The present application claims priority from Japanese application serial no. P2007-146431, filed on Jun. 1, 2007, the content of which is hereby incorporated by reference into this application.
1. Field of the Invention
The present invention relates to a head slider used in a disk apparatus and, more particularly, to an active slider. An active slider is a slider having an actuator for moving a head in any of a flying direction, a track direction, and a jitter direction.
2. Description of the Related Art
Actuators for moving a head in a flying direction in practical use include those which include a heater formed in a slider and in which a write/read element portion is protruded by thermal expansion caused by the heater serving as a heat source to vary the flying height of the write/read element.
Active sliders capable of dynamically following up a waviness of a disk and capable of accurate positioning in the direction of a data track using a piezoelectric element as an actuator have been introduced at academic meeting and the like. In particular, the invention disclosed in JP-A-2000-348321 is a well-known technique relating to an active slider which has high rigidity and which is excellent in the reliability of bonding between a piezoelectric material and a slider base material.
In the active slider disclosed in JP-A-2000-348321, a magnetic head is mounted on a slider base material with a piezoelectric element interposed therebetween, and the piezoelectric element is displaced to adjust the position of the magnetic head minutely. The active slider disclosed in JP-A-2000-348321 serves as a flying height control actuator which allows the magnetic head to fly at an extremely small height when it moves the head in the direction of the flying height. When the slider moves the head in the direction of the width of a track, it serves as an actuator having high positioning accuracy. When the slider moves the head in the circumferential direction of a track, it serves as an actuator for reducing jitters of a reproduction signal. The active slider disclosed in JP-A-2000-348321 can achieve high-speed response because it moves the magnetic head using only the deformation of the piezoelectric element itself. Further, since the bonding surface of the slider base material undergoes no deformation, the slider has high reliability of bonding.
JP-A-2002-251855 discloses an invention in which an actuator is provided on a side of a slider and in which a magnetic head portion is separated from a slider base material and driven by the actuator.
However, the above-described techniques in the related art have problems as described below.
When the head portion 2 is used for control in the direction of a track, the deformation of the actuator 3′ results in an offset between center axes of the slider base material 4 and the head portion 2 in the longitudinal direction of the slider. As a result of this offset, the positive pressure 17 generated on the downstream side of the actuator 3′ will be also offset from the center axis. Then, the slider receives a force in the roll direction, and flyability of the same is therefore adversely affected.
Another problem is how to assemble the piezoelectric element in the gap between the slider base material and the head without making a significant change in existing slider manufacturing processes. For example, when the actuator utilizes a shear deformation mode of the piezoelectric element, the polarization direction and the direction of the electric field must be made orthogonal, and the electrode surface (bonding surface) of the piezoelectric element and the polarization direction must be in parallel with each other. However, in order to dispose the piezoelectric element in such a manner, an electrode for polarization and an electrode for driving must be provided on respective different surfaces of the piezoelectric element. Further, when the slider has a shape that is totally different from normal slider shapes, significant changes must be made in manufacturing processes themselves.
The invention provides an active slider in which the flying height of a head may be efficiently changed or an active slider which may be manufactured without significant changes in slider manufacturing processes.
The invention of the present request includes a configuration and a manufacturing method as described below.
A head slider includes a slider base material which receives a pre-load from a suspension, a deforming element bonded to the slider base material, and a head portion bonded to the slider base material through the deforming element. The slider includes a pad generating a positive pressure on an air bearing surface of the slider base material which is located toward the deforming element with respect to the position receiving the load. The attitude of the slider is maintained by balance between a positive pressure generated at the pad located toward a leading edge side with respect to the deforming element and a pressing force from a dimple.
Alternatively, the slider includes a head portion having an element for writing and reading information on and from a recording medium, a deforming element located on an air leading side of the head portion, and a slider base material located on the air leading side of the deforming element. The slider includes a first positive pressure generating surface provided on an air bearing surface which is located toward the air leading side with respect to the position at ⅓ of the entire length of the head slider from the air leading side and a second positive pressure generating surface provided on the air bearing surface in a position which is located toward the air trailing side with respect to the position at ⅓ of the entire length of the head slider from the air leading side and which is located toward the air leading side with respect to the deforming element.
