Headlamp assembly having a heat sink structure and wire heating element for removing water based contamination

Abstract

A headlamp assembly having a mechanism for reducing water based contamination is disclosed. A headlamp assembly includes a lens affixed to a housing having an inner surface and an outer surface, a wire heating element embedded within the inner surface of the lens, wherein the wire heating element is electrically coupled to a circuit board. An encapsulation layer is disposed over the wire heating element and a thermistor is affixed to the lens for sensing when the lens reaches a predetermined condition. The thermistor is electrically coupled to the circuit board and a micro-controller is provided for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

Description

This application incorporates by reference and is a Continuation-in-part of U.S. patent application Ser. No. 13/024,323, now U.S. Pat. No. 8,459,848.

SUMMARY

Embodiments disclosed herein relate generally to a lighting system which comprises a means for removing and/or preventing water based contamination from forming or accumulating on areas of an optical lens used in conjunction with a light emitting diode (LED) lamp.

A mechanism for reducing water based contamination in a headlamp assembly is provided. The mechanism uses some of the heat created by a LED emitter or other heat-generating devices within the headlamp assembly, to heat the lens area of a LED lamp. Thus, the heat prevents build-up of water-based contamination in the form of snow or ice on the lens, and heat is drawn away from the heat-generating devices, thereby extending the useful life of a LED circuit and emitter which may deteriorate prematurely when exposed to elevated temperatures generated by the LED and associated components.

In addition, one or more resistive heating elements, in the interior of the headlamp may be utilized in conjunction with heat radiating from the LED in order to remove water-based contamination from a LED lamp assembly. An optically clear thermal transfer fluid may be utilized in the interior of a LED lamp to heat the lens structure in order to prevent accumulation of water-based contamination on the LED lamp.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an assembled front view of one embodiment of a LED lamp assembly.

FIG. 2A is an exploded view of a lens assembly for a headlamp assembly.

FIG. 2B is an exploded view of the LED lamp shown in FIG. 1.

FIG. 3A shows an exploded view of an embodiment a lens assembly with a resistor there between.

FIG. 3B shows an assembled view of the lens assembly of FIG. 3A.

FIG. 3C is a schematic representation of a resistive heating element.

FIG. 4A is a schematic representation of another embodiment of a mechanism for reducing water based contamination from a headlamp assembly.

FIG. 4B schematic representation of another embodiment of a mechanism for reducing water based contamination from a headlamp assembly.

FIG. 5 illustrates a cross-sectional view a mechanism for reducing water based contamination from a headlamp assembly.

FIGS. 6A and 6B are cross-sectional views of a mechanism for reducing water based contamination from a headlamp assembly having side channels.

FIGS. 7A and 7B are cross-sectional views embodiments of a mechanism for reducing water based contamination from a headlamp assembly using a circulation system.

FIGS. 8A, 8B, and 8C are cross-sectional view of a mechanism for reducing water based contamination from a headlamp assembly including a solid state heat pump.

FIGS. 9A and 9B represent alternative embodiments of a mechanism for reducing water based contamination from a headlamp assembly utilizing a single lens structure.

FIGS. 10-13 illustrates embodiments of a mechanism for reducing water based contamination from a headlamp assembly including resistive heating elements embedded the outer lens.

FIGS. 14A-19 illustrate an additional embodiment.

DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS

For purpose of promoting an understanding of embodiments described herein, references are made to embodiments of a vehicle light emitting diode (LED) headlamp assembly and method of making only some of which are illustrated in the drawings. It is nevertheless understood that no limitations to the scope of any embodiments disclosed are thereby intended. One of ordinary skill in the art will readily appreciate that modifications such as the component geometry and materials, the positioning of components, type of heating and control devices, and the type of electrical connections do not depart from the spirit and scope of any embodiments disclosed herein. Some of these possible modifications are mentioned in the following description. Furthermore, in the embodiments depicted, like reference numerals refer to identical structural elements in the various drawings.

A headlamp assembly 10 in accordance with an embodiment of the invention is illustrated in FIG. 1. In the embodiment illustrated, headlamp assembly includes a plurality of light emitting diodes, one of which is indicated at 12. Those of skill in the art will appreciate that the quantity of Light emitting diodes depicted should not be construed as limiting, in that more or less Light emitting diodes may be utilized depending on the application of the headlamp. Headlamp assembly 10 includes a lens assembly 15 and a housing 20. Lens assembly 15 is formed of a material that prevents light emitting diodes 12 from being exposed to the outside environment. For example, lens may be formed of polyester, polycarbonate, or glass. In addition, lens assembly 15 may be a single or dual lens structure, which will be described in detail below. In the embodiment shown in FIG. 1, heating elements 25 are incorporated into lens assembly 15 for assisting in the removal of water based contamination.

FIG. 2A is an exploded view of a lens assembly 15 for a headlamp assembly 10. An inner lens layer 17 and an outer lens layer 18, which includes side perimeter 19 terminating at ledge 22, are shown along with sealing element 30. A resistive element 25 is installed between inner lens layer 17 and outer lens layer 18 using an optically clear acrylic based pressure sensitive adhesive as a filler and bonding agent. Inner and outer lenses or lens layers (17,18) may be formed of polycarbonate, polyester, polyester, or glass.

FIG. 2B is an exploded view of a headlamp assembly 10 with lens assembly 15 removed. The embodiment shown comprises a circuit board (not shown), light emitting diodes 12, and a housing 20, which includes first housing portion 26a and second housing portion 26b. The lens assembly 15 of FIG. 2A attaches to housing 20 to form headlamp assembly 10.

