Guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems

Information

  • Patent Grant
  • 6354885
  • Patent Number
    6,354,885
  • Date Filed
    Monday, June 5, 2000
    24 years ago
  • Date Issued
    Tuesday, March 12, 2002
    22 years ago
Abstract
The present invention is used in conjunction with two piece connector systems. The present invention provides an integral keying and an electrostatic discharge path. The daughtercard connector has at least two electrostatic discharge paths into an electrostatic discharge contact which then provides a path to a guide pin of the backpanel housing.
Description




FIELD OF THE INVENTION




The present invention relates generally to backpanel connectors and daughtercard connectors, and more particularly, to guide systems -including integral keying and having electrostatic discharge paths.




BACKGROUND OF THE INVENTION




Printed circuit boards and devices mounted on printed circuit boards can easily be adversely affected by electrostatic discharge. Connectors such as those disclosed in U.S. application Ser. No. 09/295,344 entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999, U.S. Pat. No. 6,179,663, can store electrostatic energy which is then dissipated onto the printed circuit board when the connectors are mounted thereon. The devices mounted on the printed circuit board can be damaged or otherwise adversely affected. Accordingly, a need exists in the art for a connector which can be used in conjunction with two piece connector systems to dissipate the electrostatic energy.




SUMMARY OF THE INVENTION




It is, therefore, an object of the present invention to provide a backpanel guide assembly and a daughtercard guide assembly having a key and a mating key receptacle to prevent non-matching daughtercard assemblies from mating with the backpanel assembly.




Another object of the present invention is to provide a backpanel guide assembly and a daughtercard guide assembly having a key and mating receptacle which can each be oriented in any one of a number of possible positions, therefore reducing the likelihood of a mating keying insert matching with a non-matching daughtercard assembly.




It is yet another object of the present invention to provide a backpanel guide assembly and a daughtercard guide assembly having mating keys, mating guides and at least one path for electrostatic discharge.




The present invention is used in conjunction with two piece connector systems. The present invention provides integral keying and an electrostatic discharge path. The daughtercard guide assembly has at least two electrostatic discharge paths into an electrostatic discharge contact which then provides a path to a guide pin of the backpanel housing.




These and other objects of the present invention are achieved by a guide module, including a backpanel guide assembly including a backpanel housing and a key oriented in one of a plurality of positions relative to the backpanel housing. A guide pin extends from the backpanel housing. A daughtercard guide assembly includes a mating key receptacle oriented in one of a plurality of possible positions for receiving the key and a guide hole for receiving the guide pin.




The foregoing and other objects of the present invention are achieved by an electrical connector, including a backpanel connector including a backpanel housing having a first electrically conductive pin and a second electrically conductive pin for engagement with a backpanel and a daughtercard connector. A daughtercard housing has a plurality of protrusions and an opening for receiving the guide pin. An electrically conductive post on the daughtercard housing is for engagement with a daughtercard. An electrically conductive stiffener is connected to the protrusions. A contact is mounted to the daughtercard connector for contact with the electrically conductive pin.




The foregoing and other objects of the present invention are achieved by a guide module, including a backpanel guide assembly including a backpanel housing and a key oriented in one of a plurality of possible positions relative to the backpanel housing and an electrically conductive guide pin. A second electrically conductive pin is for engagement with the backpanel. A daughtercard guide assembly includes a mating key receptacle oriented in one of a plurality of possible positions for receiving the key and a guide hole for receiving the guide pin. An opening in the daughtercard housing is for receiving the guide pin. An electrically conductive post is for engagement with a daughtercard. An electrically conductive stiffener is connected to the protrusion. A contact is mounted to the daughtercard guide assembly for contact with the electrically conductive pin.




Still other objects and advantages of the present invention will become readily apparent to those skilled in the art from the following detailed description, wherein the preferred embodiments of the invention are shown and described, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings and description thereof are to be regarded as illustrative in nature, and not as restrictive.











