Glass fusion method

Information

  • Patent Grant
  • 9181126
  • Patent Number
    9,181,126
  • Date Filed
    Friday, January 6, 2012
    12 years ago
  • Date Issued
    Tuesday, November 10, 2015
    8 years ago
Abstract
A glass layer fixing method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, includes the steps of disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material and irradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer.
Description
TECHNICAL FIELD

The present invention relates to a glass fusing method for manufacturing a glass fusing structure by fusing glass members together.


BACKGROUND ART

Known as a conventional glass fusing method in the above-mentioned technical field is one comprising burning a glass layer containing a laser-absorbing pigment onto one glass member along a region to be fused, then overlaying the other glass member on the former glass member such that the glass layer is interposed therebetween, and irradiating the region to be fused therealong with a laser beam, so as to fuse one glass member and the other glass member together.


A typical technique for burning a glass layer onto a glass member is one comprising firmly attaching a glass layer to the glass member by removing an organic solvent and a binder from a paste layer containing a glass frit, a laser-absorbing pigment, the organic solvent, and the binder; and then heating the glass member having the glass layer firmly attached thereto in a firing furnace, so as to melt the glass layer, thereby burning the glass layer onto the glass member (see, for example, Patent Literature 1).


On the other hand, proposed from the viewpoint of suppressing the increase in energy consumption and burning time caused by the use of the firing furnace (i.e., the viewpoint of high efficiency) is a technique which irradiates a glass layer attached to a glass member with a laser beam, so as to melt the glass layer, thereby burning the glass layer onto the glass member (see, for example, Patent Literature 2).


CITATION LIST
Patent Literature



  • Patent Literature 1: Japanese Translated International Patent Application Laid-Open No. 2006-524419

  • Patent Literature 2: Japanese Patent Application Laid-Open No. 2002-366050



SUMMARY OF INVENTION
Technical Problem

However, there have been cases where glass members having glass layers burned thereonto by laser light irradiation are damaged by cracks and the like occurring at the time of burning and their fusion thereafter.


In view of such circumstances, it is an object of the present invention to provide a glass fusing method which can efficiently fuse glass members together by preventing the glass members from being damaged.


Solution to Problem

For achieving the above-mentioned object, the inventors conducted diligent studies and, as a result, have found out that the burning of a glass layer by laser beam irradiation leads to damages in a glass member because of the fact that the laser absorptance of the glass layer drastically increases when the temperature of the glass layer exceeds its melting point Tm at the time of burning as illustrated in FIG. 7. That is, in the glass layer firmly attached to the glass member, voids formed by the removal of the binder and the particle property of the glass frit produce scattering of light exceeding the absorption characteristic of the laser-absorbing pigment, so that the laser absorptance is low (e.g., the glass layer appears whiter under visible light). When a laser beam is emitted with such a laser power P that the glass layer attains a temperature Tp higher than the melting point Tm but lower than its crystallization temperature Tc as illustrated in FIG. 8, the glass frit melts to fill the voids and loses the particle property, so that the laser-absorbing pigment remarkably exhibits its absorption characteristic, whereby the glass layer drastically increases its laser absorptance (e.g., appears darker under visible light). This causes the glass layer to absorb the laser beam more than expected, thereby generating cracks in the glass member because of a heat shock due to excessive heat input. In practice, as illustrated in FIG. 8, the laser irradiation at the laser power P lets the glass layer reach a temperature Ta higher than the crystallization temperature Tc. When a portion of the glass layer on the side opposite from the glass member onto which it is to be burned (i.e., a portion of the glass layer located on the side of the glass member to which it is to be fused) is crystallized by excessive heat input, the melting point rises in this portion. This makes it necessary to emit the laser beam with a higher laser power at the time of fusing the glass members together thereafter so as to melt the portion of the glass layer located on the side of the glass member to which it is to be fused, whereby cracks are generated in the glass member because of a heat shock due to excessive heat input as in the burning. The inventors have conducted further studies based on this finding, thereby completing the present invention. The change in color of the glass layer under visible light in the case where the laser absorptance of the glass layer is enhanced by the melting of the glass layer is not limited to the change from a whiter state to a darker state. For example, laser-absorbing pigments for near-infrared laser beams include those exhibiting green when the glass layer melts.