FIG. 3A is an exploded view of another embodiment of lens assembly 15 for use with headlamp assembly 10. As depicted, lens assembly 15 is a composite lens including inner lens 50 and outer lens 55 with resistive heating element 60 positioned therebetween. Inner and outer lens layers 50 and 55 may be formed of an optical grade material, such as polycarbonate or glass. An adhesive material of an optical grade, i.e. an acrylic based adhesive, is applied on upper and lower sides of heating element 60, which is an electrically resistive element having a small enough diameter that it does not interfere with the optical performance of lens assembly 15. By way of example, suitable alternative adhesives include thermally-activated or thermosetting adhesives, hot melt, chemically-activated adhesives such as those utilizing cross-linking agents, UV activated light curing materials (LCM), encapsulated adhesives, and the like. Thus, lens assembly 15 is manufactured to fit together with sufficient precision as to have the same effect as a single layer lens. To accomplish this, the index of refraction of each material used in the lens assembly must be known in addition to the geometry. Then, modifications to the geometries of each lens layer may be considered to ensure starting and ending light path of light rays passing through lens assembly 15 matches that of a single layer lens that lens assembly 15 is replacing. The index of refraction for all points of interest across the lens surfaces may be determined using the following equation:

$\sin {\alpha }_{\mathrm{resul}}=\frac{n_{\mathrm{incid}}}{n_{\mathrm{resul}}}\sin {\alpha }_{\mathrm{incid}}$

• • Wherein:
    • α resul is the angle between a ray that has passed through a surface from one media to another and the normal line at the point on the surface where the ray passes through
    • η incid is the refractory index of the material that the ray is traveling within as it approaches an interface surface between two media.
    • η resul is the refractory index of the material that the ray passes into once it crosses the interface surface between two media.
    • α incid is the angle between a ray as it approaches a surface between one media and another and the normal line at point on the surface where the ray passes through.

Heating element 60 may be formed of copper or other base material that would operate within the voltage and current limitations necessary for removing water based contamination from lens assembly 15. For example, heating element 60 may operate at a voltage of 12-24 VDC/VAC. A maximum power of 0.1255 Watts/cm² lens area may also be applied. More particularly, heating element 60 may have specific resistance as determined by the required power density, operating voltage, and specific lens area in order for heating element 60 to be capable of removing an average of 3.095 milligrams of ice/cm² of lens area/minute over a maximum 30 minute duration when headlamp assembly 10 has been held at −35 C for a period not shorter than 30 minutes in an environment chamber with the environment chamber fully active for both 30 minute durations. The total power (in watts) can be determined by multiplying the effective area of lens assembly 15 required to be cleared of water based contamination (in cm²) times the power per lens area. Thus, resistance of the heating element 60 is dependent upon the type of material used to make resistive heating element 60, as well as its diameter.

In some embodiments resistive heating element 30 may be formed by depositing a layer of indium tin oxide (ITO) metal film on a polyester sheet, such as manufactured by Minco®. The diameter of heating element 60 may be in the range of 10 to 20 microns. In one embodiment, heating element 60 is configured in a pattern and disposed between two sheets of polyester, such as Thermal-Clear™. In some alternate embodiments heating element 60 may be formed by depositing a layer of indium tin oxide (ITO) metal film on a polyester sheet, such as manufactured by Minco®. In addition, the material used to make heating element 60 may be copper or a transparent conducting oxide such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and doped zinc oxide or other similarly conductive and optically transparent materials.

Lens assembly 15 is shown in an assembled configuration in FIG. 3b. In one embodiment, lens assembly 15 is formed by laying heating element 60 in a pressure sensitive adhesive material using a robotic fixture device or other controllable/repeatable means capable of placing heating element 60. Heating element 60, containing adhesive, is then sandwiched between lens layers, 50 and 55, which are pressed together using a clamp, ram, vice, or other means of applying a clamping force to lens assembly 15 by contacting an inner surface 62 of inner lens 50 and an outside surface 63 of outer lens 55 with compliant interfaces (rubber blocks, etc). The compliant interfaces may be shaped such that they contact center portions of inner and outer lenses, 50 and 55, prior to deforming to make contact with the remainder of inner surface 62 and outer surface 64 for the purpose of dispelling air and other entrapped gases.

Alternatively, heating element 60 or wire may be embedded within a lens via an ultrasonic procedure. Essentially, the procedure begins with determining a mounting location in the lens substrate. Next, a wire is threaded onto an embedding tool known as a sonotrode. The sonotrode aids in pressing the wire against the lens substrate, and comprises an ultrasonic transducer, which heats the wire by friction. The molecules of the polycarbonate substrate simultaneously vibrate very quickly, so that the lens material melts in the area of the aperture. Accordingly, the wire is embedded into the polycarbonate substrate by use of pressure and heat. A final step in the process entails connecting ends of the wire that are not embedded, to terminals on the lens substrate.

FIG. 3 c shows a view of a circuit 70 used in one embodiment providing power to heating element 60. Circuit 70 comprises a resistive heating element 60 made from a thin wire, comprising any of various materials including copper, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and doped zinc oxide. Preferably, materials selected for heating element 60 should be optically transparent, and be capable of resisting fluctuations in current flow direction. Heating element 60 is configured as a pair of metallic or metallic oxide loops connected in parallel. A first loop 72 is connected to leads A and B. A second loop 74 is connected to leads B and C. The circuit construction allows for the use of either 24 volt or 12 volt systems at the same power level. Thus, for 24 volt operation, only leads A and C are utilized. For 12 volt operation, leads A and C are connected together to one pole and lead B to the other pole.

A simple control system 100 may be used to allow heating element 60 to operate automatically. Automatic or manual control logic would dictate that as long as the ambient temperature local to lens assembly is within temperature range wherein water based contamination may occur, heating element 60 is active (powered on). An automatic control system could be constructed of a comparator that switches heating element 60 on or off based on the resistance value of heating element 60 (which would vary with temperature). The resistance value may be compared to a set threshold resistance associated with a maximum temperature of the range wherein water based contamination may occur. Then, if the resistance value is at or below the threshold, the comparator switches to close the circuit providing power to heating element 60 and remains in that state. Conversely, if the resistance value is above the threshold resistance, the comparator switches to open the circuit disrupting power to the mechanism, which remains in an off state. The threshold value could be determined by calculation using the material properties of the resistive element, adhesive, and lens material and geometries and verified through empirical testing or just determined through empirical testing. Alternatively, the control system may use a separate electronic temperature indicating device. The control system could simply be a switch that is operated manually, it could be controlled by a programmable logic controller, or other means of switching the device on/off, or the device could be left on all the time.

