Information
-
Patent Grant
-
6354885
-
Patent Number
6,354,885
-
Date Filed
Monday, June 5, 200024 years ago
-
Date Issued
Tuesday, March 12, 200222 years ago
-
Inventors
-
Original Assignees
-
Examiners
Agents
- Lowe Hauptman Gilman & Berner, LLP
-
CPC
-
US Classifications
Field of Search
US
- 439 79
- 439 80
- 439 181
- 439 101
- 439 108
- 439 608
- 439 681
-
International Classifications
-
Abstract
The present invention is used in conjunction with two piece connector systems. The present invention provides an integral keying and an electrostatic discharge path. The daughtercard connector has at least two electrostatic discharge paths into an electrostatic discharge contact which then provides a path to a guide pin of the backpanel housing.
Description
FIELD OF THE INVENTION
The present invention relates generally to backpanel connectors and daughtercard connectors, and more particularly, to guide systems -including integral keying and having electrostatic discharge paths.
BACKGROUND OF THE INVENTION
Printed circuit boards and devices mounted on printed circuit boards can easily be adversely affected by electrostatic discharge. Connectors such as those disclosed in U.S. application Ser. No. 09/295,344 entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999, U.S. Pat. No. 6,179,663, can store electrostatic energy which is then dissipated onto the printed circuit board when the connectors are mounted thereon. The devices mounted on the printed circuit board can be damaged or otherwise adversely affected. Accordingly, a need exists in the art for a connector which can be used in conjunction with two piece connector systems to dissipate the electrostatic energy.
SUMMARY OF THE INVENTION
It is, therefore, an object of the present invention to provide a backpanel guide assembly and a daughtercard guide assembly having a key and a mating key receptacle to prevent non-matching daughtercard assemblies from mating with the backpanel assembly.
Another object of the present invention is to provide a backpanel guide assembly and a daughtercard guide assembly having a key and mating receptacle which can each be oriented in any one of a number of possible positions, therefore reducing the likelihood of a mating keying insert matching with a non-matching daughtercard assembly.
It is yet another object of the present invention to provide a backpanel guide assembly and a daughtercard guide assembly having mating keys, mating guides and at least one path for electrostatic discharge.
The present invention is used in conjunction with two piece connector systems. The present invention provides integral keying and an electrostatic discharge path. The daughtercard guide assembly has at least two electrostatic discharge paths into an electrostatic discharge contact which then provides a path to a guide pin of the backpanel housing.
These and other objects of the present invention are achieved by a guide module, including a backpanel guide assembly including a backpanel housing and a key oriented in one of a plurality of positions relative to the backpanel housing. A guide pin extends from the backpanel housing. A daughtercard guide assembly includes a mating key receptacle oriented in one of a plurality of possible positions for receiving the key and a guide hole for receiving the guide pin.
The foregoing and other objects of the present invention are achieved by an electrical connector, including a backpanel connector including a backpanel housing having a first electrically conductive pin and a second electrically conductive pin for engagement with a backpanel and a daughtercard connector. A daughtercard housing has a plurality of protrusions and an opening for receiving the guide pin. An electrically conductive post on the daughtercard housing is for engagement with a daughtercard. An electrically conductive stiffener is connected to the protrusions. A contact is mounted to the daughtercard connector for contact with the electrically conductive pin.
The foregoing and other objects of the present invention are achieved by a guide module, including a backpanel guide assembly including a backpanel housing and a key oriented in one of a plurality of possible positions relative to the backpanel housing and an electrically conductive guide pin. A second electrically conductive pin is for engagement with the backpanel. A daughtercard guide assembly includes a mating key receptacle oriented in one of a plurality of possible positions for receiving the key and a guide hole for receiving the guide pin. An opening in the daughtercard housing is for receiving the guide pin. An electrically conductive post is for engagement with a daughtercard. An electrically conductive stiffener is connected to the protrusion. A contact is mounted to the daughtercard guide assembly for contact with the electrically conductive pin.
