The present invention relates generally to materials science, surface engineering, spectroscopy, and, more particularly, surface enhanced Raman spectroscopy (SERS).
Since the first observation of SERS in 1974, a variety of metal nanostructures have been used to realize the enhancement of Raman signals. Generally, coinage metals such as Au, Ag, and Cu, are among the preferred choices for SERS applications because their dielectric constants satisfy the resonance condition at Raman excitation wavelengths which are typically near to or in the visible region. Among different nanostructures for SERS, nanoscale gaps between adjacent nanoparticles have demonstrated relatively strong enhancement effects and are often referred as “hot spots” for SERS. The enhancement factor, which is defined by the times of enhancement compared to a control, has been considered as one of the primary parameters for characterizing the performance of a SERS substrate. Other important parameters descriptive of SERS substrates include uniformity, repeatability, reproducibility, scalability, shelf life, and cost. In attempting to obtain reliable and scalable SERS substrates, numerous fabrication techniques and approaches have been explored, including various nanogeometries from electron beam lithography, nanopyramids and nanopillars from nanosphere lithography, nanowires decorated with nanoparticles, porous nanoscaffolds, nanoclusters from colloidal aggregation, rough thin films from chemical and physical roughening, nanorods from oblique angle deposition, nanoporous gold from dealloying, and the like. While advances have been made, there is still a need to develop SERS substrates with high enhancement factors, excellent reliability, and good scalability at low cost. The present novel technology addresses this need.
For the purposes of promoting an understanding of the principles of the invention and presenting its currently understood best mode of operation, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, with such alterations and further modifications in the illustrated device and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.
Optical-based sensing has several major advantages over electronic sensing because optical sensing reveals spectral fingerprints of chemical compounds rapidly and accurately, thus significantly simplifying the detection process and reducing false alarms. One of the most promising optical sensing techniques is surface enhanced Raman spectroscopy (SERS), which employs noble metal nanostructures to dramatically enhance Raman signals. With the aid of metallic nanostructures, such as gold based nanosubstrates, a Raman signal may be enhanced by a factor of 104 to 108 times, or even higher. This enhancement is due to the generation of spatially localized surface plasmon resonance (SPR) “hot spots” where huge local enhancements of electromagnetic field are obtained. The location of “hot spots” on the metallic structures depends on the geometry of the nanostructures, the excitation wavelength, and polarization of the optical fields. SERS can potentially reach the limit of detection down to the low parts-per-billion (ppb) and theoretically to the single molecule level. Thus, SERS has been increasingly used as a signal transduction mechanism in biological and chemical sensing.
The novel technology, as illustrated in
According to one embodiment of the present novel technology, the SERS surface 10 may include a base substrate 20 and a plurality of metallic nanostructures 15 deposited upon the base substrate 20. The substrate 20 is typically a semiconducting material, such as silicon. The nanostructures 15 are typically formed from gold, although other metals, such as silver, platinum, palladium, copper, nickel, titanium, chromium, or the like, and combinations thereof, may also be selected. The nanostructures 15 are typically sputtered onto the substrate, and are typically more or less uniformly sized and distributed. The plurality of more or less evenly distributed and sized nanostructures 15 likewise defines a plurality of gaps 25 therebetween. The respective gaps 25 may be free of nanostructure metal, or may simply contain less of it than do the adjacent nanostructures 15.
The nanostructures 15 are typically between about 10 nm and about 30 nm high and between about 15 nm and about 60 nm in diameter, more typically between about 20 nm and about 30 nm high and between about 30 nm and about 60 nm across. The nanostructures 15 define separation gaps 25 therebetween of between about 20 nm to about 50 nm. The gaps 25 may be totally devoid of the nanostructure metal, or may contain small thicknesses (typically less than about 5-10 nm) of the same, wherein those small thicknesses are substantially smaller than the nanostructure heights.
Typically, the nanostructures 15 are substantially strain-free, such as from having been annealed. The nanostructures 15 are likewise typically circular or quasi-circular in shape (as viewed from above), and typically have rounded features, although in some cases the nanostructures may have sharp features or combinations of sharp and rounder features. The nanostructures 15 may include additional roughening or protrusions 30 extending therefrom. The protrusions 30 are typically rounded (but may alternately be sharp) and are typically added by sputtering additional metal material onto previously formed nanostructures 15. Protrusions 30 are typically about 5 nm across.