FIG. 4A is a schematic representation of another embodiment of a mechanism 110 for reducing water based contamination from a headlamp assembly 10. Mechanism 110 includes inner and outer lenses 120 and 121 and an energy source that dissipates energy in the form of heat. The energy source may be light emitting diodes 125, or any other part that dissipates energy in the form of heat either by mechanic or electrical principles. An optically clear fluid, in gaseous or liquid form, is directed past energy sources (Light emitting diodes 125) with a mechanically or electrically operated pump, fan, compressor or the like. In the embodiment shown, a fan 122 is used to circulate the fluid. Free convection may also be used to transfer heat energy from energy sources 125 to mass particles contained in the fluid, which is then directed through a channel 128 between inner lens 120 and outer lens 121. Heat energy is then transferred from the fluid mass particles to lenses 120 and 121 such that accumulation of water based contamination cannot occur. The heat energy also removes any previously accumulated water based contamination from lenses 120 and 121. Mechanism 110 may be used alone or in conjunction with another device, such as a heating element, in order to provide sufficient energy to lenses 120 and 121. The fluid may be channeled using existing geometries within lens assembly 15 and additional geometries may be added to provide passages for the fluid. The fluid may be partly or completely encapsulated or free flowing against lenses 120 and 121. In the embodiment illustrated in FIG. 4a, channel 128 facilitates the transfer of cool air originating from outer lens 121, which is exposed to the outside of the headlamp, toward light emitting diodes 125 in order to decrease the temperature of light emitting diodes 125. Thus, mechanism 110 provides a means of distributing heated and cooled fluid within headlamp assembly 10. It will be appreciated by those of skill in the art that the “fluid” as used herein may comprise liquid, gaseous substances, including air or other vapors, free-flowing polymeric fluids, partially or completely encapsulated fluids, as well as fluids comprising mass particles. Representative heat transfer fluids known in the art may also include polyolefins, polyalphaolefins, diphenylethanes, and the like, manufactured and sold by Radco®.

FIG. 4B is schematic representation of an embodiment of a mechanism 210 for reducing water based contamination from a headlamp assembly 10. Similar to the embodiment described in conjunction with FIG. 4a, mechanism 210 includes inner and outer lenses 220 and 221 having a channel 128 therebetween, a fan 222 and light emitting diodes 225 that dissipate energy in the form of heat. In addition, mechanism 210 includes a heat sink 230 having fins 232. A solid state heat pump 235, such as a Peltier device, may be inserted between heat sink 230 and light emitting diodes 125. When energized solid state heat pump 235 acts to reverse the direction of energy transfer to cause energy to flow from heat sink 230 to light emitting diodes 125, as indicated by arrow 237, under controlled conditions wherein light emitting diodes 125 would not become damaged due to overheating.

The transfer of heat towards light emitting diodes 125 may be used when the temperature local to mechanism 210 and light emitting diodes 125 is sufficiently low that the conditions are correct for water based contamination to develop or accumulate on outer lens 121. Heat pump 235 also increases the energy that is transferred from light emitting diode to the fluid, thereby more effectively providing energy to outer lens 121 for the purpose of removing water based contamination. Additional solid state heat pumps, or other types of heat pumps, may be used at other locations anywhere surrounding a fluid channel that is being used for the purpose of transferring energy as described above.

As is known in the art, Peltier heat pump 235, operates based on the Thomson Effect, which is based upon the principle that electric potential difference is proportional to temperature difference. Specifically, a thermal gradient is created when a temperature difference along a conductor is present such that one part of the conductor is warmer, while the other is colder. Thermal energy in the form of electrons, will inherently travel from the warmer portion of the conductor to the colder portion.

In terms of polarity, electrons normally travel from positive to negative. The Peltier Effect involves the discovery that when current flows through a circuit comprising two or more metals of varying electronic properties (ex, n-type vs. ptype), the current drives a transfer of heat from one junction to the other. However, when the polarity is reversed as is the case under an applied voltage, electrons will travel in the opposite direction (i.e., from negative to positive). Similarly, heat transfer will also occur in the opposite direction. Thus, the direction of heat transfer may be controlled by manipulating the polarity of current running through Peltier heat pump 235.

Heat created by light emitting diodes 125, circuit board (not shown in FIG. 4b), or other heat generating devices may be absorbed by heat sink 230. In order to prevent absorbed heat from being exhausted to the atmosphere via fins 232, heat pump 235 may be activated in order to transport heat from heat sink 230 to a channel located below the heat sink. In one embodiment, sensors may be utilized to monitor when the temperature of the fluid drops below a certain level, at which time a control circuit may activate heat pump 235 in order to transport stored heat from heat sink 230 to thereby promote circulation of heated fluid within mechanism 210. Heat sink 230, which collects and stores heat originating from heat generating devices. These heat generating devices may include Light emitting diodes, resistors, fans or air pumps, power electronics including but not limited to linear and switch mode current regulators, which may be required to drive or regulate power within the lamp. Essentially, heat sink 330 may collect heat from any device that creates heat within the lamp, whether or not it is the device's primary function to do so. Subsequently, heat collected by heat sink 330 may be exhausted to the atmosphere via fins 332.

FIG. 5 illustrates a cross-sectional view a mechanism 310 for reducing water based contamination from a headlamp assembly 10. Mechanism 310 includes an inner lens 320 and outer lens 321 and heat sources, including light emitting diodes and a circuit board 325. A channel 326 is located below circuit board 325 for allowing the passage of fluid. As discussed above, heat generated by light emitting diodes and associated circuitry on circuit board 325 is transferred to channel 326 via a convection process. A channel 328 for transferring fluid is also located between inner and outer lenses 320 and 321. Subsequently, a portion of the heat transferred to channel 326, exits mechanism 310 via heat sink 330 having fins 332.

