Headphone assembly

Information

  • Patent Grant
  • D742356
  • Patent Number
    D742,356
  • Date Filed
    Thursday, May 15, 2014
    10 years ago
  • Date Issued
    Tuesday, November 3, 2015
    8 years ago
  • US Classifications
    Field of Search
    • US
    • D14 205
    • D14 223
    • D14 372
    • 181 129000
    • 181 130000
    • 181 135000
    • 379 430000
    • 379 431000
    • 379 420040
    • 381 380000
    • 381 381000
    • 381 382000
    • 351 158000
    • 345 718000
    • 348 114000
    • 348 115000
    • 455 090300
    • 455 575100
    • CPC
    • H04R25/00
    • H04R1/10
  • International Classifications
    • 1401
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a front perspective view of a headphone assembly according to our design shown in a first configuration thereof;



FIG. 2 is a front elevation view thereof;



FIG. 3 is a back elevation view thereof;



FIG. 4 is a right side elevation view thereof;



FIG. 5 is a left side elevation view thereof;



FIG. 6 is a top elevation view thereof;



FIG. 7 is a bottom elevation view thereof;



FIG. 8 is a rear perspective view of the headphone assembly of FIG. 1, shown in a second configuration thereof;



FIG. 9 is a front elevation view thereof;



FIG. 10 is a back elevation view thereof;



FIG. 11 is a right side elevation view thereof;



FIG. 12 is a left side elevation view thereof;



FIG. 13 is a top elevation view thereof; and,



FIG. 14 is a bottom elevation view thereof.


Broken lines are environmental only and form no part of the claimed design.


Claims
  • The ornamental design for a headphone assembly, as shown and described.
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Divisions (1)
Number Date Country
Parent 29459019 Jun 2013 US
Child 29490945 US