Still other objects and advantages of the present invention will become readily apparent to those skilled in the art from the following detailed description, wherein the preferred embodiments of the invention are shown and described, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings and description thereof are to be regarded as illustrative in nature, and not as restrictive.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example, and not by limitation, in the figures of the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout and wherein:
FIG. 1
is a perspective view of a backpanel guide assembly and a daughtercard guide assembly according to the present invention;
FIG. 2
is a view similar to
FIG. 1
with the backpanel guide assembly and daughtercard guide assembly shown partially in cross-section;
FIGS. 3A
,
3
B and
3
C are top, front and side elevational views of the daughtercard guide assembly according to the present invention; and
FIGS. 4A
,
4
B and
4
C are top, front and right elevational views of the backpanel guide assembly according to the present invention;
FIG. 5
is a flow diagram of the electrostatic discharge (ESD) path;
FIG. 6
is a side elevational illustration of a module heel used to align the stiffener;.
FIG. 7
is a perspective view of the module heel of
FIG. 6
;
FIG. 8
is a perspective illustration, partially cut away, of an ESD core;
FIG. 9
is a perspective view of an ESD contact;
FIG. 10
is a perspective view partially cut away, of the locking feature for locking the ESD contact into the housing; and
FIGS. 11-13
are alternative embodiments according to the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
Referring first to
FIGS. 1 and 2
, a set of mating guide modules generally depicted at
20
, is depicted according to the present invention. As illustrated in
FIGS. 1 and 2
, the guide modules
20
are illustrated in a horizontal position although it should be understood that the guide modules
20
are usable in any orientation and accordingly, terms such as “left”, “right”, “above” and “below” are to be construed in the relative sense.
The guide modules
20
include a backpanel guide assembly
30
and a daughtercard assembly
40
. Although a backpanel and a daughtercard are described herein for illustrative purposes, it should be understood that the present invention is applicable to any type of printed circuit board. These guide assemblies
30
,
40
can be incorporated into any two piece connector system such as that disclosed in U.S. application Ser. No. 09/295,344, entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999, U.S. Pat. No. 6,179,663, which is assigned to the instant assignee and is hereby incorporated by reference into this specification in its entirety.
As depicted in
FIG. 1
, the backpanel guide assembly
30
includes a backpanel housing
32
which is mounted to a backpanel such as a printed circuit board (PCB)
34
. Extending forwardly from the backpanel housing
32
is a cylindrical guide pin
36
. On opposite sides of a key
50
(
FIG. 2
) are protective wings
37
and
38
which prevent the key
50
from being damaged or dislodged during the assembly process (see also FIG.
4
A). As depicted in
FIG. 4B
, the key
50
has a D-shaped cross-section. The shape of the key
50
contributes to the ability of the guide system
20
to prevent non-matching daughtercard guide assemblies
40
from mating with the backpanel guide assembly
30
.
As depicted in
FIG. 2
, an octagonal base
70
mates with an octagonal core
86
in the backpanel housing
32
. The combination of the octagonal core in the backpanel housing and the octagonal base allowed the key
50
to be positioned in any one of eight possible positions. Of course, any number of positions is possible. The key
50
mates with a mating keying insert
90
which is in the daughtercard guide assembly
40
.
As depicted in
FIGS. 1 and 4C
, there is a dual-purpose retention post
60
extending rearwardly from the backpanel housing
32
and a dual-purpose alignment post
62
also extending rearwardly from the backpanel housing
32
. The post
60
is aligned with and coaxial with the key
50
. The post
62
is coaxial with and aligned with the guide pin
36
. The post
60
both locates the backpanel guide assembly
30
and retains the backpanel guide assembly
30
in the printed circuit board
34
. There is an interference fit between the post
60
and the printed circuit board hole
74
which retains the backpanel guide assembly
30
. Advantageously, this post
60
eliminates the need to work from the underside of the printed circuit board
34
during installation (e.g., to screw in mounting screws). The post
62
aligns the backpanel guide assembly
30
in the hole
76
and prevents rotation of the backpanel guide assembly
30
relative to the printed circuit board
34
. The post
62
has a 2-point contact with the PCB plated through hole
76
which forms an electrical connection along the electrostatic discharge (ESD) paths as will be described in greater detail below. The pin
36
also serves a dual purpose. The guide pin
36
and a mating hole
80
locate the daughtercard assembly
40
relative to the backpanel guide assembly
30
. The pin
36
has a cone-shaped tip
82
which improves the guide system's
20
ability to locate the connectors
30
,
40
. The guide pin
36
is also a component of the electrostatic discharge path.
