Hearing aid adapted for embedded electronics

Information

  • Patent Grant
  • 10051390
  • Patent Number
    10,051,390
  • Date Filed
    Monday, May 15, 2017
    7 years ago
  • Date Issued
    Tuesday, August 14, 2018
    6 years ago
Abstract
A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
Description
TECHNICAL FIELD

The present subject matter relates generally to hearing assistance devices and housings and in particular to method and apparatus for integration of electrical components with hearing assistance device housings.


BACKGROUND

Hearing assistance device manufacturers, including hearing aid manufacturers, have adopted thick film hybrid technologies that build up layers of flat substrates with semiconductor die and passive electronic components attached to each substrate. Manufacturing of such circuits employ technologies, such as, surface mount, flip-chip, or wire-bond that interconnect the various die. Conductors such as wires or flex circuits are attached to pads on the hybrid module after the hybrid module is assembled and tested. The conductors connect various electro-mechanical, electro-acoustical and electro-chemical devices to the active electronics within the hybrid. Connection points may be provided for a battery, receiver/speaker, switch, volume control, microphones, programming interface, external audio interface and wireless electronics including an antenna. Recent advances, such as the addition of wireless technology, have stressed designers' ability to accommodate additional advances using expanded hybrid circuits because of size limitations within a device housing. Growing the hybrid to add features, functions and new interfaces, increases the overall size and complexity of a hearing instrument. Expanding the current hybrid may not be a viable option since the hybrid circuit is made up of finite layers of rectangular planes. The larger, complex circuits compete with most manufacturers' goals of small and easy to use hearing assistance devices and hearing aids.


SUMMARY

The present subject matter relates to hearing aids comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver and a conductive traces integrated with an insulator, the conductive traces adapted to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. In some examples, the insulator includes a hearing aid housing and components of the hearing aid electronics embedded in the hearing aid housing. In some examples, the insulator includes a connector plug to connect a transducer to the hearing aid electronics. In some examples, the connector plug includes an embedded electrical device.


This Summary is an overview of some of the teachings of the present application and not intended to be an exclusive or exhaustive treatment of the present subject matter. Further details about the present subject matter are found in the detailed description and appended claims. The scope of the present subject matter is defined by the appended claims and their legal equivalents.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1A illustrates a portion of a hearing assistance device housing according to one embodiment of the present subject matter.



FIG. 1B shows a three dimensional view of the COI technologies present in the hearing assistance device housing of FIG. 1A according to one embodiment of the present subject matter without the plastic housing portion.



FIGS. 2A and 2B demonstrate various views of a COI application for components according to one embodiment of the present subject matter.





DETAILED DESCRIPTION

The following detailed description of the present invention refers to subject matter in the accompanying drawings which show, by way of illustration, specific aspects and embodiments in which the present subject matter may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present subject matter. References to “an”, “one”, or “various” embodiments in this disclosure are not necessarily to the same embodiment, and such references contemplate more than one embodiment. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope is defined only by the appended claims, along with the full scope of legal equivalents to which such claims are entitled.


The present subject matter provides apparatus and methods for using conductor on insulator technology to provide space saving, robust and consistent electronic assemblies. Although applicable to various types of electronics and electronic devices, examples are provided for hearing assistance devices. In various applications, the insulator is a plastic. In various applications the insulator is a ceramic. Other insulators are possible without departing from the scope of the present subject matter.



FIG. 1A illustrates a portion 100 of a hearing assistance device housing 100 according to one embodiment of the present subject matter. The illustrated housing portion includes a number of conductor-on-insulator (COI) applications. Example applications of COI traces visible in FIG. 1 are contact pads 101, 102 and multi axis traces 103, connected to the contact pads 101. The multi axis traces 103 follow the tight contours of the housing and eliminate the need for bonding wires, a separate substrate, or both, to connect, for example, a transducer or a switch, to the hearing assistance electronics. In various embodiments, electrical components, such as transducers, sensors switches and surface mounted electronics, connect to the contact pads 101, 102 using conductive silicone. Conductive silicone reduces the need for solder and makes the replacement and service of electrical components in the hearing assistance device more efficient.


In the illustrated embodiment, portions of COI traces 105 lead to an integrated capacitor (see for example capacitor 108 on FIG. 1B). Integrating electrical components, such as passive components, with the housing of the hearing assistance device frees up area within the housing and provides additional design freedom to modify the size of the device or add additional features. It is understood that other integrated passive electrical components are possible without departing from the scope of the present subject matter.