More specifically, a free-convection process may be utilized to circulate fluid between inner and outer lenses 320 and 321 in order to maximize melting of snow and ice from outer lens 321. In this embodiment, heat is transferred to fluid by use of geometries within the lens structure. The initial temperature of channel 328 is cold. Second fluid-flow channel 326 is located below circuit board 325 and facilitates absorbance of heat originating from circuit board 325. Thus, the initial temperature of channel 326 is hot. As illustrated in FIGS. 6a and 6b, side channels 327, 327′ located in opposite side-walls of mechanism 310 connect channels 326 and 328. The channels may be formed at an angle in the range of 10 to 30 degrees, as in FIG. 6a, to an angle of approximately 120 to 150 degrees, as in FIG. 6b. Angled side channels 327, 327′ as well as channels 326 and 328 represent a system of channels enabling heated fluid to flow within mechanism 310 via a free convection process enhanced by gravity, density, and buoyancy. This process optimizes fluid flow within the dual lens structure, brought about by absorption and desorption of heat as discussed infra.

Heated fluid located in channel 326, is inherently less dense than colder fluid located in channel 328. Gravitational acceleration creates a buoyant force causing colder, heavier fluid in channel 328 to move down to displace the warmer fluid in channel 326. As the cold fluid collects in channel 326, it absorbs heat from circuit board 325, light emitting diodes, and other heat-generating devices. As the fluid becomes warmer, viscous forces of the fluid are decreased and buoyant forces which encourage fluid flow are increased. Buoyant forces thus overtake the viscous forces of the fluid, and flow is commenced toward channels 328. Pressure within the side channels is minimized by optimizing the cross-sectional area of the channels so that cross-sectional area increases in the direction of desired fluid flow. Accordingly, fluid flow within the side channels is promoted in the direction of channel 328, and resisted in the direction of channel 326. Once the fluid reaches channel 328 its heat is desorbed by snow and ice accumulating on outer lens 321. This steady state process repeats itself continuously, until outer lens 321 is free from water-based contamination caused by cold outdoor temperatures.

FIG. 7A is a cross-sectional view of another embodiment of a mechanism 410 for reducing water based contamination from a headlamp assembly 10. Mechanism 410 includes an inner lens 420 and outer lens 421 and heat sources, including light emitting diodes and a circuit board 425. A channel 426 is located below circuit board 425 for allowing the passage of air. As discussed above, heat generated by light emitting diodes and associated circuitry on circuit board 425 is transferred to channel 426 via a convection process. A circulation device such as fan 427 is provided to further encourage circulation of air within mechanism 410. A channel 428 for transferring fluid is also located between inner and outer lenses 420 and 421. Subsequently, a portion of the heat transferred to channel 426, exits mechanism 410 via heat sink 430 having fins 432.

FIG. 7B is a cross-sectional view of mechanism 410′ wherein a liquid is circulated within channels 426′ and 428′. As discussed above the liquid may be a heat transfer fluid known in the art such as polyolefins, polyalphaolefins, diphenylethanes, and the like. A pump 427′ is provided to circulate the liquid within mechanism 410.

FIGS. 8A, 8B, and 8C are cross-sectional view of a mechanism 510 for reducing water based contamination from a headlamp assembly 10 including a solid state heat pump 512. FIG. 8A illustrates mechanism 510 with a single lens 521. Heat sources, including light emitting diodes and a circuit board 525 are also provided. In the embodiment of FIG. 8A, heat is transferred by way of solid state heat pump 512. As discussed above, heat pump 512 transfers heat from a heat sink 530 towards circuit board 525. Thus, heat from heat sources, including circuit board 525 is directed towards lens 521 to heat lens 521 for reducing water based contamination from a headlamp assembly 10.

The embodiment shown in FIG. 8B is also a mechanism 510′ for reducing water based contamination from a lens, wherein a heat pump 512′ is employed. Mechanism 510′ includes inner lens 520′ and outer lens 521′. As discussed with respect to FIG. 5, heat generated by light emitting diodes and associated circuitry on circuit board 525′ is transferred to a channel 526′ via a convection process. A channel 528′ for transferring fluid is also located between inner and outer lenses 520′ and 521′. Heat sources, including light emitting diodes and a circuit board 525′ are also provided. In the embodiment of FIG. 8B, a solid state heat pump 512′ is positioned below circuit board 525′ and acts to draw heat from circuit board 525′ and the light emitting diodes. The heat is then transferred to from heat pump 512′ to channel 528′ to heat the fluid within the channel. The heated fluid then travels up channels formed in the sides of mechanism to channel 528. The heated air may then heat lens 521 for reducing water based contamination from a headlamp assembly 10. Transferring heat away from circuit board 525′ and light emitting diodes also reduces the temperature of the circuit elements and light emitting diodes, thereby preventing degradation due to heat.

FIG. 8C depicts a mechanism 510″ for reducing water based contamination from a lens, wherein a first heat pump 512″ and a second heat pump 513″ employed. Mechanism 510″ includes inner lens 520″ and outer lens 521″. Heat generated by light emitting diodes and associated circuitry on circuit board 525′ is transferred to a channel 526″ via a convection process. A channel 528″ for transferring fluid is also located between inner and outer lenses 520″ and 521″. First solid state heat pump 512″ is positioned below circuit board 525″ and acts to draw heat from circuit board 525″ and the light emitting diodes. The heat is then transferred to from heat pump 512″ to channel 526″ to heat the fluid within the channel. In addition, a second heat pump 513″ is positioned adjacent to heat sink 530″ for transferring heat from heat sink 530″ towards channel 526″. The heated fluid then travels up channels formed in the sides of mechanism 510″ to channel 528″. The heated air may then heat lens 521 for reducing water based contamination from a headlamp assembly 10.