BRIEF DESCRIPTION OF THE DRAWINGS




The present invention is illustrated by way of example, and not by limitation, in the figures of the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout and wherein:





FIG. 1

is a perspective view of a backpanel guide assembly and a daughtercard guide assembly according to the present invention;





FIG. 2

is a view similar to

FIG. 1

with the backpanel guide assembly and daughtercard guide assembly shown partially in cross-section;





FIGS. 3A

,


3


B and


3


C are top, front and side elevational views of the daughtercard guide assembly according to the present invention; and





FIGS. 4A

,


4


B and


4


C are top, front and right elevational views of the backpanel guide assembly according to the present invention;





FIG. 5

is a flow diagram of the electrostatic discharge (ESD) path;





FIG. 6

is a side elevational illustration of a module heel used to align the stiffener;.





FIG. 7

is a perspective view of the module heel of

FIG. 6

;





FIG. 8

is a perspective illustration, partially cut away, of an ESD core;





FIG. 9

is a perspective view of an ESD contact;





FIG. 10

is a perspective view partially cut away, of the locking feature for locking the ESD contact into the housing; and





FIGS. 11-13

are alternative embodiments according to the present invention.











BEST MODE FOR CARRYING OUT THE INVENTION




Referring first to

FIGS. 1 and 2

, a set of mating guide modules generally depicted at


20


, is depicted according to the present invention. As illustrated in

FIGS. 1 and 2

, the guide modules


20


are illustrated in a horizontal position although it should be understood that the guide modules


20


are usable in any orientation and accordingly, terms such as “left”, “right”, “above” and “below” are to be construed in the relative sense.




The guide modules


20


include a backpanel guide assembly


30


and a daughtercard assembly


40


. Although a backpanel and a daughtercard are described herein for illustrative purposes, it should be understood that the present invention is applicable to any type of printed circuit board. These guide assemblies


30


,


40


can be incorporated into any two piece connector system such as that disclosed in U.S. application Ser. No. 09/295,344, entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999, U.S. Pat. No. 6,179,663, which is assigned to the instant assignee and is hereby incorporated by reference into this specification in its entirety.




As depicted in

FIG. 1

, the backpanel guide assembly


30


includes a backpanel housing


32


which is mounted to a backpanel such as a printed circuit board (PCB)


34


. Extending forwardly from the backpanel housing


32


is a cylindrical guide pin


36


. On opposite sides of a key


50


(

FIG. 2

) are protective wings


37


and


38


which prevent the key


50


from being damaged or dislodged during the assembly process (see also FIG.


4


A). As depicted in

FIG. 4B

, the key


50


has a D-shaped cross-section. The shape of the key


50


contributes to the ability of the guide system


20


to prevent non-matching daughtercard guide assemblies


40


from mating with the backpanel guide assembly


30


.




As depicted in

FIG. 2

, an octagonal base


70


mates with an octagonal core


86


in the backpanel housing


32


. The combination of the octagonal core in the backpanel housing and the octagonal base allowed the key


50


to be positioned in any one of eight possible positions. Of course, any number of positions is possible. The key


50


mates with a mating keying insert


90


which is in the daughtercard guide assembly


40


.




As depicted in

FIGS. 1 and 4C

, there is a dual-purpose retention post


60


extending rearwardly from the backpanel housing


32


and a dual-purpose alignment post


62


also extending rearwardly from the backpanel housing


32


. The post


60


is aligned with and coaxial with the key


50


. The post


62


is coaxial with and aligned with the guide pin


36


. The post


60


both locates the backpanel guide assembly


30


and retains the backpanel guide assembly


30


in the printed circuit board


34


. There is an interference fit between the post


60


and the printed circuit board hole


74


which retains the backpanel guide assembly


30


. Advantageously, this post


60


eliminates the need to work from the underside of the printed circuit board


34


during installation (e.g., to screw in mounting screws). The post


62


aligns the backpanel guide assembly


30


in the hole


76


and prevents rotation of the backpanel guide assembly


30


relative to the printed circuit board


34


. The post


62


has a 2-point contact with the PCB plated through hole


76


which forms an electrical connection along the electrostatic discharge (ESD) paths as will be described in greater detail below. The pin


36


also serves a dual purpose. The guide pin


36


and a mating hole


80


locate the daughtercard assembly


40


relative to the backpanel guide assembly


30


. The pin


36


has a cone-shaped tip


82


which improves the guide system's


20


ability to locate the connectors


30


,


40


. The guide pin


36


is also a component of the electrostatic discharge path.




