1. Field
The embodiments relate to headphone pillows, and more particularly to a wrap-around pillow having repositional headphones.
2. Description of the Related Art
There are many types of headphones that serve the purpose of comfort, relaxation and enjoyment. Headphones can be used in many places and for many reasons. The existing headphones, however, have some limitations. One type of headphone pillow exists where a user must lie down on the pillow and fixed positioned speakers are built into the pillow. Others must remain on a user's ears at all times, as the speakers are immovable. Other types of headphones include speakers that are placed in the ear canal. These, however, can lead to irritation and soreness if left in an ear for a long time, e.g. a full-length movie.
One embodiment includes a headphone pillow having a support portion. The support portion is flexible and has a first end and a second end. A first pillow portion has a first pillow ear portion connected to the first end of the support portion. The first pillow portion has a first pillow receive portion. A second pillow portion has a second pillow ear portion connected to the second end of the support portion. The second pillow portion has a second pillow receive portion. The first pillow portion and the second pillow portion each have a release mechanism. The first pillow ear portion and the second pillow ear portion each have a first side and a second side. The second side of either the first pillow ear portion or the second pillow ear portion is independently removably connected to either the first pillow receive portion or the second pillow receive portion.
Another embodiment includes a headphone including a flexible support. The flexible support is curved. A first pillow portion has a first pillow ear portion connected to a first portion of the flexible support. The first pillow portion has a first pillow receive portion. A second pillow portion has a second pillow ear portion connected to a second portion of the flexible support. The second pillow portion has a second pillow receive portion. A third pillow portion is connected to a third portion of the flexible support. The first pillow ear portion and the second pillow ear portion each have a first side and a second side. The second side is independently removably connected to either of the first pillow receive portion and the second pillow receive portion.
Still another embodiment includes applying a force to a headphone pillow to force the headphone pillow from a first shape to a second shape, and removing the force applied to the headphone pillow. The headphone pillow returns to the first shape when the force is removed from the headphone pillow.
The embodiments discussed herein generally relate to a headphone pillow with repositional headphones. Referring to the figures, exemplary embodiments will now be described. The exemplary embodiments are provided to illustrate the embodiments and should not be construed as limiting the scope of the embodiments.
The invention generally relates to headphone pillows with repositional headphones. Referring to the figures, exemplary embodiments of the invention will now be described. The exemplary embodiments are provided to illustrate the invention and should not be construed as limiting the scope of the invention.
First pillow portion 111 has first pillow receive portion 405 (see
In one embodiment first pillow portion 111 and second pillow portion 112 each have release mechanism 130. First pillow ear portion 111 and second pillow ear portion 112 each has a first side and a second side, and the second side is independently removably connected to either first pillow receive portion 405 and the second pillow receive portion.
In one embodiment headphone pillow 100 is covered in soft material, such as cotton blends, synthetic material (e.g., polyester), neoprene, compressible material, such as a foam polymer type material, velour, terry, etc. In one embodiment, headphone pillow 100 is made of a polymer foam material that is layered and has shape memory. In this embodiment, headphone pillow 100 can be forced into different shapes and into a compressed size. When the force is removed, headphone pillow 100 returns to its original shape and size. In other embodiments, headphone pillow 100 includes filling material. In this embodiment, the filling material can be natural or synthetic. In one embodiment, the filling material can be polystyrene beads, millet seed/hulls, buckwheat seeds/hulls, etc.
In one embodiment headphone pillow 100 includes plug 215 (see
In one embodiment headphone pillow 100 includes earpiece 120 including a headphone speaker 510 (see
First pillow ear portion 110 and second pillow ear portion 113 with earpiece 120 have cushioning disposed between an outer portion and an inner portion to aid in comfort to a person's ear when positioned next to an ear and acts as additional pillow cushioning when folded in a closed position. The inner portion covers earpiece 120. In one embodiment the inner portion is a sound permeable material to protect speaker 510 from contacting a person's ear, dust, liquids, etc. In one embodiment earpiece 120 includes foam padding. In another embodiment, earpiece 120 includes a liquid or gel filled portion for cushioning. In yet another embodiment earpiece 120 includes a sealed air chamber. In another embodiment, ear piece 120 includes an air chamber that can be manually adjusted for the amount of air in the chamber.
One embodiment includes a method of applying a force to headphone pillow 100 to force headphone pillow 100 from a first shape, such as its original shape, to a second shape that is different from its original shape (e.g., compressing, squeezing, etc.). When the force is removed headphone pillow 100 returns to the first shape. The method further includes moving first pillow ear portion 111 from an open position to a locked position. When release tab 130 is pulled, first pillow ear portion returns to the open position.
The method further including storing headphone pillow 100 that is forced into the second shape in a space smaller than headphone pillow 100 can fit when in the first shape.
In one embodiment the composition of the material covering headphone pillow 100 is such that it can be formed by a heat source in a press which molds composite materials. Since this embodiment of headphone pillow 100 is comprised of molded material, headphone pillow 100 has shape “memory.” Therefore, headphone pillow 100 can be folded, twisted, washed, etc., and will retain its original formed shape. In another embodiment headphone pillow 100 is formed from one contiguous molded material formed by heat and pressure applied to the material. Since headphone pillow 100 can be forced into various shapes and sizes, headphone pillow 100 is easily stowed when traveling on a vehicle, such as an airplane, a ship or boat, a bus or car, a motorcycle, a train, etc. It should be noted that when headphone pillow 100 is placed under a force, such as a persons hands clasping or squishing headphone pillow 100, air is removed from the foam polymer layer. This reduces the volume of the foam polymer allowing headphone pillow 100 to displace less volume. When the force is removed, air fills spaces in the foam polymer returning headphone pillow 100 back to its original displacement and original shape.
Reference in the specification to “an embodiment,” “one embodiment,” “some embodiments,” or “other embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiments is included in at least some embodiments, but not necessarily all embodiments. The various appearances of “an embodiment,” “one embodiment,” or “some embodiments” are not necessarily all referring to the same embodiments. If the specification states a component, feature, structure, or characteristic “may”, “might”, or “could” be included, that particular component, feature, structure, or characteristic is not required to be included. If the specification or claim refers to “a” or “an” element, that does not mean there is only one of the element. If the specification or claims refer to “an additional” element, that does not preclude there being more than one of the additional element.
While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that this invention not be limited to the specific constructions and arrangements shown and described, since various other modifications may occur to those ordinarily skilled in the art.