This approach also allows the integration of ball grid array component bond pads 106 and connecting traces 107 with the device housing as demonstrated in FIG. 1A. The COI bond pads 106 and traces 107 reduce the need for an additional substrate and bond wires, thus freeing up space within the housing. Such designs can provide for one or more of: smaller housings, additional features, more streamlined manufacturing processes, and/or more consistent performance of the electronics of the device.


FIG, 1B shows a three dimensional view of the COI technologies present in the hearing assistance device housing of FIG. 1A without the plastic housing portion. FIG. 1B includes the multi axis traces 103 and bond pads 101, 102 integrated with the sidewalls of the housing. FIG. 1B also shows the position of the integrated capacitor 108 discussed above and the traces 105 connected to the capacitor. Additional bonding pads 106 for a ball grid array (BGA) component or other surface mounted electronics are illustrated in FIG. 1B. FIG. 1B demonstrates some additional options for design, including, but not limited to, an active component 109 integrated into the device housing, a large bonding pad 110 and distribution trace 111 for a battery, and an inter-cavity conductor 112 and contact pad 113. In one embodiment, active component 109 is a flip chip semiconductor die. Other design options are possible, and those shown herein are intended to demonstrate only some options and are not intended to be an exhaustive or exclusive set of design options.



FIGS. 2A and 2B demonstrate various views of a COI application for components. In the example of FIGS. 2A and 2.B a plug for a hearing assistance device is coated with conductive traces. In one embodiment, the plug is used with a receiver-in-the-canal (RIC) application, such as RIC plug 220. The plug includes a number of conductive traces 221 integrated with the plastic body 222. The illustrated plug is used to connect an OTE or BTE type housing to a RIC device. In this embodiment, the plug includes five (5) traces 221 and contact pads 224 to connect both a receiver (2 traces) and a microphone (3 traces). In the design shown, discrete components, such as a DC blocking capacitor 223 is integrated with the body of the plug. Available space of the plug is better utilized by embedding the passive component 223, in this example a microphone DC blocking capacitor. Integrating components, such as surface mounted electronics, into the plug body frees up volume within the housing of the hearing assistance device. The component 223 can be placed into a cavity with a connector or can be otherwise integrated into the connector using a variety of technologies. The capacitor 223 can either be placed into a cavity within a connector or the capacitor can be completely embedded within the connector using various technologies known in the art. For example, a technology called Microscopic integrated Processing Technology (MIPTEC) available from Panasonic integrates 3-dimensional conductive elements about the surface of various injection molded components. The process includes molding one or more articles, thinly metalizing one or more surfaces using sputter deposition, for example, laser etching conductor patterns in the metallization layer, electroplating the conductors with copper, etching to remove excess metallization material and then electroplating additional conductive material such as nickel and aluminum to form the finished conductors. The process is used to form 3-dimensional conductive traces on plastic and ceramic insulators. Additional technologies, including various Molded Interconnect Device (MID) technologies, are available for integrating and embedding electrical circuit and circuit components with a housing, including, but not limited to, the process described in U.S. Patent Publication 2006/0097376, Leurs, et al., and incorporated by reference herein in its entirety.


Referring again to FIGS. 2A and 2B, in various embodiments, a hearing assistance system includes two plugs. One plug connects wires to the receiver, or RIC device, and the other connects the wires to the housing enclosing the hearing assistance electronics. In various embodiments, conductive silicone is used to electrically connect the plug with the corresponding circuits in a mated connector.


For hearing assistance devices, COI technology provides some benefits including, but not limited to, one or more of: tightly controlled and consistent radio frequency (RF) characteristics due to consistent circuit placement; reduced feedback and/or repeatable feedback performance due to precise transducer lead location; efficient production with substantially fewer manufacturing steps including elimination of manual soldering, wire routing, and related, traditional electronic assembly operations, smaller hearing instruments; possible elimination of wires; possible elimination of the traditional PCB or thick film ceramic substrate; and possibly smaller and/or less expensive hearing instrument components. Such components include, but are not limited to RIC connectors, DAI modules, capacitive switches, or antenna modules,


Examples of hearing assistance device designs benefiting from COI technologies include, but are not limited to, behind-the-ear (BTE) and over-the-ear (OTE) designs as well as the faceplates of in-the-ear (ITE), in-the-canal (ITC) and completely-in-the-canal (CIC) designs. Any hearing assistance device housing and/or connectors can benefit from the teachings provided herein. In a hearing assistance device housing, for example, DSP, memory, and RF semiconductor dies can be flip chip attached and integrated with the hearing instrument housing or spine along with passive components, battery contacts, interconnecting conductor traces, RF antenna, and transducer connectors to reduce the assembly process of the hearing assistance device.