The backpanel housing


32


has a key retention hole


84


which is used to retain the key


50


using an interference fit. The backpanel housing


32


has an octagonal core


86


aligned with key retention hole


84


. The core


86


mates with the octagonal base


70


of the key. These two octagonal shapes clock the key


50


in any one of eight possible positions. Advantageously, the key


50


and mating keying insert


90


prevent non-matching daughtercard guide assemblies


40


from mating with the backpanel guide assembly


30


. Letters A through H identify the orientation of the key as depicted in FIG.


4


B. The explicit identification simplifies both the assembly process and the subsequent interpretation of the position of the key


50


. Incorporation of the letters into the housing


32


saves the cost of an additional marking or labeling operation.




The protective wings


37


,


38


prevent the key


50


from being dislodged or damaged. The backpanel housing


32


is a die cast part which provides robustness and strength. The metal material used for the housing allows the housing to function as an electrostatic discharge device.




As depicted in

FIG. 2

, the key


50


has a rear retention rib section


92


which retains the key


50


in the key retention hole via an interference fit. The octagonal base


70


mates with the octagonal core


86


of the backpanel housing


32


. These two shapes clock the key


50


into any one of eight possible positions. The key


50


and the mating keying insert


90


prevent non-matching, daughtercard guide assemblies


40


from mating with the backpanel guide assembly


30


.




As depicted in

FIG. 2

, the daughtercard housing


42


includes a downwardly extending dual-purpose retention post


100


(see FIG.


3


C). This post


100


both locates the guide assembly


40


and retains it in the printed circuit board


44


. The interference between the post


100


and the PCB hole retains the daughtercard guide assembly


40


. A dual purpose alignment post


102


extends downwardly from the daughtercard housing


42


. This post


102


(see also

FIG. 3C

) aligns the daughtercard guide assembly


40


and prevents rotation of the assembly on the printed circuit board


44


. The 2-point contact with the printed circuit board through hole is an electrical connection along the electrostatic discharge (ESD) path.




As depicted in

FIGS. 1 and 3A

, a plurality of protrusions


110


,


112


extend upwardly from the daughtercard housing


42


. These protrusions


110


,


112


function both mechanically and electrically. Mechanically, the shape of the protrusions


110


,


112


and mating stiffener slots


114


,


116


in stiffener


46


align the housing


42


relative to other pin and socket connectors such as those disclosed in U.S. application Ser. No. 09/295,344 entitled “HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY”, filed Apr. 21, 1999. The protrusions


110


,


112


are then deformed during the assembly process, thereby fastening the daughtercard guide housing


42


to stiffener


46


. Electrically the contact between protrusions


110


,


112


and the stiffener


46


are connections along the electrostatic discharge path. A cylindrical positioning post


122


extends rearwardly from the housing


42


and locks the daughtercard guide housing


42


into position on the stiffener


46


, thereby improving the robustness of the stiffener


46


attachment. The positioning post


122


may also be staked to the stiffener


46


to enhance the retention. The guide hole


80


and mating pin


36


of the backpanel guide assembly


30


locate the daughtercard guide assembly


40


relative to the backpanel guide assembly


30


. The keying insert position identification uses letters A through H to identify the orientation of the keying insert (FIG.


