Cadmium telluride (CdTe) is a Group IIB-VIA compound semiconductor with application in photovoltaics (PV). CdTe solar cells with near 20% conversion efficiency have been demonstrated in the laboratory and a solar module with 17% efficiency has also been fabricated. One of the biggest challenges for CdTe devices for effectively participating in the ever-growing PV market is the limited availability of tellurium (Te), which is a rare element. At the present time typical high efficiency CdTe solar cells have an absorber thickness of 3000-6000 nm. Assuming a 15% module efficiency, it has been calculated that the existing worldwide Te production would allow the CdTe technology manufacturing to be limited to below 10 GW/year. Considering the fact that the world PV market is expected to grow beyond 50 GW/year in just 2-3 years, limited Te availability is a serious setback for the CdTe technology. To address this issue, research groups have been working on approaches to reduce the thickness of the CdTe absorber of the device to around 1000 nm. However, reduction of the film thickness typically introduces problems such as pinhole generation and reduction in conversion efficiency. Also the thin absorber device structure requires the use of a near-intrinsic CdTe layer. As deposited CdTe layers may be obtained as near-intrinsic high resistivity films. However, the electronic properties of such as-deposited layers are inferior due to the low carrier lifetimes, which result from high density of defects in the as-deposited material. Post deposition process steps such as Cl treatment (chloride treatment) at elevated temperatures and p-type doping improve the electronic properties of thin CdTe layers, but at the same time, they lower the resistivity of the material away from the intrinsic state. Another issue in the prior art CdS/CdTe heterojunction solar cell structure is the rather large (about 10%) lattice mismatch at the hetero-interface or junction. Such mismatch reduces the efficiency of the solar cells and modules, especially during mass production. Therefore, there is great need to develop approaches in thin film solar module manufacturing that will reduce lattice mismatch at the junction of the devices, reduce the Te usage in the process and provide a material with good electronic properties.
As can be seen from
1) The CdSeyTe(1-y) absorber has an optical bandgap of 1.45-1.52 eV, which is very close to the bandgap of pure CdTe. This is a unique property of this material. Despite the fact that 70-80 percent of Te is replaced by Se, the bandgap of the new alloy containing Se still has a bandgap value of around 1.5 eV, which is equivalent to the bandgap value of CdTe. It should be noted that 1.5 eV is near the theoretically calculated bandgap value of a thin film absorber for the highest solar cell conversion efficiency, and therefore is very desirable. The bandgap of the CdSeyTe(1-y) material increases beyond 1.52 eV if the value of “y” is larger than 0.8, and it decreases from 1.45 eV to about 1.35 eV as the value of “y” is decreased from 0.7 to 0.4. Therefore, the compositions with x<0.7 and x>0.8 may not be desirable for high efficiency solar cell fabrication.
2) As a portion of the Te in CdTe is replaced by Se, the lattice constant of the material gets reduced. For example, the lattice constant of CdTe is about 6.48 angstroms, whereas the lattice constant of CdSe is about 6.05 angstroms. For compositions between CdTe and CdSe the lattice constant values vary between 6.48 and 6.05. For the prior art device structure of CdS/CdTe the lattice mismatch at the hetero-junction interface is about 10% considering the fact that the lattice constant of CdS is about 5.83 angstroms, i.e. lattice mismatch=(6.48-5.83)/6.48. For the CdSexS(1-x)/CdSeyTe(1-y), structures of the present inventions the lattice constant of CdSexS(1-x) may increase from about 5.83 to about 5.94 as x increases from 0 to 0.5, and the lattice constant of CdSeyTe(1-y) may range from about 6.18 to about 6.14 with y values ranging from 0.8 to 0.7, respectively. As a result, the lattice mismatch at the CdSexS(1-x)/CdSeyTe(1-y) junction of the present inventions may be greatly reduced, to a range of 3.2%-5.7%. This drastically reduced lattice mismatch in thin film solar cells increases device voltage and current and the conversion efficiency.
3) As a portion of the Te in the CdTe layer is replaced by Se, the electron effective mass in the material decreases. For example in CdTe the electron effective mass is about 0.195 m0, whereas in CdSe this value is about 0.15 m0, where m0 is true mass of electron (˜10−30 kg). For a CdSeyTe(1-y) absorber with “y” value between 0.7 and 0.8 the electron effective mass may be in the 0.155-0.16 m0 range. Lower electron effective mass compared to CdTe provides higher electron mobility and longer electron lifetime values in the CdSeyTe(1-y) absorber layer of the present inventions, and it results in improved solar cell efficiency.
4) In addition to the technical benefits listed above, replacement of 70-80% of the Te amount in a CdTe layer with a more abundant material, Se, provides a 3.5-5 times expansion possibility in the manufacturing volume. Whereas, only about 10 GW/year of manufacturing may be possible using the prior art CdTe absorbers due to the limited availability of Te, this manufacturing volume may be increased to 35-50 GW with the structure of the present inventions even if the absorber thickness and the efficiency of the device were left the same. It should be noted that the improved efficiency of the devices due to the technical factors listed above may increase the manufacturing volume well above the 50 GW/yr level.