A metal is vacuum-deposited on a surface of a first wafer. A write/read element is formed on a surface of a second wafer, and a metal is vacuum-deposited on another surface of the same. A metal is vacuum-deposited on both surfaces of a plate material to serve as a deforming element. The first wafer and the second wafer are bonded with the plate material sandwiched between the surfaces thereof on which the metals are vacuum-deposited. A head slider is manufactured by cutting the bonded member.
According to the invention of the present request, a change in a flying height may be efficiently obtained from deformation of an actuator. The attitude of the slider may be prevented from becoming unstable even when a magnetic head is moved by deformation of the actuator.
An active slider may be manufactured without significant changes in existing slider manufacturing processes.
A magnetic disk apparatus will now be described as an example of a disk apparatus in which an active slider according to the invention is used.
The disk 1 rotates counter clockwise when it is viewed from above in
Embodiments of the invention will now be described based on the drawings.
One trailing pad 26 including the write/read element 11 is formed on the air bearing surface of the magnetic head portion 2. In order to prevent the generation of a positive pressure, no step (shallow groove on the air leading side) is provided on the trailing pad 26, and the pad has a size that is a required minimum to form the write/read element 11.
Although no step is provided at the trailing pad 26 in
A comparison between
Therefore, when the step 25′ is provided, it is desirable to make the surface area of the trailing pad 26 as small as possible and to provide a great gap between the air bearing surface of the trailing pad 26 and the step 25′ or a great depth of the step 25′ as will be described later, which allows the pressure generated at the trailing pad 26 to be suppressed and allows a moment of the positive pressure generated by the trailing pad 26 acting around the dimple to be kept as small as possible. Thus, the flying height 18 of the write/read element maybe efficiently decreased as a result of deformation of the piezoelectric element 3. Since balance between moments of the slider as a whole acting around the dimple varies depending on whether the step 25′ is provided or not, the balance between all moments may be maintained increasing the positive pressure generated at the pad located toward the leading side with respect to the dimple when the step 25′ is provided. When the dimple 25′ is not provided, since a smaller positive pressure is generated by the slider as a whole, the positive pressure generated may be adjusted by changing the surface area of the pad.
In the present embodiment, the slider base material 4 has four pads in total disposed thereon, i.e., two each in respective intervals between the leading edge 12 and the dimple position 22 and between the dimple position 22 and the piezoelectric element 3. However, what is intended is to generate the positive pressure toward the trailing edge 13 with respect to the dimple position 22 primarily in the interval between the dimple position 22 and the piezoelectric element 3. Although the positive pressure depends on the position and size of pads or the presence or absence of a step, it does not depend on the number of pads. Therefore, no problem occurs whether the number of the pads 23 and 24 is one or three or more.
Embodiment 2 of an active slider according to the invention will now be described with reference to
The present embodiment is similar to Embodiment 1 in that an active slider 5 is constituted by a magnetic head portion 2 having a write/read element 11, a piezoelectric element 3 subject to shear deformation, and a slider base material 4.
As shown in
In the negative pressure slider of the present embodiment, the air bearing stiffness between the active slider 5 and a disk 1 may be enhanced using the negative pressure 16 to keep the attitude with higher stability. Therefore, a flying height 18 of the magnetic head portion 2 and the write/read element may be more efficiently decreased in relation to the amount of deformation of the piezoelectric element 3. The center of the generation of the negative pressure 16 is located toward the air leading side with respect to the dimple position 22. As a result, a moment which cancels a clockwise moment attributable to the positive pressure generated at a pad 23 may be generated by the negative pressure 16. It is therefore easier to suppress fluctuations of the pitch angle of the head slider even when a counterclockwise moment which must be generated by the positive pressure at the pad 24 is small.
As shown in
One trailing pad 26 including a write/read element 11 is formed on the air bearing surface of the magnetic head portion 2. The trailing pad 26 has a size that is a minimum requirement for forming the write/read element 11 in order to suppress the generation of a positive pressure just as in Embodiment 1, and no step is provided on the leading edge side of the same.
What is important is to dispose pads between the dimple position 22 and the piezoelectric element 3 also in the present embodiment, and the number of pads does not matter whether it is one or three or more.