3


B). The explicit identification simplifies both the assembly process and subsequent interpretation of the position of the insert


90


. The incorporation of letters into the housing


42


saves the cost of an additional marking or labeling operation. A shoulder support


210


provides additional support for the daughtercard assembly


40


during the connector mating process. A dual-purpose core


130


(see

FIGS. 8

,


9


and


10


) has both a mechanical function and an electrical function. Mechanically, the core


130


mates with an ESD contact generally indicated at


150


, locking it into place and preventing it from dislodging. This occurs due to bending of flexible leg sections


162


and the locking of angled portions


160


into mating sections in the housing


42


. Electrically, the interference fit between the core


130


and the contact


150


provides a 2-point connection along the ESD path. A module heel


300


is a protrusion of the housing


42


which sits under the stiffener


46


and fits closely to the stiffener's vertical section to enhance alignment of the housing


42


(see FIGS.


6


and


7


). The daughtercard housing


42


is a die cast part which provides strength and robustness. The metal material allows the housing to function for ESD.




As depicted in

FIGS. 1 and 2

, the key insert


90


has a D-shaped through hole


170


which contributes to the guide system's ability to prevent non-matching daughtercard assemblies from mating with the backpanel assembly. Failure to prevent incorrect mating can disadvantageously result in significant time and cost spent on rework. A positioning arrow


172


for the insert further simplifies the assembly process and subsequent interpretation of the position of the insert


90


. The incorporation of the arrow


172


into the insert


90


saves the cost of an additional marking or labeling operation.




As depicted in

FIG. 2

, a pair of horizontally extending outer beams


200


flex inwardly during the contact assembly


150


into the daughtercard housing


42


. When the contact


150


is in place, the beams


200


spring back to their original position, locking the contact


150


in place and preventing the contact


150


from being dislodged during handling and the connector mating process. A compliant center beam


212


extends between the pair of horizontally extending outer beams


200


. The compliant center beam


212


is a flexing member that contacts with the guide pin


36


of the backpanel guide assembly


30


when the guide pin


36


is inserted into the mating hole


80


. This contact point is a connection along the ESD path. There are two dual-purpose interference bumps


220


as depicted in

FIG. 2

which function both mechanically and electrically. Mechanically the interference bumps


220


anchor the ESD contact


150


in the core


130


of the daughtercard housing


42


and help to control the action of the center beam


212


. Electrically the interference fit between the bumps


220


and the daughtercard housing core


130


provides a 2-point connection along the ESD path.




The need for the ESD contact


150


is to ensure continuous reliable electrical path for discharge. The system would still serve as an initial electrostatic discharge path without the contact


150


. The ESD contact


150


guarantees continuous stable electrical path during operation and since the daughtercard guide housing is attached to stiffener, mechanically and electrically, these items combined also form an EMI shield over the daughtercard signal contact tails.





FIG. 11

illustrates an alternative reverse gender arrangement where the guide pin module is on the daughtercard and the guide receptacle module is on the backpanel.





FIG. 12

illustrates another alternative arrangement where two daughtercard connectors (where the printed circuit boards are parallel) in the same plane each require a stiffener.





FIG. 13

illustrates yet another alternative arrangement where two backpanel connectors are oriented parallel to each other in different planes.




It should now be apparent that a guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems has been disclosed. At least two paths have been disclosed through the daughtercard connector to the backpanel connector.




It will be readily seen by one of ordinary skill in the art that the present invention fulfills all of the objects set forth above. After reading the foregoing specification, one of ordinary skill will be able to affect various changes, substitutions of equivalents and various other aspects of the invention as broadly disclosed herein. It is therefore intended that the protection granted hereon be limited only by the definition contained in the appended claims and equivalents thereof.



