GRINDER

Abstract

A grinder may include a spindle, a grinding wheel and a mount disk. The spindle may be configured to generate a rotary force. The grinding wheel may be configured to receive the rotary force from the spindle and grind an object. The mount disk may be between the spindle and the grinding wheel and may be configured automatically engage or disengage the grinding wheel based on a rotation direction of the mount disk. Thus, an exchange or replacement of the grinding wheel may be performed in a short time by rotating the spindle so that the grinding wheel is disengaged from the mount disk.

Description

CROSS-RELATED APPLICATION

This U.S. non-provisional application claims the benefit of priority under 35 USC § 119 to Korean Patent Application No. 10-2023-0082323, filed on Jun. 27, 2023 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in its entirety.

BACKGROUND

Various example embodiments relate to a grinder. More particularly, various example embodiments relate to a grinder configured to grind a backside of a wafer and/or a method of operating the grinder, etc.

A semiconductor packaging process may include a process for grinding a backside of a wafer using a grinder. The grinder may include a grinding wheel rotatably contacted with the backside of the wafer.

The grinding wheel of the grinder may become worn and may be exchanged for a new grinding wheel. The exchange of the grinding wheel may include unfastening and fastening bolts and/or other fasteners. Thus, a large amount of time may be used in the exchange of the grinding wheel. Further, the exchange of the grinding wheel may be too difficult for a worker.

SUMMARY

Various example embodiments provide a grinder that may be capable of being exchanged readily for a new one in a short time and/or a method of operating the grinder, etc.

According to at least one example embodiment, there may be provided a grinder. The grinder may include a spindle, a grinding wheel and a mount disk. The spindle may be configured to generate a rotary force. The grinding wheel may be configured to receive the rotary force from the spindle and grind an object based on the rotary force. The mount disk may be between the spindle and the grinding wheel, and may be configured to automatically engage or disengage the grinding wheel based on a rotation direction of the mount disk.

According to at least one example embodiment, there may be provided a grinder. The grinder may include a spindle, a grinding wheel, an inner disk, an outer disk and a plurality of combination shafts. The spindle may be configured to generate a rotary force. The grinding wheel may be configured to receive the rotary force from the spindle and grind a surface of a semiconductor wafer based on the rotary force. The inner disk may be connected to the spindle. The outer disk may be connected to the inner disk. The plurality of combination shafts may be configured to engage or disengage the grinding wheel based on a rotation direction of the outer disk.

According to at least one example embodiment, there may be provided a grinder. The grinder may include an actuator, a spindle, a grinding wheel, an inner disk, an outer disk and a plurality of combination shafts. The actuator may be configured to generate a rotary force. The spindle may be configured to rotate based on the rotary force. The grinding wheel may be configured to receive the rotary force from the spindle and grind a surface of a semiconductor wafer based on the rotary force. The inner disk may be connected to the spindle. The outer disk may be connected to the inner disk. The plurality of combination shafts may be configured to engage or disengage the grinding wheel based on a rotation direction of the outer disk. The outer disk may include an inner race and an outer race. The inner race may be connected to the inner disk. The inner race may include an inner gear surface. The outer race may be spaced apart from the inner race, the outer race and the inner race may define a receiving space. The outer race may include an outer gear surface. Each combination shaft may include a geared portion and a screwed portion. The geared portion may be configured to engage the inner gear surface and the outer gear surface. The screwed portion may be extended from the geared portion. The screwed portion may be configured to engage or disengage the grinding wheel based on a rotation direction of the geared portion.

According to at least one example embodiment, the combination shaft may be raised or lowered based on the rotation directions of the inner race so that the screwed portion of the combination shaft may be engaged or disengaged from the grinding wheel. Thus, an exchange or replacement of the grinding wheel may easily be performed in a short period of time by rotating the spindle.

BRIEF DESCRIPTION OF THE DRAWINGS

Various example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. FIGS. 1 to 6 represent non-limiting, example embodiments as described herein.