It will be understood by those of ordinary skill in the art, upon reading and understanding the present subject matter that COI technology includes, but is not limited to, conductor-on-plastic (COP) or conductor-on-ceramic (COC) processes, for example. Technologies have been developed, as discussed above, which enable formation of conductive patterns either on or embedded within uniquely shaped plastic or ceramic substrates. Such processes facilitate production of electronic assemblies or components integrated with uniquely shaped plastic or ceramic substrate structures.


The present subject matter includes hearing assistance devices, including, but not limited to, cochlear implant type hearing devices, hearing aids, such as behind-the-ear (BTE), in-the-ear (ITE), in-the-canal (ITC), or completely-in-the-canal (CIC) type hearing aids. It is understood that behind-the-ear type hearing aids may include devices that reside substantially behind the ear or over the ear. Such devices may include hearing aids with receivers associated with the electronics portion of the behind-the-ear device, or hearing aids of the type having receivers in-the-canal. It is understood that other hearing assistance devices not expressly stated herein may fall within the scope of the present subject matter.


This application is intended to cover adaptations and variations of the present subject matter. It is to be understood that the above description is intended to be illustrative, and not restrictive. The scope of the present subject matter should be determined with reference to the appended claim, along with the full scope of equivalents to which the claims are entitled.

Claims
  • 1. A hearing aid comprising: a microphone;a receiver;hearing aid electronics coupled to the microphone and the receiver; andconductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator, wherein the insulator includes a hearing aid housing and wherein the hearing aid housing includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing aid electronics disposed within at least two different cavities of the hearing aid housing.
  • 2. The hearing aid of claim 1, wherein the hearing electronics include a plurality of electronic devices, and wherein an electronic device of the plurality of electronic devices is embedded in the insulator and coupled to one or more of the conductive traces.
  • 3. The hearing aid of claim 2, wherein the electronic device includes a passive surface mount device.
  • 4. The hearing aid of claim 2, wherein the electronic device includes an active device.
  • 5. The hearing aid of claim 2, further comprising conductive silicone to couple the electronic device to the one or more conductive traces.
  • 6. The hearing aid of claim 1, comprising a contact pad trace array integrated with the insulator, the contact pad trace array having a contact array pattern coupled to the conductive traces and configured to receive an electrical component having a ball grid array (BGA) type packaging.
  • 7. The hearing aid of claim 1, wherein the insulator includes plastic.
  • 8. The hearing aid of claim 1, wherein the insulator includes ceramic.
  • 9. The hearing aid of claim 1, wherein the hearing aid housing is a behind-the-ear housing.
  • 10. The hearing aid of claim 1, wherein the hearing aid housing is an in-the-ear housing.
  • 11. The hearing aid of claim 1, wherein the hearing aid housing is an in-the-canal housing.
  • 12. The hearing aid of claim 1, wherein the hearing aid housing is a completely-in-the-canal housing.
  • 13. A method of manufacturing a hearing aid, the method comprising: providing a housing for the hearing aid, the housing including integrated electrical components embedded within a sidewall of the housing; andproviding multi-axis conductive traces along contours of the sidewall of the housing using Molded Interconnect Device (MID) technology, the conductive traces overlaying an insulator and following non-planar contours of the insulator, the conductive traces configured to connect the integrated electrical components to hearing aid electronics within the housing using the conductive traces, wherein the housing includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing aid electronics disposed within at least two different cavities of the housing.
  • 14. The method of claim 13, wherein the integrated electronic components include a passive surface mount device.
  • 15. The method of claim 13, wherein the integrated electronic components includes an active device.
  • 16. The method of claim 13, further comprising integrating a contact pad trace array with the insulator, the contact pad trace array having a contact array pattern coupled to the conductive traces and configured to receive an electrical component having a ball grid array (BGA) type packaging.
  • 17. The method of claim 13, wherein the insulator includes plastic.
  • 18. The method of claim 13, wherein the insulator includes ceramic.
PRIORITY AND RELATED APPLICATIONS

The application is a continuation of U.S. application Ser. No. 14/257,537, filed Apr. 21, 2014, is a continuation of U.S. application Ser. No. 12/539,195, filed Aug. 11, 2009, now issued as U.S. Pat. No. 8,705,785, which application claims the benefit of priority under 35 U.S.C. 119(e) of U.S. Provisional Patent Application Ser. No. 61/087,899, filed Aug. 11, 2008, which application are incorporated herein by reference in their entirety.