The glass fusing method in accordance with the present invention is a glass fusing method for manufacturing a glass fusing structure by fusing first and second glass members together, the method comprising the steps of disposing a glass layer between the first glass member and a thermal conductor along a region to be fused, the glass layer being formed by removing an organic solvent and a binder from a paste layer containing a glass powder, a laser-absorbing material, the organic solvent and the binder; irradiating the region to be fused therealong with a first laser beam while using the thermal conductor as a heatsink, so as to melt the glass layer disposed between the first glass member and the thermal conductor, and fix the glass layer to the first glass member; and overlaying the second glass member on the first glass member having the glass layer fixed thereto such that the glass layer is interposed therebetween, and irradiating the region to be fused therealong with a second laser beam, so as to fuse the first and second glass members together.


In this glass fusing method, the glass layer is disposed between the first glass member and the thermal conductor along the region to be fused, and the first laser beam is emitted while using the thermal conductor as a heatsink, so as to melt the glass layer and fix the glass layer to the first glass member. While the glass layer drastically increases its laser absorptance when being fixed, the thermal conductor serves as the heatsink and draws heat from the glass layer, thereby inhibiting the glass layer from falling into an excessive heat input state. As a consequence, even when the glass layer is fixed to the first glass member by irradiation with the first laser beam, the glass members can be prevented from being damaged by cracks occurring therein and the like at the time of fixing the glass layer and fusing the glass members together thereafter. Therefore, this glass fusing method can prevent the glass members from being damaged and efficiently fuse the glass members together.


Preferably, in the glass fusing method in accordance with the present invention, the thermal conductor has a thermal conductivity higher than that of the glass powder. This allows the thermal conductor to serve as the heatsink and draw heat efficiently from the glass layer. More preferably, in this case, the thermal conductivity of the thermal conductor is higher than that of the first glass member. This allows the thermal conductor to serve as the heatsink and draw heat more efficiently from the glass layer.


Preferably, in the glass fusing method in accordance with the present invention, the difference between coefficients of linear expansion of the glass powder and the thermal conductor is greater than the difference between coefficients of linear expansion of the glass powder and the first glass member. This can reliably prevent the glass layer from firmly attaching to the thermal conductor when fixing the glass layer to the first glass member.


Preferably, in the glass fusing method in accordance with the present invention, the first laser beam irradiates the glass layer from the first glass member side. This can fully heat the interface part between the first glass member and the glass layer, thereby strongly fixing the glass layer to the first glass member.


Advantageous Effects of Invention

The present invention can efficiently fuse glass members together by preventing the glass members from being damaged.





BRIEF DESCRIPTION OF DRAWINGS


FIG. 1 is a perspective view for explaining a glass fusing structure manufactured by an embodiment of the glass fusing method in accordance with the present invention;



FIG. 2 is a perspective view for explaining the glass fusing method for manufacturing the glass fusing structure of FIG. 1;



FIG. 3 is a sectional view for explaining the glass fusing method for manufacturing the glass fusing structure of FIG. 1;



FIG. 4 is a perspective view for explaining the glass fusing method for manufacturing the glass fusing structure of FIG. 1;



FIG. 5 is a perspective view for explaining the glass fusing method for manufacturing the glass fusing structure of FIG. 1;



FIG. 6 is a sectional view for explaining the glass fusing method for manufacturing the glass fusing structure of FIG. 1;



FIG. 7 is a graph illustrating the relationship between the temperature and laser absorptance of a glass layer; and



FIG. 8 is a graph illustrating the relationship between the laser power and the temperature of the glass layer.





DESCRIPTION OF EMBODIMENTS

In the following, preferred embodiments of the present invention will be explained in detail with reference to the drawings. In the drawings, the same or equivalent parts will be referred to with the same signs while omitting their overlapping descriptions.



