Claims
- 1. A gravure printing sleeve, comprising:
a tubular substrate having an inner and an outer surface, the inner surface sized to fit on a cylinder mandrel; a printing surface on the outer surface of the tubular substrate; and a resist layer on the printing surface.
- 2. A gravure printing sleeve according to claim 1, wherein the tubular substrate is a metallic cylinder.
- 3. A gravure printing sleeve according to claim 1, wherein the printing surface comprises a layer of copper.
- 4. A gravure printing sleeve according to claim 3, comprising a layer of chrome on top of the layer of copper.
- 5. A gravure printing sleeve according to claim 3, comprising a release layer disposed between the substrate and the layer of copper.
- 6. A gravure printing sleeve according to claim 1, wherein the cylinder mandrel comprises an arbor with an intermediate sleeve slideably located on the arbor.
- 7. A gravure printing sleeve according to claim 1, wherein the resist layer is adapted to change solubility in response to imagewise exposure by infrared radiation.
- 8. A method for preparing a gravure printing element, the method comprising:
providing a ready-to-image gravure sleeve comprising a tubular substrate having an inner and an outer surface with a printing surface on the outer surface thereof and a resist layer on the printing surface; loading the ready-to-image sleeve in an imaging device; receiving image data representing a gravure image; exposing the resist layer in accordance with the image data; and etching a plurality of gravure cells in the printing surface using the exposed resist layer as an etch mask.
- 9. A method according to claim 8, further comprising removing the etch mask after etching.
- 10. A method according to claim 8, wherein loading the ready-to-image sleeve in an imaging device comprises:
providing a cylinder mandrel, the mandrel sized for an interference fit with the inner surface of the sleeve; positioning the sleeve in partial engagement with the mandrel; introducing a pressurized airflow between the sleeve and the mandrel to expand the sleeve; sliding the sleeve into full engagement with the mandrel; interrupting the pressurized airflow, thus allowing the sleeve to contract into an interference fit with the mandrel.
- 11. A method according to claim 8, further comprising developing the exposed resist layer to form the etch mask.
RELATED APPLICATIONS
[0001] This application claims benefit of the filing date of U.S. application Ser. No. 60/426870 provisionally filed on Nov. 18, 2002.
Provisional Applications (1)
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Number |
Date |
Country |
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60426870 |
Nov 2002 |
US |