The present disclosure generally relates to the field of electronics. More particularly, an embodiment of the invention relates to a graphics memory module.
Computer graphics performance has become and integral part of computer system performance. With rapidly evolving graphics workloads in support of visually rich applications, such as games or graphics-rich operating systems, graphics compute throughput and memory bandwidth requirements remain on a steep upward trend. One current solution utilizes a unified physical system memory for both graphics tasks and other processing tasks. Such an implementation may force improvements in graphics memory bandwidth to remain dependent on the development roadmap of general-purpose memory chips. Additionally, sharing of the system memory may result in a lower performance, for example, when several components may try to access the system memory simultaneously. Another current solution utilizes discrete graphics cards. Adding a graphics card may add a significant amount of cost, e.g., associated with the graphics card itself or other supporting components, such as a cooling fan or a power supply. Also, graphics cards generally include their own components, such as a graphics processor, which in turn add to heat generated in a system. The additional heat may damage IC chips present in the system by, for example, thermal expansion. Also, the additional heat may limit usage locations and/or applications of a computing device that includes a discrete graphics card.
The detailed description is provided with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different figures indicates similar or identical items.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of various embodiments. However, various embodiments of the invention may be practiced without the specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to obscure the particular embodiments of the invention. Further, various aspects of embodiments of the invention may be performed using various means, such as integrated semiconductor circuits (“hardware”), computer-readable instructions organized into one or more programs (“software”), or some combination of hardware and software. For the purposes of this disclosure reference to “logic” shall mean either hardware, software, or some combination thereof.
Some of the embodiments discussed herein may be utilized to improve memory bandwidth available to integrated graphics logic. In an embodiment, the graphics logic may be provided on an integrated circuit (IC) device. The graphics logic may have access to data stored in an external graphics memory module. Hence, the graphics logic may have access to memory bandwidth provided through the graphics memory module, in addition to or instead of access to a system memory that may be shared between various components of a computing system, such as the computing systems discussed with reference to
More particularly,
As shown in
Additionally, the module 120 may include one or more graphics memory unit(s) 128 (generally referred to here as graphics “memory units” or more generally graphics “memory unit”), such as one or more units of graphics DDR (GDDR), DDR DRAM, etc. In some embodiments, the memory units used for the graphics memory module 120 may be faster (e.g., operating at a higher frequency), include less capacity, and/or provide a wider data path access when compared with the memory units used for the system memory 110. In an embodiment, graphics performance may be enhanced because the graphics logic 104 may have access to the graphics memory module through a dedicated interconnection or alternatively an interconnection which is shared amongst relatively less devices than the system memory 110. Also, the memory devices discussed herein (e.g., with respect to the system memory 110 and/or the memory module 120) may include various types of memory units in various embodiments, such as dual in-line memory modules (DIMMs) or small outline DIMMs (SO-DIMMs).
Furthermore, the system 100 may include a translation logic 130 to translate data communicated between the communication interfaces 124 and 126 between a first format (e.g., that may be used by the graphics logic 104) and a second format (e.g., that may be used by the graphics memory unit(s) 128). In some embodiments, the translation logic 130 may translate between proprietary low-level protocols, such as low level xDDR commands including a “pre-charge” command, an “open page” command, etc. Accordingly, the logic 130 may enable the graphics logic 104 to utilize any type of graphics memory unit(s) 128. Alternatively, the logic 130 may be located elsewhere in components of the system 100 (such as within the graphics controller 102) in some embodiments.
A chipset 206 may also communicate with the interconnection network 204. The chipset 206 may include a graphics memory controller (GMC) 208. The GMC 208 may include a memory controller 210 that communicates with a memory 212 (which may be the same or similar to the memory 110 of
The GMC 208 may also include the graphics logic 104 that communicates with a display device 216. In one embodiment of the invention, the graphics logic 104 may communicate with the display device 216 via an accelerated graphics port (AGP) and/or a PEG port. In an embodiment of the invention, the display 216 (such as a flat panel display) may communicate with the graphics logic 104 through, for example, a signal converter (not shown) that translates a digital representation of an image stored in a storage device such as video memory (e.g., the module 120) or system memory (e.g., memory 212) into display signals that are interpreted and displayed by the display 216. Moreover, in some embodiments that utilize a PEG port, one or more of the PEG port pins may be used to drive the display device 216 while one or more other pins of the PEG port may be used to access the graphics memory module 120. The display signals produced by the display device may pass through various devices before being interpreted by and subsequently displayed on the display 216.