US Referenced Citations (104)
Number Name Date Kind
2327320 Shapiro Aug 1943 A
3728509 Shimojo Apr 1973 A
3812300 Brander et al. May 1974 A
4017834 Cuttill et al. Apr 1977 A
4310213 Fetterolf, Sr. et al. Jan 1982 A
4564955 Birch et al. Jan 1986 A
4571464 Segero Feb 1986 A
4729166 Lee et al. Mar 1988 A
5606621 Reiter et al. Feb 1997 A
5640457 Gnecco et al. Jun 1997 A
5687242 Iburg Nov 1997 A
5708720 Meyer Jan 1998 A
5740261 Loeppert et al. Apr 1998 A
5755743 Volz et al. May 1998 A
5802183 Scheller et al. Sep 1998 A
5824968 Packard et al. Oct 1998 A
5825894 Shennib Oct 1998 A
5987146 Pluvinage et al. Nov 1999 A
6031923 Gnecco et al. Feb 2000 A
6167138 Shennib Dec 2000 A
6563045 Goett et al. May 2003 B2
6766030 Chojar Jul 2004 B1
6876074 Kim Apr 2005 B2
6985598 Joschika Jan 2006 B1
7003127 Sjursen et al. Feb 2006 B1
7016512 Feeley et al. Mar 2006 B1
7065224 Cornelius et al. Jun 2006 B2
7110562 Feeley et al. Sep 2006 B1
7139404 Feeley et al. Nov 2006 B2
7142682 Mullenborn et al. Nov 2006 B2
7181035 Van Halteren et al. Feb 2007 B2
7256747 Victorian et al. Aug 2007 B2
7320832 Palumbo et al. Jan 2008 B2
7354354 Palumbo et al. Apr 2008 B2
7446720 Victorian et al. Nov 2008 B2
7460681 Geschiere et al. Dec 2008 B2
7471182 Kumano et al. Dec 2008 B2
7593538 Polinske Sep 2009 B2
7720244 Espersen et al. May 2010 B2
8098863 Ho et al. Jan 2012 B2
8103039 Van Halteren et al. Jan 2012 B2
8116495 Spaulding Feb 2012 B2
8259975 Bally et al. Sep 2012 B2
8295517 Gottschalk et al. Oct 2012 B2
8385573 Higgins Feb 2013 B2
8494195 Higgins Jul 2013 B2
8638965 Higgins et al. Jan 2014 B2
8705785 Link et al. Apr 2014 B2
8781141 Higgins et al. Jul 2014 B2
8798299 Higgins et al. Aug 2014 B1
8861761 Higgins Oct 2014 B2
8908895 Würfel Dec 2014 B2
9049526 Higgins Jun 2015 B2
9654887 Link et al. May 2017 B2
9693154 Higgins et al. Jun 2017 B2
20020061113 Van Halteren et al. May 2002 A1
20020074633 Larson Jun 2002 A1
20020131614 Jakob et al. Sep 2002 A1
20030178247 Saltykov Sep 2003 A1
20030200820 Takad et al. Oct 2003 A1
20040010181 Feeley et al. Jan 2004 A1
20040028251 Kasztelan et al. Feb 2004 A1
20040114776 Crawford et al. Jun 2004 A1
20040240693 Rosenthal Dec 2004 A1
20050008178 Joergensen et al. Jan 2005 A1
20050111685 Gabathuler May 2005 A1
20060008110 Van Halteren Jan 2006 A1
20060018495 Geschiere et al. Jan 2006 A1
20060078142 Neilson Apr 2006 A1
20060097376 Leurs May 2006 A1
20060159298 Von Dombrowski et al. Jul 2006 A1
20070009130 Feeley et al. Jan 2007 A1
20070014423 Darbut et al. Jan 2007 A1
20070036374 Bauman et al. Feb 2007 A1
20070121979 Zhu et al. May 2007 A1
20070147630 Chiloyan Jun 2007 A1
20070188289 Kumano et al. Aug 2007 A1
20070248234 Ho et al. Oct 2007 A1
