This relates to electronic devices and, more particularly, to glass structures for electronic devices.
Electronic devices such as cellular telephones, handheld computers, and portable music players often include housings with glass members. For example, a device with a display may have a glass cover that serves as a protective layer. In some devices, a rear housing surface may be formed from a layer of glass.
To ensure satisfactory robustness, it is generally desirable to form device housing structures such as cover glass layers and housing surfaces from structures that are sufficiently strong to prevent damage during accidental impact events. For example, it is generally desirable to form portable devices that are subject to drop events from structures that are able to withstand the forces involved in a typical drop event without incurring excessive damage.
Glass strength and device aesthetics can sometimes be enhanced by using sufficiently thick glass layers. However, the size and weight of a device should not be excessive. If care is not taken, modifications that are made to ensure that a device has glass structures that are sufficiently strong, will make the device heavy and bulky.
It would therefore be desirable to be able to provide improved glass structures for electronic devices.
An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structures may cover a front face of an electronic device and, if desired, may cover additional device surfaces.
The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Raised support structure ribs may be formed by fusing glass structures to the planar glass member.
Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Display structures and other internal components may be slid into place between opposing glass sides of the box.
Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.
Further features of the invention, its nature and various advantages will be more apparent from the accompanying drawings and the following detailed description of the preferred embodiments.
Electronic devices such as computers, handheld devices, computer monitors, televisions, cellular telephones, media players, and other equipment may have displays and other components that are covered with glass structures. The glass structures, which may sometimes be referred to as glass housing structures, may be used to provide a protective transparent covering for a display or other optical component, may be used to form a housing sidewall, may be used to form other housing structures such as a rear housing wall or other housing structures, may be used to form raised features such as raised ribs that serve as support structures for a sheet of glass or other glass structures, or may otherwise be used in forming structures in an electronic device.
An example of an electronic device that may have glass housing structures is shown in
Housing 18 may be formed from metal, plastic, glass, ceramic, carbon-fiber composite material or other fiber-based composite materials, other materials, or combinations of these materials. Display 16 may be covered with glass structures 20. Glass structures 20 may serve as a glass front housing structure for device 10. Glass structures 20 may be transparent so that display 16 may be viewed by a user of device 10 through glass structures 20. Display 16 may include display structures with image pixels formed from light-emitting diodes (LEDs), organic LEDs (OLEDs), plasma cells, electrowetting pixels, electrophoretic pixels, liquid crystal display (LCD) components, or other suitable image pixel structures. Touch sensor electrodes may be included in display 16 to provide display 16 with touch sensing capabilities (e.g., display 16 may be a touch screen) or display 16 may be touch insensitive.
In the illustrative example of
In the illustrative example of
The illustrative device configurations of
Display structures 40 may include a number of layers of material. These layers may include, for example, layers of glass, layers of plastic, and layers of adhesive. A liquid crystal display may have layers of polarizer, light diffusing elements, light guides for backlight structures, and a liquid crystal layer. An organic light-emitting diode (OLED) display may have organic materials that are used in producing light. An array of circuit components such as a thin-film transistor (TFT) array may be used to drive the image pixels in a display. This array of circuitry may be formed on a substrate material such as glass or polymer. The substrate layer on which the thin-film transistors and/or other circuitry for the display are formed may sometimes referred to as a TFT substrate or transistor substrate.
Glass housing structures 20 may be mounted to housing structures 18 (e.g., housing structures formed from metal, glass, plastic, fiber-based composites, etc.). Internal components may be mounted within the housing of electronic device 10. For example, device 10 may include a printed circuit such as printed circuit 42. Printed circuit 42 may be a rigid printed circuit board (e.g., a fiberglass-filled epoxy board), a flexible printed circuit (“flex circuit”) formed from a flexible sheet of polyimide or other polymer layer, or may formed using other dielectric substrate materials. Components 44 such as switches, connectors, discrete circuit elements such as capacitors, resistors, and inductors, integrated circuits, and other electronic devices may be mounted to substrate 42. Display structures 40 may be coupled to circuitry on substrates such as substrate 42 using communications path 46 (e.g., a flex circuit cable or other suitable path).
To help maximize the interior volume in device 10 and reduce the size and weight of glass structures 20, center portion 48 of glass structures 20 may have a thickness T1 that is smaller than edge thickness T2. The smaller size of thickness T1 may create a recessed portion 50. Recess 50 in center portion 48 may have a rectangular shape or other suitable shape and may be configured to receive internal components in device 10 such as display structures 40. The larger size of edge thickness T2 relative to center thickness T1 may help strengthen glass structure 20 along its periphery to prevent damage in the event of an impact event. The larger size of the edges of glass structures 20 may also improve device aesthetics.
