Grounding ring of a process kit for semiconductor substrate processing

Abstract

Description

FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.

FIG. 2 is a bottom isometric view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a left elevation view thereof.

FIG. 6 is a right elevation view thereof.

FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,

FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

Claims

The ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.