Patent Application
20210396233
The present invention relates to a glanded pump, and more specifically, to a glanded pump used in pumping a pumping medium.
Glanded pumps require commutation electronics, which can be arranged between the stator and the sealing flange. The available installation space is very tight. The cup-shaped capacitors commonly used today are the largest components on the circuit board and generally mean that the overall length of the pump housing has to be increased to accommodate the capacitors.
US 2002/0171301 A1 discloses a single-phase motor for submersible pumps, which has a ring capacitor arranged between a pump head and a stator winding package.
A submersible pump is known from U.S. Pat. No. 6,359,353 B1, which shows a ring capacitor arranged in a stator chamber. The ring capacitor is arranged at a distance from the stator and encloses a rotor chamber. The electric motor is a capacitor motor. It uses the energy of the capacitor during the starting process. The capacitor creates a phase shift to generate additional torque.
Example embodiments of the present disclosure provide glanded pumps each with a compact dimension.
A glanded pump to pump a pumped medium according to an example embodiment of the present disclosure includes a motor to drive a pump shaft of the glanded pump about a longitudinal axis, a controller connected to the motor to control the motor, a pump housing to contain the pumped medium, in which an impeller is provided, and a sealing flange which seals off the pump housing from the motor. The controller is connected to the sealing flange on a side remote from the impeller. The controller includes an annular printed circuit board and a ring capacitor thereon. The ring capacitor extends in the longitudinal direction between the printed circuit board and the sealing flange and concentrically with respect to both and is in direct contact with the sealing flange in order to provide a thermally conductive contact.
The ring capacitor is not only arranged to save space, it also transfers the heat generated in the controller to the sealing flange so that it can be dissipated.
The ring capacitor preferably rests with a first end surface on the printed circuit board and with a second end surface opposite the first end surface on the side of the sealing flange remote from the impeller.
The sealing flange is preferably cooled on a side close to the impeller by a flowing pumped medium.
In an example embodiment, the sealing flange is made from a material with increased thermal conductivity, for example, aluminum.
It is advantageous if the motor is an electronically commutated electric motor including a stator and a rotor, the stator being located on a side of the sealing flange remote from the impeller. In this case, the rotor is connected to the pump shaft in a rotationally fixed manner.
It is preferred that the glanded pump is an external rotor pump.
Preferably, the pump shaft passes through the sealing flange. It is advantageous if a mechanical seal is between the pump shaft and the sealing flange.
The ring capacitor may be attached to the printed circuit board by through-hole technology and soldering.
In an advantageous example embodiment, a height of the ring capacitor in a longitudinal direction is several times smaller than a width of the ring.
It is advantageous if the ring capacitor is glued to the sealing flange.
Furthermore, a coolant pump for motor vehicles is provided, which has a glanded pump described above.
The above and other elements, features, steps, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of the example embodiments with reference to the attached drawings.
For controlling the motor 11, the stator 14 is connected to a controller 19, which is arranged inside the housing 3 lying between the stator 14 and the sealing flange 7, viewed in longitudinal direction. The controller 19 has a printed circuit board 20 to which a ring capacitor 21 is attached. The fastening is preferably carried out using the so-called push-through technique and by soldering. The ring capacitor 21 rests with a first end surface on the printed circuit board 20. The ring capacitor 21 surrounds the elevation of the sealing flange 8 and is arranged concentrically to this and to the longitudinal axis 100. The ring capacitor 21 directly abuts the outer surface of the sealing flange 7 with a second end surface opposite the first end surface. The ring capacitor 21 has an inner radius and an outer radius. Whereby the ring width b represents the difference between the two radii. In the longitudinal direction, the ring capacitor extends over a height h. The height of the capacitor is many times smaller than the ring width. The height of the capacitor h is between 3 mm and 15 mm.
The ring capacitor 21 enables a flat, compact design of the printed circuit board 20. As a result of the large contact surface to the printed circuit board 20, there is a very good vibration-resistant connection of the ring capacitor 21 to the controller 19. Since the ring capacitor 21 is in direct contact with the sealing flange, it can absorb heat losses from the controller 19 as a result of the large contact surface and transfer them to the sealing flange 7. Preferably, the ring capacitor 21 is bonded to the sealing flange 7. The sealing flange 7 is preferably made of aluminum and has good thermal conductivity, so that the heat can be transferred from the ring capacitor 21 to the pumped medium via the sealing flange 7.
While example embodiments of the present disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present disclosure. The scope of the present disclosure, therefore, is to be determined solely by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2018 123 565.8 | Sep 2018 | DE | national |
This application claims the benefit of priority to German Patent Application No. 10 2018 123 565.8, filed on Sep. 25, 2018, and is a National Stage Application of PCT Application No. PCT/EP2019/075824, filed on Sep. 25, 2019. The entire contents of each of the above applications are hereby incorporated herein by reference.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2019/075824 | 9/25/2019 | WO | 00 |
