This U.S. patent application claims priority to Taiwan Patent Application No. 106119428 filed on Jun. 12, 2017, which is incorporated herein by reference.
The present invention relates to grinding tools and fabrication methods thereof.
Grinding and/or polishing techniques are generally applied to create a desirable surface roughness or planarity of a rigid part, such as metal, ceramic or glass parts, or semiconductor wafers. To this purpose, the grinding and/or polishing techniques use tools having abrasive elements that can wear the rigid surface.
A well known polishing technique is the chemical mechanical polishing (CMP) technique employed in semiconductor fabrication processes. CMP uses a corrosive chemical slurry in conjunction with a polishing pad to remove undesired residues and planarize a wafer surface, which can be made of ceramic, silicon, glass, sapphire or metal. After the polishing pad is used over a period of time, the grinding action of the polishing pad may diminish. Accordingly, an additional grinding tool (also called “conditioner”) may be typically used to coarsen the surface of the polishing pad for maintaining an optimal grinding efficiency of the polishing pad.
Conventionally, a cutting rate of the grinding tool may be improved by increasing a distribution density of the abrasive elements provided thereon. This requires increasing the quantity of abrasive elements on the grinding tool, which makes the grinding tool more expensive to manufacture.
Therefore, there is a need for an improved grinding tool that can be fabricated in a cost-effective manner and reliably attach abrasive elements, and can address at least the foregoing issues.
The present application describes a grinding tool that can reliably attach abrasive particles, and can be fabricated in a cost-effective manner. The grinding tool includes a substrate and a plurality of abrasive particles. The substrate has a first and a second surface and a plurality of holes, each of the holes extending through the substrate and respectively having a first and a second opening on the first and second surface, the second opening being larger than the first opening. The abrasive particles are respectively disposed in the holes and attached to the substrate via a plurality of adhesive portions, each of the abrasive particles having a tip protruding outward from the first surface and a remaining part covered with one of the adhesive portions inside the corresponding hole, wherein the first openings of the holes are smaller than the abrasive particles, and the abrasive particles are respectively retained in the holes.
The present application further describes a method of fabricating a grinding tool. The method includes providing a substrate having a first and a second surface and a plurality of holes, each of the holes extending through the substrate and respectively having a first and a second opening on the first and second surface, the second opening being larger than the first opening; respectively placing a plurality of abrasive particles in the holes through the second openings thereof, wherein the abrasive particles are generally larger than the first openings and partially protrude outward from the first openings; placing the substrate on a fixed support having a plurality of positioning cavities, the abrasive particles protruding from the first openings being respectively received partially in the positioning cavities; and respectively applying a plurality of adhesive portions through the second openings into the holes, thereby the adhesive portions respectively cover the abrasive particles inside the holes and fixedly attach the abrasive particles to the substrate.
The abrasive particles 22 can be made of any suitable materials having high hardness. Examples of suitable materials for the abrasive particles 22 may include, without limitation, diamond, cubic boron nitride, aluminum oxide, and silicon carbide. The abrasive particles 22 are not limited in shape, and may exemplary have a hexoctahedron crystalline form. Moreover, the abrasive particles 22 may have any suitable size in accordance with the requisite functions of the grinding tool 2. According to an embodiment, the size of the abrasive particles 22 can exemplary be about 20 to about 30 US mesh, i.e., a mesh screen used to filter the abrasive particles 22 can have about 20 to about 30 openings per square inch, and an average greatest width of the abrasive particles 22 is between about 800 μm and about 1000 μm. According to an embodiment, there may be about 60 to about 300 abrasive particles 22 provided on the substrate 21.
Referring to
Each hole 213 can extend through the substrate 21, and can respectively form two openings 212A and 211A on the two opposite surfaces 212 and 211. According to an example of construction, the openings 212A and 211A can have circular shapes, and the openings 212A can be larger than the openings 211A. Moreover, the abrasive particles 22 are generally larger than the openings 211A. For example, each opening 211A can have a diameter generally smaller than each abrasive particle 22, e.g., smaller than an average size or average greatest width of the abrasive particles 22. According to an embodiment, the opening 212A can have a diameter between 1 mm and 2 mm, such as 1 mm, and the opening 211A can have a diameter between 0.4 mm and 0.75 mm, such as 750 μm. According to an embodiment, a size ratio (e.g., diameter ratio) between the opening 211A and the opening 212A can be between about 0.2 and about 0.75, e.g., from 0.4 to 0.375. With this differential size configuration, the smaller opening 211A can block passage of the abrasive particle 22 and thereby retain the abrasive particle 22 in the hole 213. As a result, the abrasive particle 22 can be prevented from falling out of the grinding tool 2 during use. Once the abrasive particle 22 is positioned in the hole 213, the abrasive particle 22 can partially protrude outward from the opening 211A on the surface 211 of the substrate 21.