FIGS. 9A and 9B represent alternative embodiments of a mechanism 610, 610′ for reducing water based contamination from a headlamp assembly 10 utilizing a single lens structure. As shown, a device that moves air, such as a fan or air pump, 612, 612′, is positioned in a compartment 613, 613′, below circuit board 625, 625′ and in close proximity to a channel 626, 626′. Heat from circuit board 625, 625′ is drawn into channel 626, 626′ and through passages 627, 627′ toward compartment 613, 613′. Fan, 612, 612′ acts to force the air into a chamber 628, 628′ within mechanism 610,610′ to circulate in order to prevent warm air from becoming trapped in one particular area. Warm air radiating from the Light emitting diodes and circuit board 625, 625′ rises up to lens 630, 630′. If snow or ice has accumulated on lens 630, 630′, this heat will aid in melting the snow and/or ice. If, however, the temperature of lens 630, 630′, is the same or warmer than the air inside chamber 628, 628′, heat will tend to build up in the area below lens 630, 630′ and above circuit board 625, 625′ causing a risk to the Light emitting diodes and other circuitry. Fan 612, 612′ pulls cooler, more dense air, which naturally migrates toward the bottom portion of the headlamp, up to the portion between lens 630, 630′ and circuit board 625, 625′, thus facilitating a replacement of warmer air trapped within the this area. As shown, one or more holes 632, 632′ may be provided in circuit board 625, 625′ to facilitate transfer of air from the bottom portion of mechanism 610, 610′, through holes 632, 632′ and into chamber 628, 628′, thereby circulating air throughout mechanism 610, 610′, and particularly circulating warm air generated by the Light emitting diodes and circuitry to facilitate reducing water based contamination from a headlamp assembly 10. The embodiment of FIG. 9B includes a solid state heat pump or thermal slug 635 to further included to assist in reducing water based contamination from a headlamp assembly 10. Heat pump 635 draws heat from circuit board 625′ and light emitting diodes down into a channel 626′ where the heat is transferred, via fan 612′, to air within channel 628′ in the manner described above.

As illustrated in each of FIGS. 10-13 a resistive heating element may be embedded the outer lens of any of the previously discussed embodiments. With respect to FIG. 10, a mechanism 710 for reducing water based contamination from a headlamp assembly 10 is shown with resistive heating element 712. Heating element 712 is powered by circuit board 725 and provides heat to lens 730 when snow and ice accumulate on the lens, to thereby clear the lens from water-based contamination which can act as a filter decreasing transmittance of light through lens 730.

FIG. 11 illustrates an alternative embodiment to that disclosed in FIG. 10. A mechanism 810 for reducing water based contamination from a headlamp assembly 10 is shown with resistive heating element 812 embedded in an outer lens 830. An inner lens 831 is also shown with a channel 836 formed therebetween. Fluid within channel 836 flows through side channels and through channel 839, which is formed between circuit board 845 and heat sink 850. Once heated, resistive heating element 812 provides heat to outer lens 830 in order to facilitate the removal of water-based contamination such as snow and ice from the outer lens. In addition, resistive heating element 812 provides a means of promoting circulation of fluid within channels 836 and 839 by transfer of heat to the fluid causing the molecules of the fluid to move rapidly to thereby increase flow of fluid.

FIG. 12 represents a modified version of the embodiment disclosed in FIG. 10. A mechanism 910 for reducing water based contamination from a headlamp assembly 10 is shown with resistive heating element 912 embedded in a single lens 930. The resistive heating element 912 is powered by circuit board 945 and provides heat to lens 930 when snow and ice accumulate on the lens, to thereby clear the lens from water-based contamination which can act as a filter decreasing transmittance of light through lens 930.

In addition, as shown by the arrows, warm air originating from Light emitting diodes and circuit board 945 and associated circuitry is transferred to lens 930 via heat pump 948. Heat from heat sink 946 is also transferred toward lens 930. Thus, lens 930 is provided with heat both by a resistive heating element 912 as well as transfer of heat radiating from the Light emitting diodes and circuit board 945 by way of heat pump 948. This creates a two-fold advantage, in that water-based contamination is melted from lens 930 thereby increasing optical transmittance, and heat is reduced in the area of the Light emitting diodes and associated circuitry thereby extending the useful life of the headlamp. Heat pump operates in the manner described in relation to FIG. 8A.

The embodiment shown in FIG. 13 is a mechanism 1010 for reducing water based contamination from a headlamp assembly 10 is shown with resistive heating element 1012 embedded in a lens 1013. As described with respect to the embodiment of FIG. 9b, mechanism 1010 includes a solid state heat pump or thermal slug 1035 to further assist in reducing water based contamination from a headlamp assembly 10. Heat pump 1035 draws heat from circuit board 1045 and light emitting diodes down into a channel 1046 where the heat is transferred through passages 1048 to chamber 1050. A fan 1052 directs air through openings 1055 and into chamber 1060 towards lens 1013 in the manner described above.

A control system may be utilized in any one of the embodiments discussed supra. The system includes temperature sensor which monitors the temperature in and around the lens structure. Sensor 520 may comprise a Resistive Temperature Detector (RTD), Positive Temperature Coefficient Thermistor (PTC), or any other type of temperature sensor known in the art including variable resistors, thermistors, bimetal circuits, bimetal switches, as well as linear and switch mode current regulators. The temperature read by the sensor is converted to a signal and transferred to a comparator. The Comparator compares the actual temperature reading to a threshold temperature value stored within the device. If the actual temperature is below the threshold value, the comparator sends a signal to a switch in order to activate the heating element, thermal transfer fluid circulating device, or Peltier heat pump to thereby heat the dual or single lens structure in order to melt water-based contamination accumulating on the LED lamp. Similarly, when the actual temperature read by the sensor is above the threshold temperature value, comparator will send a signal to the switch in order to deactivate heating element, thermal transfer fluid circulating device, or Peltier heat pump and heat will thus be stored by the heat sink and eventually exhausted to the atmosphere if necessary via fins.