The backpanel housing
32
has a key retention hole
84
which is used to retain the key
50
using an interference fit. The backpanel housing
32
has an octagonal core
86
aligned with key retention hole
84
. The core
86
mates with the octagonal base
70
of the key. These two octagonal shapes clock the key
50
in any one of eight possible positions. Advantageously, the key
50
and mating keying insert
90
prevent non-matching daughtercard guide assemblies
40
from mating with the backpanel guide assembly
30
. Letters A through H identify the orientation of the key as depicted in FIG.
4
B. The explicit identification simplifies both the assembly process and the subsequent interpretation of the position of the key
50
. Incorporation of the letters into the housing
32
saves the cost of an additional marking or labeling operation.
The protective wings
37
,
38
prevent the key
50
from being dislodged or damaged. The backpanel housing
32
is a die cast part which provides robustness and strength. The metal material used for the housing allows the housing to function as an electrostatic discharge device.
As depicted in
FIG. 2
, the key
50
has a rear retention rib section
92
which retains the key
50
in the key retention hole via an interference fit. The octagonal base
70
mates with the octagonal core
86
of the backpanel housing
32
. These two shapes clock the key
50
into any one of eight possible positions. The key
50
and the mating keying insert
90
prevent non-matching, daughtercard guide assemblies
40
from mating with the backpanel guide assembly
30
.
As depicted in
FIG. 2
, the daughtercard housing
42
includes a downwardly extending dual-purpose retention post
100
(see FIG.
3
C). This post
100
both locates the guide assembly
40
and retains it in the printed circuit board
44
. The interference between the post
100
and the PCB hole retains the daughtercard guide assembly
40
. A dual purpose alignment post
102
extends downwardly from the daughtercard housing
42
. This post
102
(see also
FIG. 3C
) aligns the daughtercard guide assembly
40
and prevents rotation of the assembly on the printed circuit board
44
. The 2-point contact with the printed circuit board through hole is an electrical connection along the electrostatic discharge (ESD) path.
As depicted in
FIGS. 1 and 3A
, a plurality of protrusions
110
,
112
extend upwardly from the daughtercard housing
42
. These protrusions
110
,
112
function both mechanically and electrically. Mechanically, the shape of the protrusions
110
,
112
and mating stiffener slots
114
,
116
in stiffener
46
align the housing
42
relative to other pin and socket connectors such as those disclosed in U.S. application Ser. No. 09/295,344 entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999. The protrusions
110
,
112
are then deformed during the assembly process, thereby fastening the daughtercard guide housing
42
to stiffener
46
. Electrically the contact between protrusions
110
,
112
and the stiffener
46
are connections along the electrostatic discharge path. A cylindrical positioning post
122
extends rearwardly from the housing
42
and locks the daughtercard guide housing
42
into position on the stiffener
46
, thereby improving the robustness of the stiffener
46
attachment. The positioning post
122
may also be staked to the stiffener
46
to enhance the retention. The guide hole
80
and mating pin
36
of the backpanel guide assembly
30
locate the daughtercard guide assembly
40
relative to the backpanel guide assembly
30
. The keying insert position identification uses letters A through H to identify the orientation of the keying insert (FIG.