It will be understood that the deformation of the piezoelectric element 3 results in substantially no change in the pitch angle 19 and that the attitude of the slider is therefore maintained with stability.
The same effect may be achieved also in the present embodiment by providing the trailing pad 26 as a pad in a spherical or a spherical shape having a write element and a read element exposed in the vicinity of an apex thereof.
Embodiment 3 of an active slider according to the invention will now be described with reference to
A laser diode (LD) 30 is provided on a surface of the slider base material 4 facing a suspension 6, and a mirror 31 is provided on a surface of the magnetic head portion 2 facing the suspension.
An air bearing surface of the slider base material 4 and an air bearing surface of the magnetic head portion 2 have configurations similar to those in the Embodiment 1 or Embodiment 2.
Laser light radiated from the LD 30 is reflected by the mirror 31, and the light reaches the near-field light generating element 29 through the waveguide 28 to be converted into near-field light which heats recording bits on a surface of a disk 1.
In the active head slider 5 of the present embodiment, the flying height of the head portion 2 having the near-field light generating element 29 may be easily controlled by deforming the piezoelectric material 3, and high stability of flight is also achieved. Therefore, thermally assisted magnetic recording may be easily controlled when the active slider is used, which allows the recording density of a magnetic disk apparatus to be further improved.
Embodiment 4 of an active slider according to the invention will now be described with reference to
The active slider 5 is constituted by a magnetic head portion 2 including a write element and a read element, a piezoelectric material 3 which is subject to shear deformation, and a slider base material 4. The piezoelectric element 3 of the present embodiment is disposed such that shear deformation of the same causes the write/read element of the magnetic head portion 2 to move in the direction of the width of a track on a disk.
An air bearing surface of the slider base material 4 and an air bearing surface of the magnetic head portion 2 have configurations similar to the configurations in any of the above-described embodiments.
An embodiment of a method of manufacturing an active head slider according to the invention will now be described with reference to
A part to become a slider base material is obtained by depositing metals such as Cr/Cu/Sn—Ag on an AlTiC wafer 32 using sputtering and cutting the wafer into a plurality of plates including parts to become slider base materials. Cr/Cu/Sn—Ag represents a layered structure formed by stacking a Cr layer, a Cu layer, and a layer of a Sn—Ag alloy which are listed in the order of closeness to the wafer. The structure is formed by first performing sputtering with a target of Cr kept open, performing sputtering with a target of Cu kept open, and finally performing sputtering with targets of Sn and Ag kept open. Cr has the function of maintaining adhesion to the AlTiC wafer 32. Cu is used as a conductor of an electrode after a head slider is formed as described later taking advantage of the low resistance of the same. Ag—Sn has the function of eutectic bonding which will be also described later. Although an AltiC wafer is used in the present embodiment, a Si wafer may alternatively be used.
A part to become a piezoelectric element 3 is obtained by polishing a piezoelectric material 33 after polarizing the same, removing the electrodes used for polarization, and cutting the material into a plate with the thickness of the same adjusted. After the cutting, Cr/Cu/Sn—Ag structures are sputter-deposited on a cut surface which is to be bonded to a slider base material and a surface which is to be bonded to a magnetic head just as done on the AlTiC wafer 32. The sputter-deposited surfaces are in parallel with the polarization direction. The sputter-deposited Cr/Cu/Sn—Ag structures serve as electrodes for deforming the piezoelectric element. Apart to become a magnetic head portion 2 is obtained by forming a write/read element on an Al2O3 wafer 34 using the same process as existing ones and grinding a back surface of the wafer thereafter. A Cr/Cu/Sn—Ag structure is similarly sputter-deposited on the ground surface, and the wafer is thereafter cut into plates. Although an Al2O3 wafer is used in the present embodiment, an AlTiC wafer or a Si wafer may alternatively be used.