FIG. 1 is a front view illustrating a grinder in accordance with some example embodiments;

FIG. 2 is a perspective view illustrating a mount disk of the grinder in FIG. 1 according to at least one example embodiment;

FIG. 3 is a partially cut perspective view illustrating the mount disk in FIG. 2 according to at least one example embodiment;

FIG. 4 is a plan view illustrating an inner structure of the mount disk in FIG. 2 according to at least one example embodiment;

FIG. 5 is a perspective view illustrating a combination shaft of the mount disk in FIG. 3 according to at least one example embodiment; and

FIG. 6 is a cross-sectional view illustrating the combination shaft in FIG. 5 according to at least one example embodiment.

DETAILED DESCRIPTION

Hereinafter, various example embodiments will be explained in detail with reference to the accompanying drawings.

FIG. 1 is a front view illustrating a grinder in accordance with some example embodiments, FIG. 2 is a perspective view illustrating a mount disk of the grinder in FIG. 1 according to at least one example embodiment, FIG. 3 is a partially cut perspective view illustrating the mount disk in FIG. 2 according to at least one example embodiment, FIG.4 is a plan view illustrating an inner structure of the mount disk in FIG. 2 according to at least one example embodiment, FIG. 5 is a perspective view illustrating a combination shaft of the mount disk in FIG. 3 according to at least one example embodiment, and FIG. 6 is a cross-sectional view illustrating the combination shaft in FIG. 5 according to at least one example embodiment.

Referring to FIGS. 1 to 6, a grinder of some example embodiments may be used for a process for grinding a backside of a wafer W (e.g., a semiconductor wafer), but is not limited thereto, and for example, may be used to grind other objects. Thus, the grinder of one or more example embodiments may be used for method and/or processes for grinding objects.

The grinder may include an actuator 110, a spindle 100, a mount disk 200, and/or a grinding wheel 300, etc., but is not limited thereto, and for example, may include a greater or lesser number of constituent elements. The actuator 110 may generate a rotary force (e.g., torque) along a first axis, e.g., a vertical axis and/or vertical direction, but is not limited thereto. The spindle 100 may receive the rotary force (e.g., torque), e.g., a second axis and/or a horizontal direction, generated from the actuator 110. Thus, the spindle 100 may rotate around the first axis, e.g., the vertical direction. In some example embodiments, the actuator 110 may be arranged in and/or included in the spindle 100, but is not limited thereto. For example, the actuator 110 may be arranged above (e.g., over) the spindle 100, etc. In this case, the actuator 110 may be connected to an upper surface of the spindle 100, but is not limited thereto. Further, the actuator 110 may include a motor and/or may be implemented as a motor (not shown), but is not limited thereto.

The grinding wheel 300 may be arranged under and/or below the spindle 100, but is not limited thereto. The grinding wheel 300 may receive the rotary force of the spindle 100 through the mount disk 200. Thus, the grinding wheel 300 may be rotated around the first axis, e.g., the vertical direction, and with respect to the second axis, e.g., the horizontal direction, to grind an object, such as the backside of the wafer. In some example embodiments, a plurality of combination holes may be formed through an upper surface of the grinding wheel 300, but the example embodiments are not limited thereto. The combination holes may be spaced apart from each other by a uniform gap along a circumferential line of the grinding wheel 300, but are not limited thereto, and for example, the combination holes may be irregularly spaced apart and/or may not be arranged along a circumferential line, etc.

The mount disk 200 may be arranged at a first end, i.e., a lower end of the spindle 100, but is not limited thereto. The mount disk 200 may be combined with, attached to, and/or automatically combined with the grinding wheel 300, but is not limited thereto. Further, the mount disk 200 may be separated, detached, and/or automatically separated from the grinding wheel 300. That is, the grinding wheel 300 may be combined with, or separated from, (e.g., attached and/or detached from) the mount disk 200.

The mount disk 200 may include one or more disks, such as an inner disk 210 and an outer disk 220, and a plurality of combination shafts 230, but the example embodiments are not limited thereto, and for example, the mount disk 200 may include a greater or lesser number of disks and/or shafts. The inner disk 210 may be connected to one end of the spindle 100, e.g., the lower end of the spindle 100, etc. Thus, the inner disk 210 may be rotated together with the spindle 100 around the first axis, e.g., vertical direction, with respect to the second axis, e.g., the horizontal direction. The inner disk 210 may have a circular plate shape, but is not limited thereto, and may have other shapes.