Improved SERS surfaces 10 are typically produced by sputtering or otherwise introducing 40 gold or a like metal 35 onto a semiconducting substrate 20 to yield a plurality of generally evenly or homogeneously distributed nanostructures 15 defining a plurality of (typically generally evenly distributed) gaps 25 therebetween. The nanostructures 15 are then annealed 45. Typically, the sputtering/annealing processes 40/45 are repeated at least once, more typically at least twice, to yield a plurality of annealed nanoislands 15 on the substrate 20. While the last step is typically an annealing step 45, it may likewise be a sputtering step 40. Further, while each subsequent sputtering step 40 typically introduces more of the same metal 35 as did the previous step 40, in some embodiments subsequent sputtering 40 introduces different metal 35.
A silicon (100) wafer 20 was rinsed by acetone, methanol, and de-ionized water sequentially, and then dried by nitrogen gas flow. An ultra-thin non-contiguous gold layer defining a plurality of nanostructures 15, and with a 5 nm nominal thickness, was sputtered 40 on the wafer 20. The as-coated silicon wafer 20 was annealed 45 in a quartz tube furnace at 200° C. for 2 h, during which 100 standard cubic centimeters per minute (sccm) mixed forming gas (95% argon and 5% hydrogen) was used as the protective agent. After the first annealing 45, a plurality of gold nanoisland structures 15 had been formed. The 5 nm gold sputtering deposition 40 was repeated, as was a post-deposition annealing 45 of the gold nanoisland structures 15 either one or two times more, yielding three samples respectively having pluralities of gold nanoislands 15 with single, double, and triple sputtering deposition 40 and post-deposition annealing 45 processes, respectively. The triple processed gold nanoislands 15 were coated with a final layer of gold thin film (10 nm, 20 nm, 30 nm, 40 nm, 50 nm, and 60 nm nominal thicknesses) for the SERS measurements. For convenience, the gold nanoislands after each annealing 45 are referred to as primary gold nanoislands 15′ and the final layer of gold deposition is referred to as secondary gold nanoparticles 15″. The secondary gold nanoparticles 15″ are smaller than the primary gold nanoislands 15′. In addition, for comparison, a single process of gold sputtering deposition 40 and post-deposition annealing 45 was also applied on samples with initial nominal thickness of 10 nm and 15 nm. The planar morphology of gold nanoislands 15 at different stages was characterized with field emission SEM, and the heights of gold nanoislands 15 were measured with tapping mode atomic force microscopy. The size distribution analysis of gold nanoislands 15 was carried out by measuring and counting nanoislands across 1.2 μm by 1.2 μm SEM images.
Raman spectra were collected using a 20× objective with 10-second exposure time and ˜50 mW laser output. Malachite green (MG) and 1,2-benzenedithiol (1,2-BDT) were used as analytes. Analyte solutions of MG at various concentrations were prepared in an acetonitrile and water mixture (1:1 in volume). For each measurement, 0.2 μl MG analyte solution was dropped onto a SERS substrate 10 and dried in air. Also, a self-assembled monolayer (SAM) of 1,2-BDT was formed on a SERS substrate 10 in order to study its uniformity. Given the inner diameter (5.08 cm) of the tube used for annealing, the dimension of this SERS substrate was confined at 5 cm by 5 cm.
SEM characterization showed nearly round nanoislands 15 (from top view) formed with an average diameter of ˜16 nm after a single sputtering deposition 40 (5 nm nominal thickness) and post-deposition annealing process 45 (
By contrast, a single process of sputtering deposition 40 and post-deposition annealing 45 was also applied on samples with initial nominal thicknesses of 10 nm (equivalent to 2×5 nm) and 15 nm (equivalent to 3×5 nm). The planar morphology of these two thin films before annealing is shown in
While sputtered gold is composed of tiny nanoparticles with diameters of a few nanometers, gold sputtered onto substrates evolves to completely covered thin film state through a series of stages, namely isolated islands, percolation, holes filling, and finally thin film. When induced by annealing, the sputtered gold transforms into larger islands. This process is referred as to solid-state dewetting. The reduction of surface free energy (through the reduction of surface area) and the difference in thermal expansion coefficient between gold and the silicon substrate are the driving forces for the morphology change. Specifically, the inhomogeneous stress distribution at the gold-silicon interface promotes the migration of gold atoms to more relaxed regions. In addition, elevated temperatures enhance the mobility of gold atoms and facilitate small gold nanoparticles coalescing into larger islands to reduce the surface free energy. In general, the morphology of the resulting nanoislands 15 is primarily influenced by two factors, the initial film thickness or the initial stage of the sputtered gold (isolated islands, percolation, or holes filling), and the annealing environment, including temperature, atmosphere, and time.