3
B). The explicit identification simplifies both the assembly process and subsequent interpretation of the position of the insert
90
. The incorporation of letters into the housing
42
saves the cost of an additional marking or labeling operation. A shoulder support
210
provides additional support for the daughtercard assembly
40
during the connector mating process. A dual-purpose core
130
(see
FIGS. 8
,
9
and
10
) has both a mechanical function and an electrical function. Mechanically, the core
130
mates with an ESD contact generally indicated at
150
, locking it into place and preventing it from dislodging. This occurs due to bending of flexible leg sections
162
and the locking of angled portions
160
into mating sections in the housing
42
. Electrically, the interference fit between the core
130
and the contact
150
provides a 2-point connection along the ESD path. A module heel
300
is a protrusion of the housing
42
which sits under the stiffener
46
and fits closely to the stiffener's vertical section to enhance alignment of the housing
42
(see FIGS.
6
and
7
). The daughtercard housing
42
is a die cast part which provides strength and robustness. The metal material allows the housing to function for ESD.
As depicted in
FIGS. 1 and 2
, the key insert
90
has a D-shaped through hole
170
which contributes to the guide system's ability to prevent non-matching daughtercard assemblies from mating with the backpanel assembly. Failure to prevent incorrect mating can disadvantageously result in significant time and cost spent on rework. A positioning arrow
172
for the insert further simplifies the assembly process and subsequent interpretation of the position of the insert
90
. The incorporation of the arrow
172
into the insert
90
saves the cost of an additional marking or labeling operation.
As depicted in
FIG. 2
, a pair of horizontally extending outer beams
200
flex inwardly during the contact assembly
150
into the daughtercard housing
42
. When the contact
150
is in place, the beams
200
spring back to their original position, locking the contact
150
in place and preventing the contact
150
from being dislodged during handling and the connector mating process. A compliant center beam
212
extends between the pair of horizontally extending outer beams
200
. The compliant center beam
212
is a flexing member that contacts with the guide pin
36
of the backpanel guide assembly
30
when the guide pin
36
is inserted into the mating hole
80
. This contact point is a connection along the ESD path. There are two dual-purpose interference bumps
220
as depicted in
FIG. 2
which function both mechanically and electrically. Mechanically the interference bumps
220
anchor the ESD contact
150
in the core
130
of the daughtercard housing
42
and help to control the action of the center beam
212
. Electrically the interference fit between the bumps
220
and the daughtercard housing core
130
provides a 2-point connection along the ESD path.
The need for the ESD contact
150
is to ensure continuous reliable electrical path for discharge. The system would still serve as an initial electrostatic discharge path without the contact
150
. The ESD contact
150
guarantees continuous stable electrical path during operation and since the daughtercard guide housing is attached to stiffener, mechanically and electrically, these items combined also form an EMI shield over the daughtercard signal contact tails.
FIG. 11
illustrates an alternative reverse gender arrangement where the guide pin module is on the daughtercard and the guide receptacle module is on the backpanel.
FIG. 12
illustrates another alternative arrangement where two daughtercard connectors (where the printed circuit boards are parallel) in the same plane each require a stiffener.
FIG. 13
illustrates yet another alternative arrangement where two backpanel connectors are oriented parallel to each other in different planes.
It should now be apparent that a guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems has been disclosed. At least two paths have been disclosed through the daughtercard connector to the backpanel connector.
It will be readily seen by one of ordinary skill in the art that the present invention fulfills all of the objects set forth above. After reading the foregoing specification, one of ordinary skill will be able to affect various changes, substitutions of equivalents and various other aspects of the invention as broadly disclosed herein. It is therefore intended that the protection granted hereon be limited only by the definition contained in the appended claims and equivalents thereof.