FIG. 1 is a perspective view of the glass fusing structure manufactured by an embodiment of the glass fusing method in accordance with the present invention. As illustrated in FIG. 1, the glass fusing structure 1 is a fusion-bonded grass structure in which glass members (first and second glass members) 4, 5 are fused together through a glass layer 3 formed along a region R to be fused. For example, each of the glass members 4, 5 is a rectangular plate-shaped member made of alkali-free glass having a thickness of 0.7 mm, while the region R to be fused is set like a rectangular ring along the outer edges of the glass members 4, 5. For example, the glass layer 3 is made of low-melting glass (vanadium-phosphate-based glass, lead borosilicate glass, or the like) and formed into a rectangular ring along the region R to be fused.


The glass fusing method for manufacturing the above-mentioned glass fusing structure 1 will now be explained.


First, as illustrated in FIG. 2, a frit paste is applied by a dispenser, screen-printing, or the like, so as to form a paste layer 6 on a surface 4a of the glass member 4 along the region R to be fused. An example of the frit paste is one formed by kneading a powdery glass frit (glass powder) 2 made of amorphous low-melting glass (vanadium-phosphate-based glass, lead borosilicate glass, or the like), a laser-absorbing pigment (laser-absorbing material) which is an inorganic pigment such as iron oxide, an organic solvent such as amyl acetate, and a binder which is a resin component (such as acrylic resin) thermally decomposable at the glass softening temperature or lower. The paste layer 6 contains the glass frit, laser-absorbing pigment, organic solvent, and binder.


Subsequently, the paste layer 6 is dried, so as to eliminate the organic solvent, and further heated, so as to remove the binder, thereby firmly attaching the glass layer 3 to the surface 4a of the glass member 4 along the region R to be fused. Here, voids formed by the removal of the binder and the particle property of the glass frit 2 produce scattering of light exceeding the absorption characteristic of the laser-absorbing pigment, so that the glass layer 3 firmly attached to the surface 4a of the glass member 4 is in a low laser absorptance state (e.g., appears whiter under visible light).


Thereafter, as illustrated in FIG. 3, the glass member 4 is mounted on a surface 7a (a polished surface here) of a planar thermal conductor 7 made of aluminum, such that the glass layer 3 is interposed therebetween. As a consequence, the glass layer 3 formed by removing the organic solvent and binder from the paste layer 6 is disposed between the glass member 4 and the thermal conductor 7 along the region R to be fused.


Next, while using the thermal conductor 7 as a heatsink, the region R to be fused is irradiated therealong with a laser beam (first laser beam L1) such that a converging spot is located at the glass layer 3. This melts and resolidifies the glass layer 3 disposed between the glass member 4 and the thermal conductor 7, thereby burning the glass layer 3 onto the surface 4a of the glass member 4. As the voids are filled by the melting of the glass frit 2, the glass layer 3 burned onto the surface 4a of the glass member 4 loses its particle property and remarkably exhibits the absorption characteristic of the laser-absorbing pigment, thereby attaining a high laser absorptance state (e.g., appearing darker under visible light). The glass layer 3 burned onto the surface 4a of the glass member 4 is in a state where irregularities on its surface 3a opposite from the glass member 4 are made flat.


At the time of burning the glass layer 3, the thermal conductor 7 serves as the heatsink and draws heat from the glass layer 3, thereby inhibiting the glass layer 3 from falling into an excessive heat input state. Here, the thermal conductor 7 is made of aluminum, so that the thermal conductivity of the thermal conductor 7 is higher than that of the glass frit 2 and that of the glass member 4, whereby the heat is dissipated from the glass layer 3 to the thermal conductor 7 very efficiently.


Since the difference between the coefficients of linear expansion of the glass frit 2 and thermal conductor 7 is greater than the difference between the coefficients of linear expansion of the glass frit 2 and glass member 4, the glass layer 3 does not firmly attach to the surface 7a of the thermal conductor 7 at the time of burning. While this fact indicates that it will be more preferred if the difference between the coefficients of linear expansion of the glass frit 2 and thermal conductor 7 is greater, not only aluminum (having a coefficient of linear expansion of 23×10−6/K) but stainless steel (having a coefficient of linear expansion of 17.3×10−6/K) or copper (having a coefficient of linear expansion of 16.8×10−6/K) can also constitute the thermal conductor 7 for use in combination with the glass frit 2 made of vanadium-phosphate-based glass (having a coefficient of linear expansion of 7.0×10−6/K) or lead borosilicate glass (having a coefficient of linear expansion of 13×10−6/K).