An additional embodiment is illustrated and described in connection with FIGS. 14A-19. A headlamp assembly 1100 (FIG. 19) for a vehicle includes a 7-in round housing 1115 for coupling headlamp assembly 1110 to a vehicle, first and second reflector portions 1120 and 1121 and a heat sink structure 1125, which bisects housing 1115 into upper and lower areas, 1127 and 1128. Heat sink structure 1125 supports light emitting diode assemblies 1136 and 1137 on first and second surfaces 1138, 1139 of heat sink structure 1125 and a circuit board, as will be discussed in detail below. Further details of headlamp assembly 1100 are described in U.S. patent application Ser. No. 13/024,320, which is incorporated herein by reference. Headlamp assembly 1100 includes a lens 1130 that is heated for the purpose of preventing lens contamination related to the accumulation of water in the form of fog, frost, snow, or ice, which may exist under various environmental conditions.

FIG. 14A illustrates a lens 1130 having a circuit board 1140 mounted hereto. FIG. 14B illustrates lens 1130, wherein a resistive wire heating element 1135 is embedded into lens material 1130 using ultrasonic technology. The embedding via ultrasonic technology may be performed through robotics to easily accommodate variations in lens surface, variables in wire patterns, and for improved accuracy and speed. Wire heating element 1135 may also be attached to non-embeddable materials using ultrasonic technology with the use of coated wire wherein the coating material is melted ultrasonically, thereby becoming an adhesive between wire heating element 1135 and the non-embeddable material. Resistive wire heating element 1135 may include a copper core with a silver coating to prevent corrosion of wire heating element 1135. Typically resistive wire heating element 1135 is embedded in lens 1130 at a depth approximately ⅔ of the full wire diameter (⅔d). In one embodiment, the diameter of resistive wire heating element 1135 is approximately 3.5/1000 inches so the embedding depth is between 0.0023333333 to 0.0035 inches. The wire is embedded by tapping it into the lens at a frequency which locally excites the lens molecules causing the lens to melt locally to the wire. Force control is used to prevent pushing the wire down farther than desired (so that the embedding head does not directly impact the lens).

An encapsulating material may be used to cover wire heating element 1135 on an inside surface of lens 1130 to prevent localized superheating (i.e. fusing) of wire heating element 1135 due to exposure to air. When wire heating element 1135 is exposed directly to the air the heat generated in wire heating element 1135 cannot transfer fast enough to the air through convection. Thus, the temperature of wire heating element 1135 exceeds the melt temperature of wire heating element 1135. The encapsulating material prevents overheating by accepting heat transfer through conduction on the order of 1000 faster than convection to the air. Thus, the temperature of wire heating element 1135 is not raised enough to melt the wire, the lens, or the encapsulating material(s). A suitable encapsulating material is Red Spot. Other encapsulating materials that are Department of Transportation compliant, as specified for optical grade materials/coatings, must have adequate adhesion to the lens material, must have temperature limitations not less than that of the lens material or the heater wire maximum temperature under prescribed conditions, and must not violate other design features/parameters. The encapsulating material also helps to prevent wire heating element 1135 from coming free from lens 1130 due to random vibration or impact.

A coating or encapsulating material may also be applied on an outside surface of lens 1130 to protect lens 1130 against deterioration from weather (UV rays, heat, cold, rain, snow, and ice). It also resists damage from sand and dirt. It is specifically required on polycarbonate headlamp lenses to meet FMVSS 108 abrasion test requirements and chemical resistance (ASTM Fuel Reference C, Tar Remover, Power Steering Fluid, Antifreeze, and windshield washer fluid). The coating material may or may not be UV or thermally cured. Some alternative coating materials are Momentive PHC 587, Momentive AS 4700, and Red Spot 620V.

Wire heating element 1135 is actively controlled in order to increase performance and efficiency of the wire heating element 1135. A heating element circuit board 1140 is universally attached to the headlamp circuit board such that wire heating element 1135 may be used in various lamp designs. Thermal compression bonding or welding is utilized to attach heating element circuit board 1140 to lens 1130. Heating element circuit board 1140 may be affixed to lens 1130 using a two component, 1:1 mix ratio epoxy from Star Technology (Versabond ER1006LV). Alternate adhesives may be used based on temperature range, adhesive strength/durability, out-gassing properties, chemical reactivity, flexibility, application method, cure time, appearance, availability, and cost. Acceptable adhesives include non-cyanoacrylate based adhesives.

An attachment area is provided on either side of heating element circuit board 1140 wherein the wire heating element 1135 can be embedded into lens 1130 and routed such that wire heating element 1135 crosses over heating element circuit board 1140 as well as applicable conducting pad areas 1151 therein. Heating element circuit board 1140 includes a thermistor 1150 on the outward facing side for heater control feedback purposes. Heating element circuit board 1140 and thermistor 1150 are placed into lens 1130 such that the distance between an outer surface the thermistor and an outer surface of the lens does not exceed 1/10 the distance from the outer surface of thermistor and an inner surface of the lens at any one point for the purpose of minimizing the thermal impedance between the thermistor and outer lens surface and maximizing the thermal impedance between the thermistor and the inner lens surface. Thermal impedance is therefore manipulated by varying the thermistor's distance from the inner and outer surfaces of the lens, represented by the equation: Do≦( 1/10)Di where Do=the distance from the thermistor to the outer lens and Di=the distance between the thermistor and inner lens. Therefore, the resistance to heat transfer is at least 10 times more from the thermistor to the inside air compared to the resistance to heat transfer between the thermistor and the outside of the lens.

The resistance of thermistor 1150 may be used to accurately predict the outer lens surface temperature wherein the ratio of distances versus the desired accuracy of the control system feedback is calculated and validated empirically. Thermal impedance is the resistance to transfer heat from any one point to any other point (if the thermal impedance is high, less heat transfer will occur and vice versa). The thermisor needs to be sensitive to temperature changes on the lens surface because that is the surface from which water-based contamination such as snow and ice is removed. Therefore, it is necessary to have a very low thermal impedance from the thermistor to the outer lens surface. In this case, the lens material and outer lens coating are the thermal barriers between the thermistor and the outer lens. In addition, it is important to maximize the resistance from the thermistor to the inside of the lamp so the inside lamp temperature does not affect the temperature reading sensed by the thermistor.