Glass structures 20 may have a rectangular periphery (e.g., glass structures 20 may be formed from structures such as a planar sheet having a rectangular outline when viewed from above) and center portion 48 may form a rectangular recess within center of glass structures 20. In this type of configuration, thickened edge portions 49 may form a rectangular ring that runs around the periphery of glass structure 20. If desired, glass structure 20 may have other shapes (e.g., oval, circular, square, shapes with curved edges and/or straight edges, etc.). The thickened edge portions of glass structures 20 may also be provided along only part of the edges of glass structures 20, rather than the entire periphery of glass structures 20.
Housing structures such as structures 20 and 18 may be joined using interposed layers of adhesive, using fasteners, using interlocking engagement features such as snaps, or using other suitable attachment mechanisms.
In the illustrative example of
As shown in
Device structures such as glass structures 20 may be formed from multiple pieces of glass that are fused together. Glass structures may, for example, be heated to an elevated temperature (e.g., about 800° C.) that is above the glass fusion temperature and that is below the glass working temperature. Using a metal die or other glass fusing tool, the heated glass pieces may be pressed together. Glass structures that are fused together using this type of approach may have invisible or barely visible joint lines (i.e., the fused glass joints that are formed when fusing a first glass member to a second glass member may be invisible or barely visible to the naked eye).
Illustrative operations and equipment involved in forming glass structures 20 with recessed portion are shown in
Initially, a portion of glass structures 20 such as planar glass member 20A may be formed and polished using polishing tool 56. For example, both upper surface 58 and lower surface 60 of glass structures 20A may be polished using tool 56. Polishing tool 56 may be used to perform mechanical and/or chemical polishing processes. Glass structures 20A may be formed from a glass sheet with a rectangular shape, a shape with curved edges, a shape with straight edges, or a shape with a combination of curved and straight edges.
Following polishing operations with tool 56, additional glass structures may be fused to glass structures 20A using heated press (fusing tool) 62. In particular, upper press member 64 may be moved downwards in direction 66 while lower press member 68 is moved upwards in direction 70 to press glass structures 20A and glass structures 20B together. During pressing, the temperature of glass structures 20A and 20B may be maintained at an elevated temperature of about 800° C. (e.g., a temperature above the fusion temperature of the glass and below the working temperature of the glass). This forms glass fusion bond 72 between structures 20A and 20B and fuses structures 20A and 20B together to form glass structures 20.
Glass structures 20B may, for example, be a peripheral glass member having the shape of a rectangular ring that runs around the periphery of a rectangular version of glass structure 20A or may be a glass member that runs around part of the periphery of glass structure 20A (as examples). The glass structures that are formed by fusing structures 20B to structures 20A may have an edge thickness T2 and a thinner central region of thickness T1, as described in connection with
Because lower surface 60 of glass structures 20A was polished by tool 56, this surface may remain polished following fusion of glass structures 20B to glass structures 20A.
Following formation of glass structures 20 using glass fusing tool 62, glass structures 20 may be strengthened. For example, glass structures 20 may be strengthened using chemical strengthening tool 74. Chemical strengthening tool 74 may be used to immerse glass structures 20 in a bath containing potassium nitrate (as an example). Glass structures 20 may be free of glass frit at fusion joints 72, which may promote compatibility with chemical strengthening treatments. Heat-based tempering operations may also be performed to strengthen glass structures 20, if desired.
Following strengthening of glass structures 20 with chemical strengthening tool 74, glass structures 20 may have polished upper surface 58, polished lower surface 60, recessed central region 48 of thickness T1, and thickened edge regions 49 of thickness T2 (T2>T1). Glass structures 20 may then be assembled into device 10. For example, glass structures 20 may be attached to additional glass structures (using glass fusing, using adhesive, using fasteners, using mating engagement structures, etc.) and/or non-glass housing structures.
As shown in
If desired, glass structures 20B may be fused to glass structures 20A in other patterns. For example, glass structures 20B that have the shape of strengthening support ribs may be fused across the center of the surface of glass structures 20A, as shown in
Glass structures 20 may be formed from clear glass, glass with a colored tint (e.g., a blue tint, red tint, green tint, etc.), black glass, gray glass, or glass of other colors. As shown in
As shown in
In the
Illustrative operations involved in forming glass structures 20 with a recessed portion and curved features such as rounded edges are shown in
As shown in
After fusing structures 20A and 20B together using tool 62, tool 92 (e.g., a machining tool, grinding tool, polishing tool and/or other equipment for machining and polishing structures 20) may be used in removing excess glass along curved surfaces 86 and 88, thereby rounding the edges of glass structures 20.