Subsequent to the burning of the glass layer 3, as illustrated in FIG. 4, the glass member 5 is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Here, since the surface 3a of the glass layer 3 is made flat, a surface 5a of the glass member 5 comes into contact with the surface 3a of the glass layer 3 without gaps.


Next, as illustrated in FIG. 5, the region R to be fused is irradiated therealong with a laser beam (second laser beam) L2 while locating a converging spot at the glass layer 3. As a consequence, the glass layer 3 in a high laser absorptance state absorbs the laser beam L2, so as to melt and resolidify the glass layer 3 and its peripheral portions (the portions of the glass members 4, 5 on their surfaces 4a, 5a), thereby bonding the glass members 4, 5 together. Here, since the surface 5a of the glass member 5 is in contact with the surface 3a of the glass layer 3 without gaps, the glass members 4, 5 are uniformly fused together along the region R to be fused.


As explained in the foregoing, the glass fusing method for manufacturing the glass fusing structure 1 disposes the glass layer 3 between the glass member 4 and the thermal conductor 7 along the region R to be fused and then emits the laser beam L1 while using the thermal conductor 7 as a heatsink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. While the laser absorptance of the glass layer 3 rapidly increases at the time of burning the glass layer 3, the thermal conductor 7 serves as the heatsink and draws heat from the glass layer 3, thereby inhibiting the glass layer 3 from falling into an excessive heat input state. This can prevent cracks from occurring in the glass members 4, 5 because of a heat shock due to excessive heat input at the time of burning the glass layer 3 even when the glass layer 3 is burned by irradiation with the laser beam L1. Further, at the time of burning the glass layer 3, the portion of the glass layer 3 on the surface 3a (i.e., the portion of the glass layer 3 located on the side of the glass member 5 to which it is to be fused) is not crystallized by excessive heat input and thus does not raise its melting point. Therefore, it is not necessary for the laser beam L2 to be emitted with such a high laser power as to melt the portion of the glass layer 3 on the surface 3a at the time of fusing the glass members 4, 5 together thereafter, whereby cracks can be prevented from occurring in the glass members 4, 5 because of a heat shock due to excessive heat input as in the burning of the glass layer 3. Hence, the above-mentioned glass fusing method can efficiently fuse the glass members 4, 5 together by preventing the glass members 4, 5 from being damaged.


The above-mentioned glass fusing method irradiates the glass layer 3 with the laser beam L1 from the glass member 4 side. Therefore, the interface part between the glass member 4 and the glass layer 3 is fully heated. Hence, the glass layer 3 can be strongly burned and fixed onto the glass member 4. This can also more reliably prevent the portion of the glass layer 3 (portion of the glass layer 3 on the surface 3a) located on the side of the glass member 5 to which it is to be fused from being crystallized by excessive heat input.


At the time of burning the glass layer 3, the portion of the glass layer 3 located on the side of the glass member 4 onto which it is to be burned may be crystallized by irradiation with the laser beam L1. At the time of fusing the glass members 4, 5 together, the portion of the glass layer 3 (the portion of the glass layer 3 on the surface 3a) located on the side of the glass member 5 to which it is to be fused may be crystallized by irradiation with the laser beam L2. This is because finally crystallizing the glass layer 3 reduces the coefficient of linear expansion of the glass layer 3 in the glass fusing structure 1.