Claims
- 1. A guide module, comprising:a backpanel guide assembly including a backpanel housing; a key oriented relative to said backpanel housing in one of a first plurality of positions; a first alignment post extending from said backpanel housing for electrical connection with a plated hole in a backpanel; and an electrically conductive guide pin extending from said backpanel housing; a daughtercard guide assembly including a daughtercard housing, a mating key receptacle oriented relative to said daughtercard housing in one of a second plurality of possible positions corresponding to the first positions for receiving said key; a second alignment post extending from said daughtercard housing for electrical connection with a plated hole in a daughtercard; and a guide hole for receiving said guide pin; and a contact mounted to said daughtercard housing for contact with said guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second alignment post to said contact to said guide pin to said first alignment post to the backpanel; and wherein a second electrostatic discharge path is formed from said daughtercard housing to said contact to said guide pin to said first alignment post to the backpanel.
- 2. The guide module of claim 1, wherein the first alignment post is an end of said guide pin.
- 3. The guide module of claim 1, wherein a portion of said key has a D-shape cross-section.
- 4. The guide module of claim 1, further comprising protective wings extending from said backpanel housing and located on opposite sides of said key.
- 5. The guide module of claim 1, further comprising indicators for identifying the positions of said key and said mating key receptacle.
- 6. The guide module of claim 1, further comprising a retention post extending downwardly from said daughtercard housing for interference fit with a corresponding hole in the daughtercard.
- 7. The guide module of claim 1, wherein said backpanel housing includes a multi-sided opening and said key has a multi-sided base corresponding in shape to said multi-sided opening.
- 8. The guide module of claim 7, wherein said multi-sided opening has an octagonal shape.
- 9. The guide module of claim 1, further comprising a retention post extending rearwardly from said backpanel housing for interference fit with a corresponding hole in the backpanel.
- 10. The guide module of claim 9, wherein the retention post is coaxial and aligned with said guide pin.
- 11. An electrical connector, comprising:a backpanel connector including a backpanel housing having an electrically conductive guide pin and a first electrically conductive post for engagement with a backpanel; and a daughtercard connector including: a daughtercard housing having an opening for receiving said guide pin, and a second electrically conductive post for engagement with a daughtercard; a stiffener connected to said daughtercard housing; and a contact mounted to said daughtercard housing for contact with said electrically conductive guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second electrically conductive post to said contact to said guide pin to said first electrically conductive post to the backpanel; and wherein a second electrostatic discharge path is formed from said stiffener to said contact to said guide pin to said first electrically conductive post to the backpanel.
- 12. The guide module of claim 11, wherein said contact is formed as a separate piece including a pair of parallel side beams and a central beam, the side beams resiliently mate with a core of said daughtercard housing while the central beam resiliently contacts with said guide pin.
- 13. The guide module of claim 11, wherein said daughtercard housing has a plurality of protrusions, said stiffener has a plurality of mating slots corresponding to said protrusions, said protrusions are deformable and thus receivable within the mating slots of said stiffener thereby fastening said stiffener to said daughtercard housing.
- 14. The guide module of claim 15, wherein said stiffener extends circumferentially of said daughtercard housing and has first and second longitudinally spaced end portions, the first end portion is connected to said daughtercard housing via said protrusions, the second end portion is connected to said daughtercard housing via a positioning post extending outwardly from said daughtercard housing.
- 15. A guide module, comprisinga backpanel guide assembly including a backpanel housing, a key oriented in one of a first plurality of possible positions relative to said backpanel housing, an electrically conductive guide pin, and a first electrically conductive post for engagement with a backpanel; a daughtercard guide assembly including a plurality of protrusions, a mating key receptacle oriented in one of a second plurality of possible positions corresponding to the first positions for receiving said key, a guide hole for receiving said guide pin, and a second electrically conductive post for engagement with a daughtercard; a stiffener connected to said protrusions; and a contact mounted to said daughtercard guide assembly for contact with said electrically conductive guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second electrically conductive post to said contact to said guide pin to said first electrically conductive post to the backpanel; and wherein a second electrostatic discharge path is formed from said stiffener to said protrusions to said contact to said guide pin to said first electrically conductive post to the backpanel.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
3914978 |
May 1989 |
DE |
0726477 |
Jan 1996 |
EP |