Glass strengthening equipment such as chemical strengthening tool 74 may be used to strengthen glass structures 20 following formation of curved surfaces 86 and 88.
If desired, display structures 40 (
As shown in
In the
Components 102 may be inserted into the interior of structures 20E (e.g., in the gap formed between the opposing front and rear sheets and between the opposing right and left sheets of glass). Components 102 may include, for example, display structures 40 for forming display 16 and other components (see, e.g., components 44 of
As shown in
At step 118, glass structures such as glass structures 20A and 20B may be polished using polishing equipment 56.
At step 120, fusing equipment 62 may be used to fuse two or more glass structures together. For example, glass structures 20A and 20B may be fused together to form glass structures 20 or the five sides of the five-sided-box glass structures of
If desired, additional machining and polishing operations may be formed at step 122. For example, a thickened edge portion (of thickness T2) of glass structures 20 may be machined and polished to form a rounded edge for glass structures 20, as shown in
At step 124, glass structures 20 may be strengthened using heat and/or chemical treatment. For example, glass structures 20 may be strengthened by applying a chemical bath to glass structures 20 using chemical strengthening tool 74.
At step 126, glass structures 20 may be assembled with other housing structures to form electronic device 10. Glass structures 20 may, for example, be attached to glass or non-glass housing structures 18 or other structures to form device 10. Internal components such as a display, integrated circuits, and other components may be mounted within the glass structures and other structures for the housing of device 10.
The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.
This application is a continuation patent application of U.S. patent application Ser. No. 16/138,933, filed Sep. 21, 2018 and titled “Glass Device Housings,” which is a continuation patent application of U.S. patent application Ser. No. 15/653,171, Jul. 18, 2017 and titled “Glass Device Housing,” now U.S. Pat. No. 10,278,294, which is a continuation patent application of U.S. patent application Ser. No. 14/819,110, filed Aug. 5, 2015 and titled “Glass Device Housing,” now U.S. Pat. No. 9,756,739, which is a continuation patent application of U.S. patent application Ser. No. 14/295,110, filed Jun. 3, 2014 and titled “Fused Glass Device Housings,” now U.S. Pat. No. 9,125,298, which is a continuation patent application of U.S. patent application Ser. No. 13/358,389, filed Jan. 25, 2012 and titled “Fused Glass Device Housings,” now U.S. Pat. No. 8,773,848, the disclosures of which are hereby incorporated herein by reference in their entireties.
Number | Name | Date | Kind |
---|---|---|---|
3415637 | Glynn | Dec 1968 | A |
3441398 | Hess | Apr 1969 | A |
3467508 | Loukes et al. | Sep 1969 | A |
3498773 | Due et al. | Mar 1970 | A |
3558415 | Rieser et al. | Jan 1971 | A |
3607172 | Poole et al. | Sep 1971 | A |
3619240 | Toussaint et al. | Nov 1971 | A |
3626723 | Plumat | Dec 1971 | A |
3652244 | Plumat | Mar 1972 | A |