Organic EL packages and the like have a small size themselves, for which thinner glass members 4, 5 are used, so that low expansion glass is often chosen as a material for the glass members 4, 5 in order to make them harder to break. Here, in order for the glass layer 3 to have a coefficient of linear expansion matching that of the glass members 4, 5 (i.e., in order to lower the coefficient of linear expansion of the glass layer 3), the glass layer 3 is made to contain a large amount of a filler constituted by ceramics or the like. By containing the large amount of the filler, the glass layer 3 changes its laser absorptance greatly between before and after irradiation with the laser beam L1. Therefore, the above-mentioned glass fusing method is effective in particular when low expansion glass is chosen as the material for the glass members 4, 5.


The present invention is not limited to the above-mentioned embodiment.


For example, as illustrated in FIG. 6, a thermal conductor 7 made of a material transparent to the laser beam L1 may be used, so as to irradiate the glass layer 3 with the laser beam L1 through the thermal conductor 7 from the side opposite from the glass member 4.


After firmly attaching the glass layer 3 to the surface 7a of the thermal conductor 7 along the region R to be fused, the glass member 4 may be mounted on the surface 7a of the thermal conductor 7 such that the glass layer 3 is interposed therebetween, whereby the glass layer 3 formed by removing the organic solvent and binder from the paste layer 6 is disposed between the glass member 4 and the thermal conductor 7 along the region R to be fused.


INDUSTRIAL APPLICABILITY

The present invention can efficiently fuse glass members together by preventing the glass members from being damaged.


REFERENCE SIGNS LIST


1 . . . glass fusing structure; 2 . . . glass frit (glass powder); 3 . . . glass layer; 4 . . . glass member (first glass member); 5 . . . glass member (second glass member); 6 . . . paste layer; 7 . . . thermal conductor; R . . . region to be fused; L1 . . . laser beam (first laser beam); L2 . . . laser beam (second laser beam)

Claims
  • 1. A method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, the method comprising the steps of: disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material; andirradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer,wherein a laser absorbance rate of the glass layer is increased when the glass powder melts to fill voids causing loss of a particle property;overlaying a second glass member on the first glass member having the glass layer fixed thereto along the region to be fused such that the glass layer is interposed therebetween; andirradiating the region to be fused therealong with a second laser beam so as to fuse the first and second glass members together,wherein disposing the glass layer on the first glass member and irradiating the region to be fused with a first laser beam is implemented before the step of overlaying a second glass member.
  • 2. The method according to claim 1, wherein the glass layer is irradiated with the first laser beam such that the glass layer attains a temperature higher than its melting point but lower than its crystallization temperature.
Priority Claims (1)
Number Date Country Kind
P2008-136843 May 2008 JP national
Parent Case Info

This is a continuation application of copending application Ser. No. 12/994,320, having a §371 date of Nov. 23, 2010, which is a national stage filing based on PCT International Application No. PCT/JP2009/058764, filed on May 11, 2009. The copending application Ser. No. 12/994,320 is incorporated by reference herein in its entirety.

