Headphone

Information

  • Patent Grant
  • D823278
  • Patent Number
    D823,278
  • Date Filed
    Friday, August 30, 2013
    11 years ago
  • Date Issued
    Tuesday, July 17, 2018
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D14 205
    • D14 206
    • D14 223
    • 181 129000
    • 181 130000
    • 181 135000
    • 379 430000
    • 379 431000
    • 381 380000
    • 381 381000
    • 381 374000
    • 381 375000
    • 381 074000
    • 455 090300
    • 455 575100
    • D29 112
    • 002 209000
    • CPC
    • H04R1/1066
    • H04R1/1016
    • H04R25/00
    • H04R1/10
    • H04R5/0335
    • H04R5/033
  • International Classifications
    • 1401
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a perspective view of a first embodiment of a headphone showing our new design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a rear elevational view thereof;



FIG. 4 is a left side elevational view thereof;



FIG. 5 is a top plan view thereof; and



FIG. 6 is a bottom plan view thereof.



FIG. 7 is a perspective view thereof wherein the headphone housing is in a first alternate position;



FIG. 8 is a perspective view thereof wherein the headphone housing is in a second alternate position;



FIG. 9 is a perspective view thereof wherein the headphone housing is in a third alternate position;



FIG. 10 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;



FIG. 11 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;



FIG. 12 is a rear elevational view thereof wherein the headphone housing is in the second alternate position; and



FIG. 13 is a rear elevational view thereof wherein the headphone housing is in the third alternate position.



FIG. 14 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.



FIG. 15 is a perspective view of a second embodiment of a headphone showing our new design;



FIG. 16 is a front elevational view thereof;



FIG. 17 is a rear elevational view thereof;



FIG. 18 is a left side elevational view thereof;



FIG. 19 is a top plan view thereof; and



FIG. 20 is a bottom plan view thereof.



FIG. 21 is a perspective view thereof wherein the headphone housing is in a first alternate position;



FIG. 22 is a perspective view thereof wherein the headphone housing is in a second alternate position;



FIG. 23 is a perspective view thereof wherein the headphone housing is in a third alternate position;



FIG. 24 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;



FIG. 25 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;



FIG. 26 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;



FIG. 27 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and



FIG. 28 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.



FIG. 29 is a perspective view of a third embodiment of a headphone showing our new design;



FIG. 30 is a front elevational view thereof;



FIG. 31 is a rear elevational view thereof;



FIG. 32 is a left side elevational view thereof;



FIG. 33 is a top plan view thereof; and



FIG. 34 is a bottom plan view thereof.



FIG. 35 is a perspective view thereof wherein the headphone housing is in a first alternate position;



FIG. 36 is a perspective view thereof wherein the headphone housing is in a second alternate position;



FIG. 37 is a perspective view thereof wherein the headphone housing is in a third alternate position;



FIG. 38 is a perspective view thereof wherein the headphone housing is in a fourth alternate position;



FIG. 39 is a rear elevational view thereof wherein the headphone housing is in the first alternate position;



FIG. 40 is a rear elevational view thereof wherein the headphone housing is in the second alternate position;



FIG. 41 is a rear elevational view thereof wherein the headphone housing is in the third alternate position; and



FIG. 42 is a rear elevational view thereof wherein the headphone housing is in the fourth alternate position.



FIG. 43 is a right side elevational view of the embodiment of FIG. 1;



FIG. 44 is a right side elevational view of the embodiment of FIG. 15; and,



FIG. 45 is a right side elevational view of the embodiment of FIG. 29.


The broken lines illustrating unclaimed portions of the headphone form no part of the claimed design. Dot-dash broken lines illustrating boundaries of the claimed design form no part of the claimed design.


Claims
  • The ornamental design for a headphone, as shown.
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Foreign Referenced Citations (1)
Number Date Country
D1327475 Apr 2008 JP