3753840 | Plumat | Aug 1973 | A |
3798013 | Hasegawa et al. | Mar 1974 | A |
3843472 | Toussaint et al. | Oct 1974 | A |
3857689 | Koizumi et al. | Dec 1974 | A |
3951707 | Kurtz et al. | Apr 1976 | A |
4015045 | Rinehart | Mar 1977 | A |
4119760 | Rinehart | Oct 1978 | A |
4156755 | Rinehart | May 1979 | A |
4165228 | Ebata et al. | Aug 1979 | A |
4178082 | Ganswein et al. | Dec 1979 | A |
4212919 | Hoda | Jul 1980 | A |
4346601 | France | Aug 1982 | A |
4353649 | Kishii | Oct 1982 | A |
4425810 | Simon et al. | Jan 1984 | A |
4646722 | Silverstein et al. | Mar 1987 | A |
4733973 | Machak et al. | Mar 1988 | A |
4842629 | Clemens et al. | Jun 1989 | A |
4844724 | Sakai et al. | Jul 1989 | A |
4846868 | Aratani | Jul 1989 | A |
4849002 | Rapp | Jul 1989 | A |
4872896 | LaCourse et al. | Oct 1989 | A |
4911743 | Bagby | Mar 1990 | A |
4937129 | Yamazaki | Jun 1990 | A |
4957364 | Chesler | Sep 1990 | A |
4959548 | Kupperman et al. | Sep 1990 | A |
4983197 | Froning et al. | Jan 1991 | A |
4986130 | Engelhaupt et al. | Jan 1991 | A |
5041173 | Shikata et al. | Aug 1991 | A |
5104435 | Oikawa et al. | Apr 1992 | A |
5129934 | Koss | Jul 1992 | A |
5157746 | Tobita et al. | Oct 1992 | A |
5160523 | Honkanen et al. | Nov 1992 | A |
5254149 | Hashemi et al. | Oct 1993 | A |
5269888 | Morasca | Dec 1993 | A |
5281303 | Beguin et al. | Jan 1994 | A |
5369267 | Johnson et al. | Nov 1994 | A |
5411563 | Yeh | May 1995 | A |
5437193 | Schleitweiler et al. | Aug 1995 | A |
5445871 | Murase et al. | Aug 1995 | A |
5483261 | Yasutake | Jan 1996 | A |
5488204 | Mead et al. | Jan 1996 | A |
5525138 | Hashemi et al. | Jun 1996 | A |
5625154 | Matsuhiro et al. | Apr 1997 | A |
5654057 | Kitayama | Aug 1997 | A |
5725625 | Kitayama et al. | Mar 1998 | A |
5733622 | Starcke et al. | Mar 1998 | A |
5766493 | Shin | Jun 1998 | A |
5780371 | Rifqi et al. | Jul 1998 | A |
5816225 | Koch et al. | Oct 1998 | A |
5825352 | Bisset et al. | Oct 1998 | A |
5826601 | Muraoka et al. | Oct 1998 | A |
5835079 | Shieh | Nov 1998 | A |
5880411 | Gillespie et al. | Mar 1999 | A |
5930047 | Gunz et al. | Jul 1999 | A |
5953094 | Matsuoka et al. | Sep 1999 | A |
5985014 | Ueda et al. | Nov 1999 | A |
6050870 | Suginoya et al. | Apr 2000 | A |
6114039 | Rifqui | Sep 2000 | A |
6120908 | Papanu et al. | Sep 2000 | A |
6166915 | Lake et al. | Dec 2000 | A |
6188391 | Seely et al. | Feb 2001 | B1 |
6245313 | Suzuki et al. | Jun 2001 | B1 |
6287674 | Verlinden et al. | Sep 2001 | B1 |
6307590 | Yoshida | Oct 2001 | B1 |
6310610 | Beaton et al. | Oct 2001 | B1 |
6323846 | Westerman et al. | Nov 2001 | B1 |
6325704 | Brown et al. | Dec 2001 | B1 |
6327011 | Kim | Dec 2001 | B2 |
6350664 | Haji et al. | Feb 2002 | B1 |
6393180 | Farries et al. | May 2002 | B1 |
6429840 | Sekiguchi | Aug 2002 | B1 |
6437867 | Zeylikovich et al. | Aug 2002 | B2 |
6516634 | Green et al. | Feb 2003 | B1 |
6521862 | Brannon | Feb 2003 | B1 |
6621542 | Aruga | Sep 2003 | B1 |
6690387 | Zimmerman et al. | Feb 2004 | B2 |
6718612 | Bajorek | Apr 2004 | B2 |
6769274 | Cho et al. | Aug 2004 | B2 |
6810688 | Duisit et al. | Nov 2004 | B1 |
6936741 | Munnig et al. | Aug 2005 | B2 |
6955971 | Ghyselen et al. | Oct 2005 | B2 |