The thermistor is essentially a surface mount resistor having approximate dimension: 0.03×0.065×0.03 inches (width, length, height) that is comprised mainly of alumina. The thermistor operates under a programmable logic sequence in order for the heating wire to be activated/deactivated automatically in order to melt snow and ice on the lens. The thermistor is used to provide feedback to the micro-controller in the form of a resistance. This resistance is correlated to a temperature that the micro-controller stores and uses to decide whether the heater should be on or off and at what level of power. The resistance/conductivity of wire heating element 1135, as well as that of the actual thermistor 1150 and heating element circuit board 1140, is factored-in to optimize the operation of the thermistor. In one embodiment, wire heating element 1135 is adapted to activate at 10 degrees C. and deactivate at 15 degrees C. However, the micro-controller may also be programmed to activate or deactivate wire heating element 1135 based on a resistance that is stored in the microcontroller from current and voltage that is associated with a specific temperature. The thermistor manufacturer provides the data to make the correlation between the resistance and temperature.

In particular, the heater control is a closed loop controller comprised of a programmable micro controller (already existing in headlamp main PCB), the lens thermistor, a current sensing resistor, a voltage sensor, a mosfet, and the heater wire circuit. The micro-controller monitors the outer lens temperature by calculating the lens thermistor's resistance at regular clock intervals, which has a known correlation to temperature. When the temperature is determined to be at or below a set activation temperature (programmed into the micro-controller), the micro-controller provides a signal to the mosfet which connects one leg of the heater circuit to lamp power (the other leg is connected to ground), therein powering the heater. If the temperature is determined to be above a set deactivation temperature (also programmed into the micro-controller), it provides a signal to the mosfet to disconnect the leg of the heater circuit from power, therein removing any power in the heater circuit. The micro-controller can also modulate power for the purpose of power regulation. Further, the microcontroller calculates heater wire temperature and will regulate heater power to prevent the heater wire from exceeding the melt or softening temperature of the lens material as needed.

The wire heater circuit board contains conductive pads to facilitate heater circuit leads in consideration of the circuit configuration plus two thermistor control leads. The conductive pads may be formed of copper covered nickel coated with gold to provide a non-corroding, malleable surface that is conducive to welding or thermal compression bonding of wire heating element 1135, as well as additional electrical attachment via spring containing (pogo) pins. In general, thermal compression bonding includes applying high temperature and pressure (locally) to mechanically fuse two materials together. Typically, a hard material is superimposed onto the end of a pressing mechanism capable of high pressure with a heating element used to heat the hard material. The two materials desired to be bonded together are pressed together with substantial force while the hard material on the end of the press is heated causing the two materials to bond together at the molecular level. The process can be used to bond similar materials (metal to metal) or dissimilar materials (metal to ceramic) together effectively.

A harness 1160 with universal terminations 1161, 1162 on either end will be used to connect heating element circuit board 1140 and thermistor 1150 to the lamp main circuit board. Termination 1162 of harness 1160 at the main circuit board end will allow for bi-directional attachment to the main circuit board by fixing the locations of the leads on the main circuit board end such that the thermistor leads are each at either extreme end thereof, with a common lead between heater wire circuit board 1140 in the center position, and the remaining ends of the heater wire circuit board 1140 disposed therebetween (blank spaces as may be necessary). The lens side termination 1161 of the harness 1160 shall be fixed in the lamp housing such that lens 1130 requires no hardwire attachment between itself and the lamp main body or components therein, to prevent interfering with the standard process of attaching lens 1130 to the lamp main body. Pins 1165 are used in the lens-side termination 1161 of harness 1160 that connects leads of wire heater circuit board 1140 and thermistor 1150 to the headlamp main circuit board. Specifically, ends of spring pins 1165 contact gold plated pads 1151 on heating element circuit board 1140. Spring pins 1165, as shown in detail in FIG. 16A, are spring loaded with a maximum stroke of 0.090 inches. The spring applies a force to keep the terminals contacting the pads 1151 on circuit board 1140 allowing for a compliant connection. Spring pins 1165 account for thermal expansion, movement due to vibration and/or shock, as well as tolerance stack-up of the assembly. During assembly, spring pins 1165 are installed in an injection molding tool, prior to overmolding material being injected into the cavity. The material (PBT Valox) is injected into the core/cavity of the injection molding tool and completely surrounds the outside body of spring pins to form a rigid body/structure around the pins.

The headlamp housing 1115 is a die-cast housing that functions as a heat sink. The housing 1115 also includes receiving features for harness 1160. In particular, the housing 1115 includes a flat seating plane 1170, two tapered pins 1172, and a guide channel 1173. Harness 1160 includes an over-molded lens-side connector body 1163 with tapered holes 1175, as shown in FIG. 16B, that mate with tapered pins 1172 for the purpose of connector alignment, as well as an extrusion 1177, that fits into the guide channel 1173, as shown in FIGS. 17A-17B, for the purpose of countering the moment created by pressing on spring pins 1165. A moment results in the assembly because the flat seating plane 1170 in the housing, which harness 1160 seats against when installed, provides a normal force that offsets the spring force in the spring pins 1165, which is not directly in-line with that force. The extrusion 1177 on connector body 1163 that fits into guide channel 1173 presses against the side of the channel and creates a coupling force preventing harness 1160 from rotating due to the misalignment of applied spring force and seating plane 1170 normal force.

The area of the lens to be heated is first determined by considering the area(s) of the lens that light passes through for the lamp function(s) that will be active (or desired) when lens heating is necessary. From this data, the required heater power is determined using ambient temperature set to the lowest defined operating temperature of the lamp, an assumed water based contamination layer on the lens exterior (approximately 2 mm thick), lens material and thickness, and required wire spacing (assuming uniform and non-segmented heating is desired). Other considerations include lamp internal air temperature prediction based on the previously listed parameters and heat dissipation from active lamp functions (CFD used for this), time desired/required to remove the water based contamination, assumed air convection coefficient inside and outside of the lamp, latent heat of fusion of ice, density of ice, and heat capacity of all material in the heat transfer paths (including the ice). This information is used to mathematically express heat transfer from the wire to the air (both inside and outside of the lamp) and the amount of energy to raise the temperature of the ice to zero degrees C. and convert the ice to water as a function of time. The mathematical expressions are combined and solved to determine the amount of power required from the heater wire to melt the ice in the desired/required time period so that once the ice is melted, the water runs off the lens due to gravity.