According to an embodiment, each hole 213 can include two hole sections 215 and 214 connected with each other that have different sizes and shapes. The hole section 215 can exemplary have a cylindrical shape, and the other hole section 214 can be exemplary shaped as a truncated cone. The hole section 215 can open on the surface 212 through the opening 212A, and can have an inner sidewall that can be substantially perpendicular to the surface 212. The hole section 214 can open on the surface 211 through the opening 211A, and can have a tapered shape that narrows toward the surface 211. For example, a material angle between an inner sidewall of the hole section 214 and the surface 211 can be between about 70 and about 89 degrees. Because the diameter of the hole section 215 is generally greater than any diameter of the tapered hole section 214, an adhesive material flowed from the hole section 215 toward the hole section 214 to form the adhesive portion 216 can fully fill the hole 213, which can reduce the occurrence of air voids inside the adhesive portion 216. The portion of the abrasive particle 22 received inside the hole 213 is in contact with the adhesive portion 216, which can substantially attach the abrasive particle 22 to the substrate 21. Examples of suitable materials for the adhesive portions 216 can include epoxy, phenolic resins, polyester resins, polyamide resins, polyimide resins, polycarbonate resins, and any combinations thereof.
The substrate 41 can may be integrally formed as a single rigid body. In particular, the substrate 41 may be made of a stiff and chemically stable material, which can exemplary include stainless steel, ceramics, and the like. According to an embodiment, the substrate 41 is made of stainless steel so that the grinding tool 4 is less subjected to chemical alteration when it is used in contact with an acid or alkaline slurry. There is no particular limitation imposed on the size of the substrate 41. According to an embodiment, the substrate 41 may be a generally circular disk having a diameter of about 4 inches. Moreover, the substrate 41 may have a thickness greater than the thickness of the substrate 21 described previously so as to increase the rigidity of the grinding tool 4. For example, the thickness of the substrate 41 can be between 5 mm and 6.35 mm.
The substrate 41 may include a plurality of holes 413 extending through two opposite surfaces 411 and 412 of the substrate 41. The abrasive particles 22 can be respectively disposed in the holes 413, and can be respectively attached to the substrate 41 via adhesive portions 416. Each abrasive particle 22 thereby attached can have a tip 421 protruding from the surface 411 of the substrate 41, and a remaining part entirely covered with the adhesive portion 416 inside the hole 413 of the substrate 41. In other words, the abrasive particles 22 partially protrude outward from the surface 411 of the substrate 41, but do not protrude from the surface 412 of the substrate 41.
Referring to
In the embodiment illustrated in
According to an embodiment, the holes 213 and the openings 212A and 211A may be formed by drilling into the substrate 21 with a machining tool. For example, step S110 can include drilling the larger hole section 215 and the opening 212A through the surface 212 of the substrate 21, and then drilling the smaller hole section 214 and the opening 211A through the surface 211 of the substrate 21. It will be appreciated that other techniques may be used for fabricating the substrate 21 with the holes 213 therein. For example, another embodiment may directly form the substrate 21 with the holes 213 by powder metallurgy, which can include pressing and sintering a metallic powder to form the substrate 21 with the holes 213 therein.
Referring to
Referring to
Referring to
It will be appreciated that steps S110, S120, S130 and S140 described herein may be likewise applied for fabricating the grinding tool 4 based on the substrate 41 provided with the holes 413. In this case, the substrate 41 with the holes 413 therein can be provided in initial step S110. For example, step S110 can include drilling the hole section 415 in the substrate 41, then drilling the hole section 417 connected with the hole section 415, and eventually drilling the hole section 414 communicating with the hole sections 415 and 417. The hole sections 415 and 414 thereby formed can respectively have the openings 412A and 411A on the two opposite surfaces 412 and 411 of the substrate 41. Subsequently, the abrasive particles 22 in step S120 can be respectively introduced through the openings 412A and placed in the holes 413 of the substrate 41. Step S130 then can be performed to properly position the abrasive particles 22 in the holes 413. Eventually, the adhesive portions 416 in step S140 can be respectively applied through the openings 412A into the holes 413 for fixedly attaching the abrasive particles 22 to the substrate 41.
According to an embodiment, the method steps may further include attaching the substrate 21 with the abrasive particles 22 affixed thereto to the base substrate 31 for forming the grinding tool 3 shown in
Advantages of the structures and method described herein include the ability to fabricate a grinding tool in a cost-effective manner. The grinding tool can include abrasive particles that are affixed to a substrate with adhesive portions substantially free of air voids, which can ensure reliable attachment of the abrasive particles.
Realizations of the grinding tool and its fabrication process have been described in the context of particular embodiments. These embodiments are meant to be illustrative and not limiting. Many variations, modifications, additions, and improvements are possible. These and other variations, modifications, additions, and improvements may fall within the scope of the inventions as defined in the claims that follow.
Number | Date | Country | Kind |
---|---|---|---|
106119428 | Jun 2017 | TW | national |