6996324 | Hiraka et al. | Feb 2006 | B2 |
7012700 | De Groot et al. | Mar 2006 | B2 |
7013709 | Hajduk et al. | Mar 2006 | B2 |
7015894 | Morohoshi | Mar 2006 | B2 |
7070837 | Ross | Jul 2006 | B2 |
7166531 | van Den Hoek et al. | Jan 2007 | B1 |
7184064 | Zimmerman et al. | Feb 2007 | B2 |
7200008 | Bhugra | Apr 2007 | B1 |
7461564 | Glaesemann | Dec 2008 | B2 |
7558054 | Prest et al. | Jul 2009 | B1 |
7583507 | Starr | Sep 2009 | B2 |
7626807 | Hsu | Dec 2009 | B2 |
7663607 | Hotelling et al. | Feb 2010 | B2 |
7810355 | Feinstein et al. | Oct 2010 | B2 |
7872644 | Hong et al. | Jan 2011 | B2 |
7918019 | Chang et al. | Apr 2011 | B2 |
8013834 | Kim | Sep 2011 | B2 |
8110268 | Hegemier et al. | Feb 2012 | B2 |
8111248 | Lee et al. | Feb 2012 | B2 |
8120922 | Randall | Feb 2012 | B2 |
8312743 | Pun et al. | Nov 2012 | B2 |
8393175 | Kohli et al. | Mar 2013 | B2 |
8551283 | Pakula | Oct 2013 | B2 |
8611077 | Sanford | Dec 2013 | B2 |
8673163 | Zhong | Mar 2014 | B2 |
8684613 | Weber et al. | Apr 2014 | B2 |
8824140 | Prest | Sep 2014 | B2 |
9119293 | Mycroft | Aug 2015 | B2 |
9125298 | Russell-Clarke | Sep 2015 | B2 |
20020035853 | Brown et al. | Mar 2002 | A1 |
20020105793 | Oda | Aug 2002 | A1 |
20020155302 | Smith et al. | Oct 2002 | A1 |
20020157199 | Piltingsrud | Oct 2002 | A1 |
20030024274 | Cho et al. | Feb 2003 | A1 |
20030057183 | Cho et al. | Mar 2003 | A1 |
20030077453 | Oaku et al. | Apr 2003 | A1 |
20030234771 | Mulligan et al. | Dec 2003 | A1 |
20040051944 | Stark | Mar 2004 | A1 |
20040119701 | Mulligan et al. | Jun 2004 | A1 |
20040137828 | Takashashi et al. | Jul 2004 | A1 |
20040142118 | Takechi | Jul 2004 | A1 |
20040163414 | Eto et al. | Aug 2004 | A1 |
20050058423 | Brinkmann et al. | Mar 2005 | A1 |
20050105071 | Ishii | May 2005 | A1 |
20050135724 | Helvajian et al. | Jun 2005 | A1 |
20050193772 | Davidson et al. | Sep 2005 | A1 |
20050245165 | Harada et al. | Nov 2005 | A1 |
20050259438 | Mizutani | Nov 2005 | A1 |
20050285991 | Yamazaki | Dec 2005 | A1 |
20060026521 | Hotelling et al. | Feb 2006 | A1 |
20060055936 | Yun et al. | Mar 2006 | A1 |
20060063351 | Jain | Mar 2006 | A1 |
20060070694 | Rehfeld et al. | Apr 2006 | A1 |
20060097991 | Hotelling et al. | May 2006 | A1 |
20060197753 | Hotelling et al. | Sep 2006 | A1 |
20060227331 | Wollmer et al. | Oct 2006 | A1 |
20060238695 | Miyamoto | Oct 2006 | A1 |
20060250559 | Bocko et al. | Nov 2006 | A1 |
20060268528 | Zadeksky et al. | Nov 2006 | A1 |
20060292822 | Xie | Dec 2006 | A1 |
20070003796 | Isono et al. | Jan 2007 | A1 |
20070013822 | Kawata et al. | Jan 2007 | A1 |
20070029519 | Kikuyama et al. | Feb 2007 | A1 |
20070030436 | Sasabayashi | Feb 2007 | A1 |
20070039353 | Kamiya | Feb 2007 | A1 |
20070046200 | Fu et al. | Mar 2007 | A1 |
20070063876 | Wong | Mar 2007 | A1 |
20070089827 | Funatsu | Apr 2007 | A1 |
20070122542 | Halsey et al. | May 2007 | A1 |
20070132737 | Mulligan et al. | Jun 2007 | A1 |
20070196578 | Karp et al. | Aug 2007 | A1 |
20070236618 | Magg et al. | Oct 2007 | A1 |
20080026260 | Kawai | Jan 2008 | A1 |
20080074028 | Ozolins et al. | Mar 2008 | A1 |
20080094716 | Ushiro et al. | Apr 2008 | A1 |
20080135175 | Higuchi | Jun 2008 | A1 |