When multiple operating voltages are required, multiple heating element circuits are used and configured in series, parallel, or a combination of series and parallel in order to attain uniform heater power at any of the prescribed input voltages for a linear type heater driver. Alternately, a switcher type driver may be used with a single heater circuit. The inherent resistance of the control system components including the thermistor in the lens must be offset in one of the heating element circuits for systems with multiple heating element circuits to ensure uniform heating between circuits (unless otherwise desired), because that resistance adds to the heating element circuit, therein reducing the amount of current that flows through it compared to other circuits. This is readily achieved by modifying the length of each circuit such that the resistances balance when the control system net resistance is added to one circuit. Straight paths of the heater circuit as embedded into the lens are minimized to reduce the appearance of light infringement within the optical pattern in order to produce a clearer more vivid shape that is more easily perceived by the human eye. Additionally, the embedding process creates a meniscus of lens material along the heater wire. The shape of this meniscus bends light around the wire such that, for a curved path, light bent away from the wire which leaves a void at angle A, will be bent toward a void at angle B, thus reducing the clarity or even eliminating such void.

It will be understood by those skilled in the art that the above disclosure is not limited to the embodiments discussed herein and that other methods of controlling heating element, thermal transfer fluid circulating device, or Peltier heat pump may be utilized. These methods may include manual activation and deactivation of heating element, thermal transfer fluid circulating device, or Peltier device via an on/off switch. Other alternative embodiments include continuous activation of the elements so that LED lamp temperature is high enough to prevent accumulation of water-based contamination but low enough to prevent inadvertent thermal deterioration of the LED lamp and its components.

Claims

1. A headlamp assembly comprising: a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;a heat sink structure having a first surface and a second surface;a main circuit board;a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;a lens affixed to the housing having an inner surface and an outer surface;a wire heating element circuit board affixed to said lens;a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;an encapsulation layer disposed over of the wire heating element;a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board; anda micro-controller for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor.

2. The headlamp assembly of claim 1, wherein the wire heating element comprises a copper core and a silver coating.

3. The headlamp assembly of claim 1, wherein said wire heating element is embedded in said lens at a depth of 2.3×10−3 to 3.5×10−3 inches.

4. The headlamp assembly of claim 1, wherein said wire heating element circuit board is electrically connected to said main circuit board.

5. The headlamp assembly of claim 1, wherein said wire heating element, wire heating element circuit board, and thermistor are embedded in said lens.

6. The headlamp assembly of claim 1, wherein a distance from an outer surface of said thermistor to the outer surface of said lens is no more than one tenth of a distance between said outer surface of the thermistor and the inner surface of said lens, represented by an equation: Do≦( 1/10) Di, where Do=the distance from the thermistor to the outer surface of the lens and Di=the distance between the thermistor and inner lens.

7. The headlamp assembly of claim 1, wherein a harness connects said wire heating element circuit board and thermistor to said main circuit board.

8. The headlamp of claim 7, wherein pins connect said harness to said main circuit board.

9. The headlamp of claim 1, wherein said housing functions as a heat sink.

10. A headlamp assembly comprising: a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;a heat sink structure having a first surface and a second surface;a main circuit board;a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;a lens affixed to the housing having an inner surface and an outer surface;a wire heating element circuit board affixed to said lens;a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;an encapsulation layer disposed over the wire heating element;a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board; anda harness electrically connecting said heating wire element circuit board to said main circuit board.

11. The headlamp of claim 10, wherein said heat sink bisects said housing into upper and lower areas.

12. The headlamp of claim 10, wherein said wire heating element is embedded in said lens at a depth of 2.3×10−3 and 3.5×10−3 inches.

13. The headlamp of claim 10, wherein said wire heating element, wire heating element circuit board and thermistor are embedded in said lens.

14. The headlamp of claim 10, wherein a distance from an outer surface of said thermistor to the outer surface of said lens is no more than one tenth of a distance between said outer surface of the thermistor and the inner surface of said lens, represented by an equation: Do≦( 1/10) Di, where Do=the distance from the thermistor to the outer surface of the lens and Di=the distance between the thermistor and inner lens.

15. The headlamp of claim 10, wherein a plurality of spring loaded pins disposed on said harness connect leads of said wire heating element circuit board and thermistor to the main circuit board.

16. The headlamp of claim 10, wherein said housing includes receiving features adapted to receive said harness.

17. The headlamp of claim 16, wherein said receiving features comprise a flat seating plane, a plurality of tapered pins, and a guide channel.

18. The headlamp of claim 17, wherein said harness includes an extrusion that fits into said guide channel.

19. The headlamp of claim 17, wherein said harness comprises tapered holes that mate with said tapered pins.

20. A headlamp assembly comprising: a housing for coupling the headlamp assembly to a vehicle, the housing including a reflector;a heat sink structure having a first surface and a second surface;a main circuit board;a first light emitting diode assembly supported by the first surface of the heat sink structure and a second light emitting diode assembly supported by the second surface of the heat sink structure, each of the first and second light emitting diode assemblies being electrically connected to the main circuit board;a lens affixed to the housing having an inner surface and an outer surface;a wire heating element circuit board affixed to said lens;a wire heating element embedded within the inner surface of the lens, and electrically coupled to the wire heating element circuit board;an encapsulation layer disposed over the wire heating element;a thermistor affixed to the lens for sensing when the lens reaches a predetermined condition, said thermistor being electrically coupled to said wire heating element circuit board;a harness electrically connecting said heating wire element circuit board to said main circuit board; anda micro-controller for activating or deactivating the wire heating element based on the predetermined condition sensed by the thermistor;wherein said wire heating element, wire heating element circuit board, and thermistor are embedded in said lens.