In the above Example, 5 nm gold deposition 40 produced isolated nanoislands 15 (
The size and spacing of gold nanoparticles strongly affect localized surface plasmon resonance (LSPR) which constitutes the foundation of electromagnetic enhancement of SERS. With interparticle coupling effect being neglected, an isolated spherical gold nanoparticle 15 yields the maximum enhancement when particle diameter is ˜60 nm. Before reaching the maximum, the enhancement increased with increasing particle size. Regarding to spacing, with the particle diameter being fixed, the interparticle coupling effect starts to take place when the particle center to center distance is less than twice the particle diameter, and the effect then rises dramatically with decreasing interparticle distance. In other words, once interparticle coupling takes effect, SERS enhancement increases sharply with an increasing ratio of particle diameter to interparticle distance. Although a smaller interparticle distance generally leads to higher enhancement, the chances for molecules to locate in such a “hot spot” zone may also decrease. As a result, there is an optimal interparticle distance, not necessarily the smallest, that provides the highest enhancement for the substrates 10.
A series of gold thin films (10 nm, 20 nm, 30 nm, 40 nm, 50 nm, and 60 nm nominal thicknesses) were deposited over the primary gold nanoisland 15 arrays, with the thin films actually made of nanoparticles of a few nanometers. The nanoisland 15 arrays were produced as described above with the triple deposition 40 and annealing 45 process, which generated the best performance prior to the final layer of gold thin film deposition. In order to investigate the influence of the thin film thickness on SERS performance, these substrates 10 were tested by measuring 200 parts per billion (ppb) MG with all other experimental conditions held constant.
As shown in
Gaps 25 between adjacent nanoparticles 15 are believed to be the region where the highest enhancement is generated, and are thus often referred as SERS “hot spots”. As shown in
Optimally, there should be a balance of the positive and negative effects of the final layer gold deposition 40. In fact, the SERS measurement in
Triple processed gold nanoisland 15 arrays with 40 nm gold deposition were used for detection limit analysis.
In practical application, uniformity of the SERS substrate contributes to the enhancement factor. An enhancement factor of 106-109 issufficiently high for single molecule detection. 1,2-BDT was used to investigate the uniformity of the SERS substrate 10 since 1,2-BDT forms a monolayer on gold surfaces. Under such circumstances, aggregation or poor distribution of the analyte could be precluded and the results would more likely reflect the intrinsic property of the substrate 10. The SERS substrate 10 in this example was triple processed gold nanoisland 15 arrays with 40 nm gold deposition. The dimension of this SERS substrate 10 was 5 cm by 5 cm. After the formation of a self-assembled 1,2 BDT monolayer, the 5 cm by 5 cm SERS substrate 10 was divided evenly into 100 grid cells (5 mm by 5 mm each). The intensity of peak at a band of 1030 cm−1 from each grid cell was collected and plotted versus the substrate's 10 X-Y position, as shown in
While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character. It is understood that the embodiments have been shown and described in the foregoing specification in satisfaction of the best mode and enablement requirements. It is understood that one of ordinary skill in the art could readily make a nigh-infinite number of insubstantial changes and modifications to the above-described embodiments and that it would be impractical to attempt to describe all such embodiment variations in the present specification. Accordingly, it is understood that all changes and modifications that come within the spirit of the invention are desired to be protected.
This patent application claims priority to co-pending provisional patent application Ser. No. 61/958,520, filed on Jul. 30, 2013.
Number | Date | Country | |
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61958520 | Jul 2013 | US |