20080158181 | Hamblin et al. | Jul 2008 | A1 |
20080202167 | Cavallaro et al. | Aug 2008 | A1 |
20080230177 | Crouser et al. | Sep 2008 | A1 |
20080243321 | Walser et al. | Oct 2008 | A1 |
20080258603 | Shinohe et al. | Oct 2008 | A1 |
20080261057 | Slobodin | Oct 2008 | A1 |
20080264176 | Bertrand et al. | Oct 2008 | A1 |
20080286548 | Ellison et al. | Nov 2008 | A1 |
20090046240 | Bolton | Feb 2009 | A1 |
20090067141 | Dabov et al. | Mar 2009 | A1 |
20090091551 | Hotelling et al. | Apr 2009 | A1 |
20090096937 | Bauer et al. | Apr 2009 | A1 |
20090153729 | Hiltunen et al. | Jun 2009 | A1 |
20090162703 | Kawai | Jun 2009 | A1 |
20090197048 | Amin et al. | Aug 2009 | A1 |
20090202808 | Glaesemann et al. | Aug 2009 | A1 |
20090220761 | Dejneka et al. | Sep 2009 | A1 |
20090257189 | Wang et al. | Oct 2009 | A1 |
20090294420 | Abramov et al. | Dec 2009 | A1 |
20090324899 | Feinstein et al. | Dec 2009 | A1 |
20090324939 | Feinstein et al. | Dec 2009 | A1 |
20100009154 | Allan et al. | Jan 2010 | A1 |
20100028607 | Lee et al. | Feb 2010 | A1 |
20100035038 | Barefoot et al. | Feb 2010 | A1 |
20100053632 | Alphonse et al. | Mar 2010 | A1 |
20100062284 | Watanabe et al. | Mar 2010 | A1 |
20100119846 | Sawada | May 2010 | A1 |
20100137031 | Griffin et al. | Jun 2010 | A1 |
20100154992 | Feinstein et al. | Jun 2010 | A1 |
20100167059 | Hashimoto et al. | Jul 2010 | A1 |
20100171920 | Nishiyama | Jul 2010 | A1 |
20100179044 | Sellier et al. | Jul 2010 | A1 |
20100206008 | Harvey et al. | Aug 2010 | A1 |
20100215862 | Gomez et al. | Aug 2010 | A1 |
20100216514 | Smoyer et al. | Aug 2010 | A1 |
20100224767 | Kawano et al. | Sep 2010 | A1 |
20100265188 | Chang et al. | Oct 2010 | A1 |
20100279067 | Sabia et al. | Nov 2010 | A1 |
20100285275 | Baca et al. | Nov 2010 | A1 |
20100296027 | Matsuhira et al. | Nov 2010 | A1 |
20100315570 | Mathew et al. | Dec 2010 | A1 |
20100321305 | Chang | Dec 2010 | A1 |
20110003619 | Fujii | Jan 2011 | A1 |
20110012873 | Prest et al. | Jan 2011 | A1 |
20110019123 | Prest et al. | Jan 2011 | A1 |
20110019354 | Prest et al. | Jan 2011 | A1 |
20110030209 | Chang et al. | Feb 2011 | A1 |
20110063550 | Gettemy et al. | Mar 2011 | A1 |
20110067447 | Prest et al. | Mar 2011 | A1 |
20110072856 | Davidson et al. | Mar 2011 | A1 |
20110102346 | Orsley | May 2011 | A1 |
20110113828 | Matsumoto | May 2011 | A1 |
20110159321 | Eda et al. | Jun 2011 | A1 |
20110164372 | McClure | Jul 2011 | A1 |
20110182084 | Tomlinson | Jul 2011 | A1 |
20110186345 | Pakula | Aug 2011 | A1 |
20110188846 | Sorg | Aug 2011 | A1 |
20110199687 | Sellier et al. | Aug 2011 | A1 |
20110248152 | Svajda et al. | Oct 2011 | A1 |
20110255000 | Weber et al. | Oct 2011 | A1 |
20110255250 | Dinh | Oct 2011 | A1 |
20110267833 | Verrat-Debailleul et al. | Nov 2011 | A1 |
20110279383 | Wilson et al. | Nov 2011 | A1 |
20110300908 | Grespan et al. | Dec 2011 | A1 |
20120018323 | Johnson | Jan 2012 | A1 |
20120020002 | Mathew | Jan 2012 | A1 |
20120027399 | Yeates | Feb 2012 | A1 |
20120069517 | Prest | Mar 2012 | A1 |
20120099113 | de Boer et al. | Apr 2012 | A1 |
20120105400 | Mathew et al. | May 2012 | A1 |
20120118628 | Pakula | May 2012 | A1 |
20120135195 | Glaesemann | May 2012 | A1 |
