 | 10/15/2019 | WO |