Grounded electrode for a plasma processing apparatus

Information

  • Patent Grant
  • D556704
  • Patent Number
    D556,704
  • Date Filed
    Thursday, August 25, 2005
    18 years ago
  • Date Issued
    Tuesday, December 4, 2007
    16 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D13 158-177
    • D13 184
    • 204 286000
    • 204 297000
    • 205 118000
    • 205 123000
    • 200 0010R0
    • 200 0050R0
    • 200 0520R0
    • 200 315000
    • 200 310000
    • 200 0060A0
    • 200 302100
    • 200 308000
    • 200 314000
    • 200 317000
    • 200 0110R0
    • 200 0160B0
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of grounded electrode for a plasma processing apparatus showing our new design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a right side elevational view thereof;



FIG. 4 is a left side elevational view thereof;



FIG. 5 is a top plan elevational view thereof;



FIG. 6 is a rear elevational view thereof; and,



FIG. 7 is a bottom plan elevational view thereof.


Claims
  • The ornamental design for grounded electrode for a plasma processing apparatus, as shown.
US Referenced Citations (14)
Number Name Date Kind
D404370 Kimura Jan 1999 S
D404372 Ishii Jan 1999 S
D427570 Ishii Jul 2000 S
6495007 Wang Dec 2002 B2
6663762 Bleck et al. Dec 2003 B2
6749728 Wang Jun 2004 B2
D494551 Doba Aug 2004 S
D494552 Tezuka et al. Aug 2004 S
6843894 Berner et al. Jan 2005 B2
6908540 Kholodenko Jun 2005 B2
7025862 Herchen et al. Apr 2006 B2
7087144 Herchen Aug 2006 B2
7138039 Burkhart et al. Nov 2006 B2
20030066484 Morikage et al. Apr 2003 A1