5) As explained before, a highly attractive high efficiency CdTe device structure employs a CdTe layer with a thickness in the range of 700-1200 nm. Although, theoretical modeling demonstrated the possibility of near 20% device efficiency for such a cell, practical devices fabricated with this absorber thickness always yielded efficiency values less than those with thicker CdTe layers. One reason for this may be the fact that the thin CdTe device structure requires a near intrinsic absorber layer with good electronic properties such as a high (mobility*lifetime) product. The prior art CdTe aborbers may not be able to deliver these requirements. The CdSeyTe(1-y) absorber of the present inventions, on the other hand, provides these properties because: i) it has high carrier mobility and long carrier lifetime, therefore good electronic properties, and, ii) it can be made near-intrinsic because CdSe is easy to make n-type but very difficult to make p-type. CdTe, on the other hand may be doped p-type. Therefore, a solid solution of CdTe and CdSe, when doped with a p-type dopant may yield a material that has a higher resistivity (or near-intrinsic) and at the same time better electronic quality compared to CdTe under the same heat treatment and doping conditions. A high efficiency CdSexS(1-x)/CdSeyTe(1-y) device with a 700-1200 nm thick CdSeyTe(1-y) absorber layer may further increase the over 50 GW/yr manufacturing volume to well above 150 GW/yr.
Several different approaches may be used to form the CdSexS(1-x) and the CdSeyTe(1-y) layers of the present inventions. The CdSexS(1-x) layer may be formed by co-deposition of CdS and CdSe with the target ratio (CdSe/(CdS+CdSe) atomic ratio of less than or equal to 0.5) using methods such as chemical bath deposition, electrodeposition, atomic layer deposition, evaporation, sputtering, close space sublimation and vapor transport. A preferred method comprises formation of a CdS/CdSe or CdSe/CdS stack followed by a heat treatment, which causes diffusion between the CdS and the CdSe films and formation of the CdSexS(1-x) ternary solid solution. Another preferred method involves heat treatment of a CdS film in a Se vapor containing environment or heat treatment of a CdSe film in a S vapor containing environment. The CdSeyTe(1-y) layer may be formed by co-deposition of CdTe and CdSe with the target ratio (CdSe/(CdTe+CdSe) atomic ratio between 0.7 and 0.8) using methods such as chemical bath deposition, electrodeposition, evaporation, sputtering, close space sublimation, ink printing and vapor transport. A preferred method comprises formation of a CdTe/CdSe or CdSe/CdTe stack followed by a heat treatment, which causes diffusion between the CdTe and the CdSe films and formation of the CdSeyTe(i-y) ternary solid solution. It is also possible to heat treat a CdTe layer in a Se containing environment to cause Se diffusion into the material and formation of the solid solution or heat treat a CdSe layer to react it with a Te source such as a layer of Te.
An exemplary process flow to fabricate a solar cell comprising a thin film heterojunction device structure of the type CdSexS(1-x)/CdSeyTe(1-y), wherein x may range between 0 and 0.5 and y may range between 0.7 and 0.8 may comprise the steps of; i) deposition of a transparent conductive layer such as a transparent conductive oxide (TCO) film on a transparent superstrate such as glass; ii) deposition of a thin, preferably <200 nm, more preferably <100 nm thick, CdSexS(1-x) junction partner film over the transparent conductive layer; iii) deposition of a CdSeyTe(1-y) absorber layer, iv) heat treatment in presence of Cl, such as in presence of cadmium chloride in a temperature range of 350-450 C, v) doping using a dopant such as Cu and Sb by depositing a dopant source film over the absorber layer and driving in the dopant by heat treatment, and, vi) deposition of a back contact over the doped absorber layer.
A preferred process flow may comprise the steps of; i) deposition of a transparent conductive layer such as a transparent conductive oxide (TCO) film on a transparent sheet such as glass, ii) deposition of a thin, preferably <200 nm, more preferably <100 nm thick, CdSexS(1-x) junction partner film over the transparent conductive layer, iii) deposition of a stack comprising at least one sub-layer of CdSe and at least one sub-layer of CdTe with the targeted “y” value, iv) heat treatment in presence of Cl, such as in presence of cadmium chloride in a temperature range of 350-500 C, thus causing reaction and inter-diffusion between the sub-layers within the stack and forming a CdSeyTe(1-y) absorber layer, v) depositing a copper source, such as a copper selenide, copper telluride or a copper salt (such as copper halide) film, on the exposed surface of the CdSeyTe(1-y) absorber layer , vi) heat treating at a temperature range of 150-350 C, and vii) deposition of a back contact over the doped absorber layer.
In one preferred embodiment the thickness of the absorber layer may be in the range of 1500-3000 nm. In another preferred embodiment the thickness of the absorber layer may be in the range of 700-1200 nm.
Number | Date | Country | |
---|---|---|---|
61997565 | Jun 2014 | US |