20120136259 | Milner et al. | May 2012 | A1 |
20120151760 | Steijner | Jun 2012 | A1 |
20120188743 | Wilson | Jul 2012 | A1 |
20120196071 | Cornejo et al. | Aug 2012 | A1 |
20120202040 | Barefoot et al. | Aug 2012 | A1 |
20120236477 | Weber | Sep 2012 | A1 |
20120236526 | Weber et al. | Sep 2012 | A1 |
20120281381 | Sanford | Nov 2012 | A1 |
20120328843 | Cleary et al. | Dec 2012 | A1 |
20130071601 | Bibl et al. | Mar 2013 | A1 |
20130083506 | Wright et al. | Apr 2013 | A1 |
20130182259 | Brezinski et al. | Jul 2013 | A1 |
20130188366 | Russell-Clarke et al. | Jul 2013 | A1 |
20130213565 | Lee et al. | Aug 2013 | A1 |
20140176779 | Weber et al. | Jun 2014 | A1 |
20150077624 | Havskjold | Mar 2015 | A1 |
20150331444 | Rappoport | Nov 2015 | A1 |
Number | Date | Country |
---|---|---|
283630 | Aug 1970 | AT |
1277090 | Dec 2000 | CN |
1369449 | Sep 2002 | CN |
1694589 | Nov 2005 | CN |
101025502 | Aug 2007 | CN |
101206314 | Jun 2008 | CN |
101523275 | Feb 2009 | CN |
101465892 | Jun 2009 | CN |
102131357 | Jul 2011 | CN |
101267509 | Aug 2011 | CN |
1322339 | Nov 2011 | CN |
102591576 | Jul 2012 | CN |
1771268 | Dec 1971 | DE |
3212612 | Oct 1983 | DE |
10322350 | Dec 2004 | DE |
1038663 | Sep 2000 | EP |
1592073 | Nov 2005 | EP |
2025556 | Feb 2009 | EP |
2036867 | Mar 2009 | EP |
2075237 | Jul 2009 | EP |
2196870 | Jun 2010 | EP |
2233447 | Sep 2010 | EP |
2483216 | Aug 2012 | EP |
2635540 | Sep 2013 | EP |
1346747 | Feb 1974 | GB |
S42011599 | Jun 1963 | JP |
S48006925 | Sep 1973 | JP |
S52031757 | Mar 1977 | JP |
S55031944 | Mar 1980 | JP |
S55067529 | May 1980 | JP |
S55095645 | Jul 1980 | JP |
S55136979 | Oct 1980 | JP |
S55144450 | Nov 1980 | JP |
S59013638 | Jan 1984 | JP |
S59037451 | Feb 1984 | JP |
S61097147 | May 1986 | JP |
S60066696 | Oct 1986 | JP |
S63060129 | Mar 1988 | JP |
S63222234 | Sep 1988 | JP |
H05032431 | Feb 1993 | JP |
H05249422 | Sep 1993 | JP |
H06242260 | Sep 1994 | JP |
H07050144 | Feb 1995 | JP |
H09073072 | Mar 1997 | JP |
H09507206 | Jul 1997 | JP |
H09312245 | Dec 1997 | JP |
2000163031 | Jun 2000 | JP |
2002003895 | Jul 2000 | JP |
2001083887 | Mar 2001 | JP |
2002160932 | Jun 2002 | JP |
2002342033 | Nov 2002 | JP |
2003502257 | Jan 2003 | JP |
2003146705 | May 2003 | JP |
2004094256 | Mar 2004 | JP |
2004259402 | Sep 2004 | JP |
2004339019 | Dec 2004 | JP |
2005140901 | Jun 2005 | JP |
2005156766 | Jun 2005 | JP |
2005162549 | Jun 2005 | JP |
2007099557 | Apr 2007 | JP |
2008001590 | Jan 2008 | JP |
2008007360 | Jan 2008 | JP |
2008063166 | Mar 2008 | JP |
2008066126 | Mar 2008 | JP |
2008192194 | Aug 2008 | JP |
2008195602 | Aug 2008 | JP |
2008216938 | Sep 2008 | JP |
2008306149 | Dec 2008 | JP |
2009230341 | Oct 2009 | JP |
2009234856 | Oct 2009 | JP |
2010060908 | Mar 2010 | JP |
2010116276 | May 2010 | JP |
2010195600 | Sep 2010 | JP |
2010237493 | Oct 2010 | JP |
2011032124 | Feb 2011 | JP |
2011158799 | Aug 2011 | JP |
2011231009 | Nov 2011 | JP |
2011527661 | Nov 2011 | JP |
2013537723 | Oct 2013 | JP |
20060005920 | Jan 2006 | KR |
20090069023 | Jun 2009 | KR |
20100019526 | Feb 2010 | KR |
20110030919 | Mar 2011 | KR |
201007521 | Feb 2010 | TW |
201129284 | Aug 2011 | TW |
