Claims
- 1. A method of producing a health support device, said method comprising the steps of:pressure-molding a mixture of a titanium oxide powder and a binder to form a molded material; sintering the molded material at a temperature of from 500° C. to 900° C. in one of a vacuum atmosphere, an inert atmosphere, and a reducing atmosphere to obtain a partially-reduced sintered material of titanium oxide; and forming a p-type semiconductor film on a surface of the partially-reduced sintered material of titanium oxide, wherein said partially-reduced sintered material of titanium oxide is a low-order oxide of titanium represented by TiO2−x, where 0<×<0.5.
- 2. A method of producing a health support device, said method comprising the steps of:pressure-molding a mixture of a titanium oxide powder and a hinder to form a molded material; sintering the molded material at a temperature of from 500° C. to 900° C. to obtain a partially-reduced sintered material of titanium oxide; and forming a p-type semiconductor film on a surface of the partially-reduced sintered material of titanium oxide, wherein said partially-reduced sintered material of titanium oxide is a low-order oxide of titanium represented by TiO2−x, where 0<×<0.5.
- 3. The method according to claim 1, wherein said binder is at least one selected from the group consisting of varnishes, starches, and polyvinyl alcohol.
- 4. The method according to claim 2, wherein said binder is at least one selected from the group consisting of varnishes, starches, and polyvinyl alcohol.
- 5. The method according to claim 1, wherein the sintering temperature is at least 600° C.
- 6. The method according to claim 2, wherein the sintering temperature is at least 600° C.
- 7. The method according to claim 3, wherein the sintering temperature is at least 600° C.
- 8. The method according to claim 4, wherein the sintering temperature is at least 600° C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-088738 |
Apr 1998 |
JP |
|
Parent Case Info
This application is a divisional of prior application Ser. No. 09/175,402, filed on Oct. 20, 1998 now U.S. Pat. No. 6,170,487.
US Referenced Citations (6)