Next, the plate-like piezoelectric element is disposed such that it is sandwiched by the plate-like slider base material and the plate-like magnetic head. Then, a temperature and/or a pressure is applied to bond them using eutectic bonding of Sn—Ag. In general, a depolarizing temperature at which a piezoelectric element starts to become depolarized is considered to be about ⅔ of a Curie temperature at which complete depolarization takes place. Since the piezoelectric element used in the present embodiment has a Curie temperature of 330° C., the bonding surface was heated up to 220° C. The maximum processing temperature of a magnetic head is normally about 160° C., and the magnetic head is broken down when a higher temperature is applied. For this reason, an element surface of the magnetic head, i.e., a surface opposite to the bonding surface must be cooled during bonding. After a row-stack 35 is formed by bonding the slider base material, piezoelectric element, and magnetic head in the form of plates, processes similar to existing slider manufacturing processes are performed, including a wrapping, cutting a row-bar from the row-stack 35, a wrapping to provide tip of write pole, coating with a protective film, and the formation of pads on air bearing surfaces. Finally, cutting is performed to obtain individual sliders.
Referring to the piezoelectric element, polarization may be carried out in advance by forming electrodes for polarization on both sides of the piezoelectric material in the form of a plate. After the material is cut into a piezoelectric element, a metal may be sputtered onto cut surfaces to use the surfaces as driving electrodes. Thus, driving electrodes may be easily provided in a direction orthogonal to the polarization direction.
It is efficient to bond a slider base material, a piezoelectric element, and a magnetic head when they are in the form of a wafer. However, a voltage as high as 400 kV is required to polarize a piezoelectric element in an in-plane direction thereof when the element has a size on the order of, for example, a 6-inch wafer. In the case of a wide bonding surface, it is difficult to bond the entire surface uniformly because of the influence of a warp or the like.
In the future, studies must be made on batch processes in which the sol-gel method or sputtering deposition method may be used to form thinner piezoelectric layers and to reduce the size of a deformed portion and in which piezoelectric layers may therefore be collectively formed on an AlTiC wafer and magnetic heads may be formed on the layers using thin film processes. However, the piezoelectric constant of a piezoelectric material formed using the sol-gen method or sputtering method is presently very much smaller than the piezoelectric constant of a bulk piezoelectric element, and a required amount of deformation cannot be obtained. Under the circumference, the present embodiment employs a method in which bulk piezoelectric elements are used and bonded to slider base materials and magnetic heads.
In the present embodiment, the magnetic head portion 2, the piezoelectric element 3, and the slider base material 4 are bonded using eutectic bonding of Sn—Ag. However, when the heat resistance of the magnetic head is considered, a bonding method involving no heating such as surface activated bonding may alternatively be used.
Finally,
Since the magnetic head is the only part which is moved by the deformation of the piezoelectric element 3 as thus described, the active slider may be designed to have a high resonant frequency. This allows disturbance of a high bandwidth to be compressed, thereby enabling highly accurate positioning. Since the mass of the magnetic head portion 2 is one-tenth or less of the mass of the slider base material 4, a reaction force generated by the movement of the magnetic head portion 2 is small.
In the active slider of the present embodiment, only a piezoelectric element for moving the magnetic head in a track positioning direction is provided. Alternatively, a piezoelectric material 3 for moving the magnetic head in the direction of the flying height thereof may be provided in addition as in the above-described embodiments. Further, in addition to the piezoelectric element 3, the piezoelectric longitudinal distortion effect or piezoelectric lateral distortion effect may be provided to allow the magnetic head portion 2 to be moved in the circumferential direction of a track. As a result, not only the flying height adjustment but also highly accurate positioning and jitter compensation may be made using a single active slider, which will contribute greatly to increase in the recording density of magnetic disk apparatus.
The use of the above-described structures make it possible to provide a disk apparatus which achieves a high recording density by accurately positioning a magnetic head on a data track.
A more specific example of the piezoelectric element 3 used in the above description is a PZT/Si unimorph type electrostrictive element. However, a magnetostrictive element which is distorted by a magnetic field may alternatively be used as the actuator. Such deforming elements may sufficiently follow up a waviness of a magnetic disk because they are quicker in response than elements deformed using heat.
Where a waviness of a magnetic disk is not a problem, even an actuator having low response may efficiently cause a change in a flying height when the actuator is deformed, and a slider may be prevented from becoming unstable in attitude because of a movement of a magnetic head when such an actuator is deformed.
Number | Date | Country | Kind |
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2007-146431 | Jun 2007 | JP | national |