The outer disk 220 may have an annular shape configured to surround the inner disk 210, but is not limited thereto and may have different shapes. The outer disk 220 may be connected to an outer circumferential surface of the inner disk 210. Thus, the outer disk 220 may be rotated together with the inner disk 210 along the, e.g., vertical direction, with respect to the second axis, e.g., the horizontal direction.

The outer disk 220 may include one or more races (e.g., rings, tracks, etc.), such as, an inner race 222 and an outer race 224, but is not limited thereto. The inner race 222 may have an annular shape configured to surround the inner disk 210, but is not limited thereto. The inner race 222 may be connected to the outer circumferential surface of the inner disk 210. That is, an inner circumferential surface of the inner race 222 may contact the outer circumferential surface of the inner disk 210. Thus, the inner race 222 may be rotated together with the inner disk 210 around the first axis, e.g., vertical direction, with respect to the second axis, e.g., the horizontal direction. An inner gear 223 (e.g., a plurality of gear teeth) may be formed on and/or included in the inner circumferential surface of the inner race 222. The inner gear 223 may be formed along the second axis, e.g., horizontal direction.

The outer race 224 may have an annular shape configured to surround the inner race 222, but is not limited thereto, and for example, may have a non-annular shape. Further, the outer race 224 may be spaced apart from the inner race 22 to form a receiving space 240 configured to receive the combination shaft 230 between the inner race 222 and the outer race 224. The receiving space 240 may have an annular shape extended in a circumferential direction of the outer race 224, but is not limited thereto. An outer gear 225 (e.g., a plurality of gear teeth) may be formed on and/or included on an inner circumferential surface of the outer race 224. That is, the inner gear 223 may be positioned at an inner wall among sidewalls of the receiving space 240, and the outer gear 225 may be positioned at an outer sidewall among the sidewalls of the receiving space 240, etc.

The combination shafts 230 may be arranged in the outer disk 220, but is not limited thereto. Particularly, the combination shafts 230 may be arranged in the receiving space 240. Further, the combination shafts 230 may be spaced apart from each other by a uniform gap along the circumferential line of the outer disk 220, but is not limited thereto, and for example, may be non-uniformly spaced apart along the outer disk 220, etc. The combination shafts 230 may be combined with, or separated from, (e.g., engaged with or disengaged from and/or attached to or detached from) the grinding wheel 300 in accordance with and/or based on the rotation directions of the outer disk 220, particularly, the inner race 222, etc. That is, the grinding wheel 300 may be combined with, or separated from, the combination shafts 230 in accordance with and/or based on the rotation directions of the inner race 222.

Each of the combination shafts 230 may include a geared portion 232 (e.g., a first section including at least one gear) and a screwed portion 234 (e.g., a second section including spiral grooves, external threads, and/or helical ridges, etc., on an exterior surface of the second portion), etc., but is not limited thereto. The geared portion 232 may be engaged with the inner gear 223 and the outer gear 225, but is not limited thereto. Because the inner gear 223 may be on and/or formed on the outer circumferential surface of the inner race 222, the geared portion 232 may be rotated around the first axis, e.g., the vertical direction, with respect to the second axis, e.g., the horizontal direction, by the rotation of the inner race 222. Thus, a rotation direction of the geared portion 232 may be opposite to the rotation direction of the inner race 222.

The screwed portion 234 may be vertically (e.g., downwardly) extended from the geared portion 232, but is not limited thereto. Thus, the screwed portion 234 may also be rotated together with the geared portion 232 around the first axis, e.g., the vertical direction. Further, the screwed portion 234 may be, for example, included in, engaged with, and/or threadedly combined with the sidewall of the receiving space 240. Thus, the screwed portion 234 may move along the first axis (e.g., upwardly or downwardly) along the sidewall of the receiving space 240 in accordance with and/or based on the rotation (e.g., the rotation directions) of the geared portion 232. The screwed portion 234 may have a diameter shorter than a diameter of the geared portion 234, but is not limited thereto.

The receiving space 240 (e.g., a receiving cavity, etc.) may include a receiving groove 242 and a plurality of screwed holes 244, but is not limited thereto. The receiving groove 242 may receive, engage with, and/or mate with the geared portion 232. The receiving groove 242 may have an annular shape along the circumferential direction of the outer race 224, but is not limited thereto.