US Referenced Citations (81)
Number Name Date Kind
3453097 Hafner Jul 1969 A
3663793 Petro et al. May 1972 A
4343833 Sawae et al. Aug 1982 A
5489321 Tracy et al. Feb 1996 A
6565400 Lee et al. May 2003 B1
7371143 Becken et al. May 2008 B2
7641976 Lamberson et al. Jan 2010 B2
7820941 Brown et al. Oct 2010 B2
7834550 Lee et al. Nov 2010 B2
7932670 Yoo et al. Apr 2011 B2
8063561 Choi et al. Nov 2011 B2
8440479 Nguyen et al. May 2013 B2
8490434 Watanabe et al. Jul 2013 B2
8516852 Matsumoto et al. Aug 2013 B2
20040069017 Li et al. Apr 2004 A1
20040207314 Aitken et al. Oct 2004 A1
20050103755 Baker et al. May 2005 A1
20060082298 Becken et al. Apr 2006 A1
20060084348 Becken et al. Apr 2006 A1
20070007894 Aitken et al. Jan 2007 A1
20070053088 Kranz et al. Mar 2007 A1
20070128967 Becken et al. Jun 2007 A1
20070170845 Choi et al. Jul 2007 A1
20070173167 Choi Jul 2007 A1
20080106194 Logunov et al. May 2008 A1
20080124558 Boek et al. May 2008 A1
20080135175 Higuchi Jun 2008 A1
20080182062 Becken et al. Jul 2008 A1
20090071588 Kimura et al. Mar 2009 A1
20090080055 Baur et al. Mar 2009 A1
20090086325 Liu et al. Apr 2009 A1
20090110882 Higuchi Apr 2009 A1
20090142984 Logunov et al. Jun 2009 A1
20090297861 Banks et al. Dec 2009 A1
20090297862 Boek et al. Dec 2009 A1
20090308105 Pastel et al. Dec 2009 A1
20100006228 Abe et al. Jan 2010 A1
20100095705 Burkhalter et al. Apr 2010 A1
20100116119 Bayne May 2010 A1
20100129666 Logunov et al. May 2010 A1
20100154476 Becken et al. Jun 2010 A1
20100267307 Park et al. Oct 2010 A1
20100304513 Nguyen et al. Dec 2010 A1
20110001424 Logunov et al. Jan 2011 A1
20110061789 Matsumoto Mar 2011 A1
20110067448 Matsumoto et al. Mar 2011 A1
20110072855 Matsumoto et al. Mar 2011 A1
20110088430 Matsumoto Apr 2011 A1
20110088431 Matsumoto Apr 2011 A1
20110135857 Logunov et al. Jun 2011 A1
20110169108 Gardner et al. Jul 2011 A1
20110223360 Shibuya et al. Sep 2011 A1
20110223371 Kawanami Sep 2011 A1
20110256407 Boek et al. Oct 2011 A1
20110265518 Matsumoto et al. Nov 2011 A1
20120111059 Watanabe et al. May 2012 A1
20120147538 Kawanami et al. Jun 2012 A1
20120151965 Matsumoto et al. Jun 2012 A1
20120156406 Banks et al. Jun 2012 A1
20120222450 Lamberson et al. Sep 2012 A1
20120234048 Matsumoto Sep 2012 A1
20120240628 Matsumoto Sep 2012 A1
20120240629 Matsumoto Sep 2012 A1
20120240630 Matsumoto Sep 2012 A1
20120240631 Matsumoto Sep 2012 A1
20120240632 Matsumoto Sep 2012 A1
20120240633 Matsumoto Sep 2012 A1
20120247153 Matsumoto Oct 2012 A1
20120260694 Matsumoto Oct 2012 A1
20120285200 Tanaka Nov 2012 A1
20120287026 Masuda Nov 2012 A1
20120318023 Shimomura Dec 2012 A1
20120320444 Baur et al. Dec 2012 A1
20130011598 Kawanami et al. Jan 2013 A1
20130104980 Sridharan et al. May 2013 A1
20130111953 Maloney et al. May 2013 A1
20130134396 Shimomura et al. May 2013 A1
20130174608 Takeuchi et al. Jul 2013 A1
20130237115 Choi et al. Sep 2013 A1
20130280981 Lee Oct 2013 A1
20130314760 Baur et al. Nov 2013 A1
Foreign Referenced Citations (52)
Number Date Country
1329395 Jan 2002 CN
1738777 Feb 2006 CN
1798708 Jul 2006 CN
1798710 Jul 2006 CN
1836177 Sep 2006 CN
101005915 Jul 2007 CN
101095247 Dec 2007 CN
101103429 Jan 2008 CN
101139165 Mar 2008 CN
100409392 Aug 2008 CN
101312234 Nov 2008 CN
101386477 Mar 2009 CN
101434453 May 2009 CN
101501808 Aug 2009 CN
102056858 May 2011 CN
2-120259 May 1990 JP
5-166462 Jul 1993 JP
2000-313630 Nov 2000 JP