201235744 | Sep 2012 | TW |
WO 0047529 | Aug 2000 | WO |
WO 0242838 | May 2002 | WO |
WO 2004014109 | Feb 2004 | WO |
WO 2004061806 | Jul 2004 | WO |
WO 2004106253 | Dec 2004 | WO |
WO 2007089054 | Aug 2007 | WO |
WO 2008044694 | Apr 2008 | WO |
WO 2008143999 | Nov 2008 | WO |
WO 2009003029 | Dec 2008 | WO |
WO 2009078406 | Jun 2009 | WO |
WO 2009099615 | Aug 2009 | WO |
WO 2009102326 | Aug 2009 | WO |
WO 2009125133 | Oct 2009 | WO |
WO 2010005578 | Jan 2010 | WO |
WO 2010014163 | Feb 2010 | WO |
WO 2010019829 | Feb 2010 | WO |
WO 2010080988 | Jul 2010 | WO |
WO 2010101961 | Sep 2010 | WO |
WO 2011008433 | Jan 2011 | WO |
WO 2011041484 | Apr 2011 | WO |
WO 2011097314 | Aug 2011 | WO |
WO 2012015960 | Feb 2012 | WO |
WO 2012106280 | Aug 2012 | WO |
WO 2013106242 | Jul 2013 | WO |
Entry |
---|
Chemically Strengthened Glass, Wikipedia, Apr. 19, 2009, http://en/wikipedia.org/w/index.php?title=Chemically.sub.--strengthened.s- ub.--glass&oldid=284794988. |
“IPhone 4”, Wikipedia, Jan. 4, 2012, 17 pgs. |
“Toward Making Smart Phone Touch-Screens More Glare and Smudge Resistant”, e! Science News, http://eciencenews.com/articles/2009/08/19toward.makingsmart.phone.touch.screens.more.glare.and.smudge.resistant, Aug. 19, 2009, 1 pg. |
Wikipedia: “Iphone 4”, www.wikipedia.org, retrieved Oct. 31, 2011, 15 pgs. |
Aben “Laboratory of Photoelasticity”, Institute of Cybernetics at TTU, www.ioc.ee/res/photo.html, Oct. 5, 2000. |
Arun K. Varshneya, Chemical Strengthening of Glass: Lessons Learned and Yet to be Learned International Journal of Applied Glass Science, 2010, 1, 2, pp. 131-142. |
Forooghian et al., Investigative Ophthalmology & Visual Science; Oct. 2008, vol. 49, No. 10. |
Karlsson et al., “The Technology of Chemical Glass Strengthening—a review”, Apr. 2010, Glass Technology, European Journal of Glass Science and Technology A., vol. 51, No. 2, pp. 41-54. |
Lee et al., “A Multi-Touch Three Dimensional Touch-Sensitive Tablet”, Proceedings of CHI: ACM Conference on Human Factors in Computing Systems, Apr. 1985, pp. 21-25. |
Mehrl et al., “Designer's Noticebook: Proximity Detection IR LED and Optical Crosstalk”, http://ams.com/eng/content/view/download/145137, Aug. 1, 2011, 5 pages. |
Ohkuma, “Development of a Manufacturing Process of a Thin, Lightweight LCD Cell”, Department of Cell Process Development, IBM, Japan, Section 13.4, 2000. |
Rubine, “The Automatic Recognition of Gestures”, CMU-CS-91-202, Submitted in Partial Fulfillment of the Requirements of the Degree of Doctor of Philosophy in Computer Science at Carnegie Mellon University, Dec. 1991, 285 pages. |
Rubine, “Combining Gestures and Direct Manipulation”, CHI'92, May 1992, pp. 659-660. |
Saxer et al., “High-Speed Fiber-Based Polarization-Sensitive Optical Coherence Tomography of in vivo Human Skin,” Optics Letters, vol. 25, No. 18, pp. 1355-1357, Sep. 15, 2000. |
Westerman, “Hand Tracking, Finger Identification and Chronic Manipulation of a Multi-Touch Surface”, A Dissertation Submitted to the Faculty of the University of Delaware in Partial Fulfillment of the Requirements for the degree of Doctor of Philosophy in Electrical Engineering, Spring 1999, 364 pages. |
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