The screwed holes 244 may be extended along the first axis, e.g., downwardly extended, from the receiving space 242. Each of the screwed holes 244 may receive the screwed portion 234. A threaded portion 246 may be formed on an inner circumferential surface of each of the screwed holes 244. Thus, the screwed portion 234 of the combination shaft 230 may be combined with, engaged with, mated with, threadedly combined with the inner circumferential surface of the screwed hole 244. In some example embodiments, the screwed hole 244 may have a width narrower than a width of the receiving groove 242, but is not limited thereto.

Additionally, in order to decrease and/or prevent particles from infiltrating into the mount disk 200 through the screwed hole 244, a seal 250 may be arranged between the inner circumferential surface of the screwed hole 244 and the screwed portion 234, but the example embodiments are not limited thereto.

In order to exchange and/or replace the grinding wheel 330 for a new grinding wheel 300, the actuator 110 may generate the rotary force (e.g., torque) along a, e.g., clockwise direction, with respect to the second axis (e.g., horizontal direction), but the example embodiments are not limited thereto. The rotary force may be transferred to the inner race 222 through the spindle 100 and the inner disk 210. Because the geared portion 232 may be engaged with the inner gear 223 of the inner race 222, the geared portion 232 may be rotated along a, e.g., counterclockwise, direction with respect to the second axis, e.g., the horizontal direction, but the example embodiments are not limited thereto. The screwed portion 234 may be moved, e.g., upwardly moved, along the inner circumferential surface of the screwed hole 244 on the first axis (e.g., vertical direction) by the rotation of the geared portion 232, but is not limited thereto. Thus, the screwed portion 234 may be removed from the combination hole of the grinding wheel 300 by the rotation of the geared portion 232. As a result, the grinding wheel 300 may be readily separated from and/or removed from the mount disk 200, thereby allowing for a technician and/or user to easily and efficiently replace the grinding wheel 300 and/or perform other maintenance on the grinding wheel 300 and/or the mount disk 200, etc.

A new grinding wheel 300 may be arranged under the mount disk 200. The actuator 110 may generate a rotary force along, for example, the counterclockwise direction with respect to the second axis, e.g., the horizontal direction. The rotary force may be transferred to the inner race 222 through the spindle 100 and the inner disk 210, but is not limited thereto. Because the geared portion 232 may be engaged with the inner gear 223 of the inner race 222, the geared portion 232 may be rotated along the clockwise direction with respect to the second axis, e.g., the horizontal direction. The screwed portion 234 may be moved along the first axis (e.g., downwardly moved) along the inner circumferential surface of the screwed hole 244 by the rotation of the geared portion 232, but is not limited thereto. Thus, the screwed portion 234 may be combined with, threadedly combined with, mated with, engaged with, etc., the combination hole of the grinding wheel 300. As a result, the new grinding wheel 300 may be readily, easily, and/or efficiently combined with, attached to, engaged to, etc., the mount disk 200.

According to some example embodiments, the combination shaft may be lifted and/or lowered in accordance with and/or based on the rotation directions of the inner race so that the screwed portion of the combination shaft may be combined with, or separated from, the grinding wheel. Thus, an exchange, replacement, and/or other maintenance of the grinding wheel and/or mount disk, etc., may be performed by rotating the spindle so that, for example, the grinding wheel may be readily exchanged for a new grinding wheel in a short time by an operator.

The foregoing is illustrative of various example embodiments of the inventive concepts and is not to be construed as limiting the inventive concepts. Although a few example embodiments have been described, those of ordinary skill in the art will readily appreciate that many modifications are possible in the example embodiments without departing from the novel teachings and advantages of the inventive concepts. Accordingly, all such modifications are intended to be included within the scope of the inventive concepts as defined in the claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Therefore, it is to be understood that the foregoing is illustrative of various example embodiments and is not to be construed as limited to the specific example embodiments disclosed, and that modifications to the disclosed example embodiments, as well as other example embodiments, are intended to be included within the scope of the appended claims.

Claims

1. A grinder comprising: a spindle configured to generate a rotary force;a grinding wheel configured to receive the rotary force from the spindle and grind an object based on the rotary force; anda mount disk arranged between the spindle and the grinding wheel, the mount disk configured to automatically engage or disengage the grinding wheel based on a rotation direction of the mount disk.