An interface 218 may allow the GMC 208 and an input/output controller (IC) 220 to communicate. The IC 220 may provide an interface to I/O device(s) that communicate with the computing system 200. The IC 220 may communicate with a bus 222 through a peripheral bridge (or controller) 224, such as a peripheral component interconnect (PCI) bridge, a universal serial bus (USB) controller, or other types of peripheral bridges or controllers. The bridge 224 may provide a data path between the CPU 202 and peripheral devices. Other types of topologies may be utilized. Also, multiple buses may communicate with the IC 220, e.g., through multiple bridges or controllers. Moreover, other peripherals in communication with the IC 220 may include, in various embodiments of the invention, integrated drive electronics (IDE) or small computer system interface (SCSI) hard drive(s), USB port(s), a keyboard, a mouse, parallel port(s), serial port(s), floppy disk drive(s), digital output support (e.g., digital video interface (DVI)), or other devices.
The bus 222 may communicate with an audio device 226, one or more disk drive(s) 228, and a network interface device 230 (which is in communication with the computer network 203). Other devices may communicate via the bus 222. Also, various components (such as the network interface device 230) may communicate with the GMC 208 in some embodiments of the invention. In addition, the processor 202 and the GMC 208 may be combined to form a single chip. Furthermore, a graphics accelerator may be included within the GMC 208 in other embodiments of the invention.
Furthermore, the computing system 200 may include volatile and/or nonvolatile memory (or storage). For example, nonvolatile memory may include one or more of the following: read-only memory (ROM), programmable ROM (PROM), erasable PROM (EPROM), electrically EPROM (EEPROM), a disk drive (e.g., 228), a floppy disk, a compact disk ROM (CD-ROM), a digital versatile disk (DVD), flash memory, a magneto-optical disk, or other types of nonvolatile machine-readable media that are capable of storing electronic data (e.g., including instructions).
Referring to
At an operation 306, data communicated with the memory module of operation 302 may be translated. For example, the logic 130 may translate the data as discussed with reference to
As illustrated in
In an embodiment, the processors 402 and 404 may be one of the processors 202 discussed with reference to
At least one embodiment of the invention may be provided within the processors 402 and 404. For example, the graphics logic 104 of
The chipset 420 may communicate with a bus 440 using a PtP interface circuit 441. The bus 440 may communicate with one or more devices, such as a bus bridge 442 and I/O devices 443. Via a bus 444, the bus bridge 442 may communicate with other devices such as a keyboard/mouse 445, communication devices 446 (such as modems, network interface devices, or other communication devices that may communicate with the computer network 203), audio I/O device 447, and/or a data storage device 448. The data storage device 448 may store code 449 that may be executed by the processors 402 and/or 404.
In various embodiments of the invention, the operations discussed herein, e.g., with reference to
Additionally, such computer-readable media may be downloaded as a computer program product, wherein the program may be transferred from a remote computer (e.g., a server) to a requesting computer (e.g., a client) by way of data signals embodied in a carrier wave or other propagation medium via a communication link (e.g., a bus, a modem, or a network connection). Accordingly, herein, a carrier wave shall be regarded as comprising a machine-readable medium.
Reference in the specification to “one embodiment,” “an embodiment,” or “some embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment(s) may be included in at least an implementation. The appearances of the phrase “in one embodiment” in various places in the specification may or may not be all referring to the same embodiment.
Also, in the description and claims, the terms “coupled” and “connected,” along with their derivatives, may be used. In some embodiments of the invention, “connected” may be used to indicate that two or more elements are in direct physical or electrical contact with each other. “Coupled” may mean that two or more elements are in direct physical or electrical contact. However, “coupled” may also mean that two or more elements may not be in direct contact with each other, but may still cooperate or interact with each other.
Thus, although embodiments of the invention have been described in language specific to structural features and/or methodological acts, it is to be understood that claimed subject matter may not be limited to the specific features or acts described. Rather, the specific features and acts are disclosed as sample forms of implementing the claimed subject matter.