2002-015108 Jan 2002 JP
2002-224871 Aug 2002 JP
2002-287107 Oct 2002 JP
2002-366050 Dec 2002 JP
2002-367514 Dec 2002 JP
2004-182567 Jul 2004 JP
2005-007665 Jan 2005 JP
2005-213125 Aug 2005 JP
2006-151774 Jun 2006 JP
2006-524419 Oct 2006 JP
2007-90405 Apr 2007 JP
2007-264135 Oct 2007 JP
2008-115057 May 2008 JP
2008-115067 May 2008 JP
2008-127223 Jun 2008 JP
2008-527655 Jul 2008 JP
2009-123421 Jun 2009 JP
2009-196862 Sep 2009 JP
10-0350323 Mar 2002 KR
10-2007-0003681 May 2007 KR
I495409 Jul 2002 TW
200516064 May 2005 TW
I255934 Jun 2006 TW
200733787 Sep 2007 TW
200737370 Oct 2007 TW
200822789 May 2008 TW
200911438 Mar 2009 TW
200944908 Nov 2009 TW
WO 2007067533 Jun 2007 WO
WO 2009131144 Oct 2009 WO
2009150975 Dec 2009 WO
2009150976 Dec 2009 WO
2009157281 Dec 2009 WO
2009157282 Dec 2009 WO
Non-Patent Literature Citations (18)
Entry
U.S. Office Action dated Jun. 28, 2012 that issued in U.S. Appl. No. 12/994,320 including Double Patenting Rejections on pp. 7-9.
U.S. Office Action dated Jul. 9, 2012 that issued in U.S. Appl. No. 12/994,321 including Double Patenting Rejections on pp. 7-9.
Cheung, Kerry, “Die-Level Glass Frit Vacuum Packaging for a Micro-Fuel Processor System,” Massachusetts Institute of Technology, Jun. 2005, pp. 17-19.
U.S. Office Action dated Apr. 25, 2013 that issued in U.S. Appl. No. 12/994,539 including Double Patenting rejections on pp. 5-8.
JP 20022366050 (Human Translation), retrieved from USPTO Translation Services and attached to the above-listed U.S. Office Action dated Apr. 25, 2013 in U.S. Appl. No. 12/994,539.
JP 2008115057 (Human Translation), retrieved from USPTO Translation Services and attached to the above-listed U.S. Office Action dated Apr. 25, 2013 in U.S. Appl. No. 12/994,539.
JP 20022366050 (Machine Translation), as attached to Office Action dated Jun. 1, 2012 in U.S. Appl. No. 12/994,354.
JP 2008115057 (Machine Translation), as attached to Office Action dated Jun. 1, 2012 in U.S. Appl. No. 12/994,354.
U.S. Office Action dated May 9, 2013 that issued in U.S. Appl. No. 12/994,399 including Double Patenting Rejections on pp. 6-10.
U.S. Office Action dated Jun. 3, 2014 that issued in U.S. Appl. No. 13/511,683 including Double Patenting Rejections on pp. 5-11.
U.S. Office Action dated Apr. 25, 2014 that issued in U.S. Appl. No. 13/511,721 including Double Patenting Rejections on pp. 2-3.
U.S. Office Action dated Jan. 28, 2014 that issued in U.S. Appl. No. 13/511,688 including Double Patenting Rejections on pp. 4-8.
U.S. Office Action dated Jul. 31, 2014 that issued in U.S. Appl. No. 12/994,354 including Double Patenting Rejections on pp. 7-10.
U.S. Office Action dated Jul. 2, 2014 that issued in U.S. Appl. No. 13/511,754 including Double Patenting Rejections on pp. 5-8.
U.S. Office Action dated Jul. 1, 2014 that issued in U.S. Appl. No. 13/511,738 including Double Patenting Rejections on pp. 4-5.
U.S. Office Action dated Jan. 16, 2014 that issued in U.S. Appl. No. 13/511,735 including Double Patenting Rejections on pp. 4-8.
U.S. Office Action dated Jan. 22, 2014 that issued in U.S. Appl. No. 13/509,112 including Double Patenting Rejections on pp. 4-5.
U.S. Office Action dated Jul. 1, 2014 that issued in U.S. Appl. No. 13/511,747 including Double Patenting Rejections on pp. 4-5.
Related Publications (1)
Number Date Country
20120151965 A1 Jun 2012 US
Continuations (1)
Number Date Country
Parent 12994320 US
Child 13345199 US