1. Field of the Invention
The present invention relates to a guide used to direct the film or tape into the bonding area of a bonding apparatus.
2. Summary of Related Art
Polyurethanes (including polyurethaneureas) can be used as adhesives for various substrates, including textile fabrics. Typically, such polyurethanes are either fully formed non-reactive polymers or reactive isocyanate-terminated prepolymers. Typically, such polymers, when fully formed, are either dissolved in a solvent (solvent borne), dispersed in water (water borne), or processed as thermoplastic solid materials (hot melt). These dispersions may be formed into films or tapes which may be bonded to fabric.
Films or tapes used for bonding to fabric must be carefully fed into the bonding apparatus to ensure accurate placement on the substrate. Current commercial bonding apparatus lack the proper equipment to properly feed the tapes or films of the present invention. Thus, it is desirable to provide an improved guide for directing the film or tape into the bonding apparatus.
One aspect of the present invention provides a device useful as a guide for feeding polyurethane tapes or films into a bonding machine. The guide includes first and second curved plates each having an interior upper surface, an exterior lower surface, and a spacer having a rectangular prism configuration including an upper surface, a lower surface, a length, a width, and a thickness. The second curved plate is placed interior to the first curved plate with the spacer between the first and second plates such that the exterior lower surface of the second curved plate contacts the upper surface of the spacer and the interior upper surface of the first curved plate contacts the lower surface of the spacer and the width of the spacer is less than the width of the first curved plate and less than the width of the second curved plate.
Another aspect of the invention provides a method for feeding a tape to a bonding machine including passing a tape though the guide of some embodiments of the invention to a bonding machine.
The present invention will be described in the following detailed description with reference to the following drawings:
The guide of some embodiments includes a guide including first and second curved plates which are separated by a spacer. The guide permits a polyurethane tape or film to be fed through the guide to a bonding machine such as the SewSystems AT750 bonding machine (commercially available from Sew Systems, Leicester, United Kingdom).
As used herein, the term “mil” refers to one-thousandth of an inch, and the term “microinch” refers to one-millionth of an inch.
As shown in
The guide may include three general regions. The first region 11, has generally a rectangular configuration as shown from the top view of
The spacer 20 is shown in more detail in
The first curved plate of the guide, which in use would be closest to the fabric to which a tape or film is to be bonded has upper 1a and lower 1b surfaces. The lower surface would be closest to the fabric. These surfaces are also referred to as the interior and exterior surfaces, respectively, to denote the surface interior or exterior to the curve. The upper surface may have a roughness greater than the lower surface. For example the upper surface may have a roughness (RMS) of about 65 μin (microinches) to about 75 μin and the lower surface may be smoother, for example, from about 8 μin to about 12 μin. The first curved plate may have a length from about 3 in (inches) to about 4 in, specifically from about 3.1 in to about 3.3 in and a radius of curvature of at least about 3 in, specifically about 3 in or greater, more specifically of about 5 in or greater.
The second curved plate may have a radius of curvature greater than the radius of curvature of the first curved plate for example, at about 3 in or greater or about 5 in or greater. The length of the second curved plate is shorter than that of the first curved plate. For example the length may be from about 1.0 in to about 1.5 in, specifically from about 1.0 in to about 1.2 in. The roughness of the upper and lower surfaces of the second curved plate may be similar, for example, a roughness (RMS) of about of about 65 μin to about 75 μin. The second curved plate may have a first section 2c adjacent to the inlet of the guide and second section 2d adjacent to the outlet of the guide. The first section 2c may be substantially flat and form an obtuse angle with respect to the second section 2d which is curved.
A large variety of polyurethane tapes and films are useful with the guide of some embodiments. Examples of suitable tapes and films are disclosed in U.S. Pat. Nos. 4,387,181; 5,270,433; 5,563,208; 6,555,613; and 6,586,523 and U.S. Patent Publication Nos. 2004/001480 A1 and 2003/0220463 A1; and co-pending U.S. application Ser. No. 11/056,067 filed on Feb. 11, 2005; all of which are incorporated herein by reference.
The method of some embodiments includes the use of the guide described hereinabove to feed a polyurethane film or tape into a bonding apparatus to affix the film or tape to fabric.
Smoothness: Root Means Squared (RMS)
Surface texture is a measure of the distance between the peaks and valleys of a surface and typically expressed as a root means squared (RMS) of the value as defined in standard ASME B46.1-2002. A Sheffield Profilometer (commercially available from Avon Gear, Company, Rocheser Hills, Mich.) is a typical instrument for expressing such values.
Representative embodiments of the present invention will be described with reference to the following examples that illustrate the principles and practice of the present invention. In these examples:
A fabric was hemmed using a SewSystems AT750 bonding machine (commercially available from Sew Systems, Leicester, United Kingdom). The SewSystems standard chute (part # SS61212/1 Hemmer Chute) was used to hem the edges of a fabric using a polyurethane tape having a thickness of 6 mils. The hemming was unsuccessful as the tape did not travel through the SewSystems chute.
The method from comparative example 1 was used, however the standard SewSystems chute was modified. The chute was roughened using 90 grit aluminum oxide blasting for 30 seconds to give a surface roughness of 65-75 RMS. The tape did not pass though the chute smoothly and the hemming was unsuccessful.
In this example, the SewSystems bonding machine in combination with the inventive guide shown in
While the present invention has been described in an illustrative manner, it should be understood that the terminology used is intended to be in a nature of words or description rather than of limitation. Furthermore, while the present invention has been described in terms of several illustrative embodiments, it is to be appreciated that those skilled in the art will readily apply these teachings to other possible variations of the invention.
This application claims the benefit of U.S. Provisional Application No. 60/694,051, filed on Jun. 24, 2005, which is incorporated herein by reference in its entirety.
Number | Date | Country | |
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60694051 | Jun 2005 | US |