Claims
  • 1. A guide module, comprising:a backpanel guide assembly including a backpanel housing; a key oriented relative to said backpanel housing in one of a first plurality of positions; a first alignment post extending from said backpanel housing for electrical connection with a plated hole in a backpanel; and an electrically conductive guide pin extending from said backpanel housing; a daughtercard guide assembly including a daughtercard housing, a mating key receptacle oriented relative to said daughtercard housing in one of a second plurality of possible positions corresponding to the first positions for receiving said key; a second alignment post extending from said daughtercard housing for electrical connection with a plated hole in a daughtercard; and a guide hole for receiving said guide pin; and a contact mounted to said daughtercard housing for contact with said guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second alignment post to said contact to said guide pin to said first alignment post to the backpanel; and wherein a second electrostatic discharge path is formed from said daughtercard housing to said contact to said guide pin to said first alignment post to the backpanel.
  • 2. The guide module of claim 1, wherein the first alignment post is an end of said guide pin.
  • 3. The guide module of claim 1, wherein a portion of said key has a D-shape cross-section.
  • 4. The guide module of claim 1, further comprising protective wings extending from said backpanel housing and located on opposite sides of said key.
  • 5. The guide module of claim 1, further comprising indicators for identifying the positions of said key and said mating key receptacle.
  • 6. The guide module of claim 1, further comprising a retention post extending downwardly from said daughtercard housing for interference fit with a corresponding hole in the daughtercard.
  • 7. The guide module of claim 1, wherein said backpanel housing includes a multi-sided opening and said key has a multi-sided base corresponding in shape to said multi-sided opening.
  • 8. The guide module of claim 7, wherein said multi-sided opening has an octagonal shape.
  • 9. The guide module of claim 1, further comprising a retention post extending rearwardly from said backpanel housing for interference fit with a corresponding hole in the backpanel.
  • 10. The guide module of claim 9, wherein the retention post is coaxial and aligned with said guide pin.
  • 11. An electrical connector, comprising:a backpanel connector including a backpanel housing having an electrically conductive guide pin and a first electrically conductive post for engagement with a backpanel; and a daughtercard connector including: a daughtercard housing having an opening for receiving said guide pin, and a second electrically conductive post for engagement with a daughtercard; a stiffener connected to said daughtercard housing; and a contact mounted to said daughtercard housing for contact with said electrically conductive guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second electrically conductive post to said contact to said guide pin to said first electrically conductive post to the backpanel; and wherein a second electrostatic discharge path is formed from said stiffener to said contact to said guide pin to said first electrically conductive post to the backpanel.
  • 12. The guide module of claim 11, wherein said contact is formed as a separate piece including a pair of parallel side beams and a central beam, the side beams resiliently mate with a core of said daughtercard housing while the central beam resiliently contacts with said guide pin.
  • 13. The guide module of claim 11, wherein said daughtercard housing has a plurality of protrusions, said stiffener has a plurality of mating slots corresponding to said protrusions, said protrusions are deformable and thus receivable within the mating slots of said stiffener thereby fastening said stiffener to said daughtercard housing.
  • 14. The guide module of claim 15, wherein said stiffener extends circumferentially of said daughtercard housing and has first and second longitudinally spaced end portions, the first end portion is connected to said daughtercard housing via said protrusions, the second end portion is connected to said daughtercard housing via a positioning post extending outwardly from said daughtercard housing.
  • 15. A guide module, comprisinga backpanel guide assembly including a backpanel housing, a key oriented in one of a first plurality of possible positions relative to said backpanel housing, an electrically conductive guide pin, and a first electrically conductive post for engagement with a backpanel; a daughtercard guide assembly including a plurality of protrusions, a mating key receptacle oriented in one of a second plurality of possible positions corresponding to the first positions for receiving said key, a guide hole for receiving said guide pin, and a second electrically conductive post for engagement with a daughtercard; a stiffener connected to said protrusions; and a contact mounted to said daughtercard guide assembly for contact with said electrically conductive guide pin; wherein a first electrostatic discharge path is formed from the daughtercard to said second electrically conductive post to said contact to said guide pin to said first electrically conductive post to the backpanel; and wherein a second electrostatic discharge path is formed from said stiffener to said protrusions to said contact to said guide pin to said first electrically conductive post to the backpanel.
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