Gripper for semiconductor wafer housing cassette

Abstract

Description

FIG. 1 is a front view of a first embodiment of a gripper for a semiconductor wafer housing cassette showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a first perspective view thereof;

FIG. 8 is a second perspective view thereof;

FIG. 9 is an enlarged portion view labeled, “9,” in FIG. 8;

FIG. 10 is an enlarged portion view labeled “10,” in FIG. 8;

FIG. 11 is a perspective view of FIG. 1 shown in a used condition attached to the end of the robot arm shown in broken lines;

FIG. 12 is a front view of a second embodiment of a gripper for a semiconductor wafer housing cassette showing our new design;

FIG. 13 is a rear view thereof;

FIG. 14 is a right side view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a top view thereof;

FIG. 17 is a bottom view thereof;

FIG. 18 is a first perspective view thereof;

FIG. 19 is a second perspective view thereof;

FIG. 20 is an enlarged portion view labeled “20,” in FIG. 19;

FIG. 21 is an enlarged portion view labeled “21,” in FIG. 19; and,

FIG. 22 is a perspective view of FIG. 12 shown in a used condition attached to the end of a robot arm shown in broken lines.

The even dashed broken lines shown in the drawings represent portions of the gripper for the semiconductor wafer housing cassette that form no part of the claimed design. The long dashed and short dashed line indicates only a boundary between the claimed and unclaimed surface and forms no part of the claimed design.

Claims

The ornamental design for a gripper for a semiconductor wafer housing cassette, as shown and described.