Claims
- 1. A resin binder formulation for coating evaporative cooler pads consisting essentially of 94 to about 100 parts by weight melamine formaldehyde resin; and about 3-6 parts by weight sulfonic acid salt and about 0.3-0.6 parts by weight citric acid.
- 2. The resin binder formulation of claim 1 additionally having 10 to 15 parts by weight water.
- 3. The resin binder formulation of claim 1 consisting of 94 to about 100 parts by weight melamine formaldehyde, about 3 to about 6 parts by weight amine sulfonate salt, about 0.3 to about 0.6 parts by weight citric acid and 10 to 15 parts by, weight water.
- 4. A resin binder formulation for coating evaporative cooler pads comprising about 20-40 parts by weight melamine formaldehyde resin and about 60-80 parts by weight urea formaldehyde resin; and, relative to 100 parts by weight resin, about 2-6 parts by weight sulfonic acid salt.
- 5. The resin binder formulation of claim 4 consisting essentially of about 20-40 parts by weight melamine formaldehyde resin and about 60-80 parts by weight urea formaldehyde resin; and, relative to 100 parts by weight resin, about 2-6 parts by weight sulfonic acid salt.
- 6. A resin binder formulation for coating evaporative cooler pads comprising about 40 parts by weight melamine formaldehyde resin and about 60 parts by weight urea formaldehyde resin; and about 3.7 parts by weight sulfonic acid salt.
- 7. A resin binder formulation for coating evaporative cooler pads consisting essentially of about 50-70 parts by weight melamine formaldehyde resin and about 30-50 parts by weight aliphatic polyurethane resin; and, relative to 100 parts by weight resin, about 3-6 parts by weight sulfonic acid salt.
- 8. A resin binder formulation for coating evaporative cooler pads consisting essentially of about 50 parts by weight melamine formaldehyde resin and about 50 parts by weight aliphatic polyurethane resin; and about 5 parts by weight sulfonic acid salt.
CROSS REFERENCE TO RELATED APPLICATIONS
This is a Continuation-in-Part Application of U.S. application Ser. No. 08/223,423 filed Apr. 5, 1994, now U.S. Pat. No. 5,811,598 which is a divisional application of U.S. application Ser. No. 08/072,697, filed Jun. 7, 1993, (now U.S. Pat. No. 5,340,651) which is a continuation application of U.S. application Ser. No. 07/777,145, filed Oct. 16, 1991 (abandoned).
US Referenced Citations (17)
Divisions (1)
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Number |
Date |
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Parent |
72697 |
Jun 1993 |
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Continuations (1)
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Number |
Date |
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Parent |
777145 |
Oct 1991 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
223423 |
Apr 1994 |
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