2. The grinder of claim 1, wherein the mount disk comprises: an inner disk connected to the spindle;an outer disk connected to the inner disk; anda plurality of combination shafts configured to engage or disengage the grinding wheel based on a rotation direction of the outer disk.

3. The grinder of claim 2, wherein the outer disk comprises: an inner race connected to the inner disk, the inner race including a plurality of first gear teeth on a circumferential surface of the inner race; andan outer race spaced apart from the inner race, the outer race and inner race defining a receiving space, the outer race including a plurality of second gear teeth on a circumferential surface of the outer race.

4. The grinder of claim 3, wherein each combination shaft of the plurality of combination shafts comprises: a geared portion configured to engage the plurality of first gear teeth of the inner race and the plurality of second gear teeth of the outer race; anda screwed portion extended from the geared portion and configured to engage or disengage the grinding wheel based on a rotation direction of the geared portion.

5. The grinder of claim 4, wherein the screwed portion has a diameter smaller than a diameter of the geared portion.

6. The grinder of claim 4, wherein the receiving space comprises: a receiving groove configured to receive the geared portion; andat least one screwed hole extended from the receiving groove and configured to receive the screwed portion, the screwed hole including at least one groove configured to threadedly engage the screwed portion.

7. The grinder of claim 6, wherein the plurality of first gear teeth and the plurality of second gear teeth define sidewalls of the receiving space.

8. The grinder of claim 6, wherein the screwed hole has a diameter smaller than a diameter of the receiving space.

9. The grinder of claim 6, further comprising: a seal arranged between an inner circumferential surface of the screwed hole and the screwed portion.

10. The grinder of claim 1, further comprising: an actuator connected to the spindle, the actuator configured to generate the rotary force.

11. The grinder of claim 1, wherein the object comprises a semiconductor wafer.

12. A grinder comprising: a spindle configured to generate a rotary force;a grinding wheel configured to receive the rotary force from the spindle and grind a surface of a semiconductor wafer based on the rotary force;an inner disk connected to the spindle;an outer disk connected to the inner disk; anda plurality of combination shafts configured to engage or disengage the grinding wheel based on a rotation direction of the outer disk.

13. The grinder of claim 12, wherein the outer disk comprises: an inner race connected to the inner disk, the inner race including an inner gear surface; andan outer race spaced apart from the inner race, the outer race and the inner race defining a receiving space, the outer race including an outer gear surface.

14. The grinder of claim 13, wherein each combination shaft of the combination shafts comprises: a geared portion configured to engage with the inner gear surface and the outer gear surface; anda screwed portion extended from the geared portion and configured to engage or disengage the grinding wheel based on a rotation direction of the geared portion.

15. The grinder of claim 14, wherein the screwed portion has a diameter smaller than a diameter of the geared portion.

16. The grinder of claim 14, wherein the receiving space comprises: a receiving groove configured to receive the geared portion; andat least one screwed hole extended from the receiving groove and configured to receive the screwed portion, the screwed hole including at least one groove configured to threadedly engage the screwed portion.

17. The grinder of claim 16, wherein the inner gear surface and the outer gear surface define sidewalls of the receiving space.

18. The grinder of claim 16, further comprising: a seal arranged between an inner circumferential surface of the screwed hole and the screwed portion.

19. A grinder comprising: an actuator configured to generate a rotary force.a spindle configured to rotate based on the rotary force;a grinding wheel configured to receive the rotary force from the spindle and grind a surface of a semiconductor wafer based on the rotary force;an inner disk connected to the spindle;an outer disk connected to the inner disk; anda plurality of combination shafts configured to engage or disengage the grinding wheel based on rotation directions of the outer disk;the outer disk including, an inner race connected to the inner disk, the inner race including an inner gear surface, andan outer race spaced apart from the inner race, the outer race and the inner race defining a receiving space, the outer race including an outer gear surface; andeach combination shaft of the plurality of combination shafts including, a geared portion configured to engage with the inner gear surface and the outer gear surface; anda screwed portion extended from the geared portion and configured to engage or disengage the grinding wheel based on a rotation direction of the geared portion.

20. The grinder of claim 19, further comprising: a seal arranged between an inner circumferential surface of a screwed hole included in the receiving space and the screwed portion.