20080003736 Arai et al. Jan 2008 A1
20080026220 Bi et al. Jan 2008 A9
20080187157 Higgins Aug 2008 A1
20080199971 Tondra Aug 2008 A1
20080260193 Westermann et al. Oct 2008 A1
20090074218 Higgins Mar 2009 A1
20090075083 Bi et al. Mar 2009 A1
20090196444 Solum Aug 2009 A1
20090245558 Spaulding Oct 2009 A1
20090252365 Lin Oct 2009 A1
20090262964 Havenith et al. Oct 2009 A1
20100034410 Douglas et al. Feb 2010 A1
20100074461 Polinske Mar 2010 A1
20100124346 Higgins May 2010 A1
20100135513 Geschiere et al. Jun 2010 A1
20100158291 Polinske et al. Jun 2010 A1
20100158293 Polinske et al. Jun 2010 A1
20100158295 Polinske et al. Jun 2010 A1
20110044485 Lin et al. Feb 2011 A1
20120014549 Higgins et al. Jan 2012 A1
20120263328 Higgins Oct 2012 A1
20130230197 Higgins Sep 2013 A1
20140355803 Higgins et al. Dec 2014 A1
20150086051 Link et al. Mar 2015 A1
20150163601 Higgins Jun 2015 A1
20170359662 Higgins et al. Dec 2017 A1
Foreign Referenced Citations (51)
Number Date Country
1247402 Aug 1967 DE
3006235 Oct 1980 DE
3502178 Aug 1985 DE
3643124 Jul 1988 DE
4005476 Jul 1991 DE
9320391 Sep 1993 DE
4233813 Nov 1993 DE
9408054 May 1994 DE
29801567 May 1998 DE
102008045668 Sep 2008 DE
0339877 Nov 1989 EP
0424916 Jul 1995 EP
0866637 Sep 1998 EP
1065863 Jan 2001 EP
1209948 May 2002 EP
1465457 Oct 2004 EP
1496530 Jan 2005 EP
1209948 Jul 2006 EP
1811808 Jul 2007 EP
1816893 Aug 2007 EP
1850630 Oct 2007 EP
1916561 Apr 2008 EP
1916561 Apr 2008 EP
1920634 Feb 2009 EP
2040343 Mar 2009 EP
2107829 May 2012 EP
2509341 Oct 2012 EP
2160047 Oct 2013 EP
2509341 Jun 2014 EP
1298089 Nov 1972 GB
1522549 Aug 1978 GB
1522549 Aug 1978 GB
2209967 Aug 1990 JP
2288116 Nov 1990 JP
09199662 Jul 1997 JP
WO-9741710 Nov 1997 WO
WO-0079832 Dec 2000 WO
WO-0143497 Jun 2001 WO
WO-2004025990 Mar 2004 WO
WO-06094502 Sep 2006 WO
WO-2006094502 Sep 2006 WO
WO-2007027152 Mar 2007 WO
WO-2007112404 Oct 2007 WO
WO-2007112404 Oct 2007 WO
WO-2007140403 Dec 2007 WO
WO-2007140403 Dec 2007 WO
WO-2007148154 Dec 2007 WO
WO-2008092265 Aug 2008 WO
WO-2008097600 Aug 2008 WO
WO-2008097600 Aug 2008 WO
WO-2011101041 Aug 2011 WO
Non-Patent Literature Citations (129)
Entry
“U.S. Appl. No. 10/894,576, Non-Final Office Action dated Jul. 2, 2007”, 12 pgs.
“U.S. Appl. No. 10/894,576, Non-Final Office Action dated Dec. 18, 2007”, 11 pgs.
“U.S. Appl. No. 10/894,576, Notice of Allowance dated Aug. 5, 2008”, 7 pgs.
“U.S. Appl. No. 10/894,576, Response filed Apr. 18, 2008 to Non-Final Office Action dated Dec. 18, 2007”, 10 pgs.
“U.S. Appl. No. 10/894,576, Response filed Oct. 1, 2007 to Non-Final Office Action dated Jul. 2, 2007”, 10 pgs.
“U.S. Appl. No. 11/857,439, Final Office Action dated Feb. 29, 2012”, 16 pgs.
“U.S. Appl. No. 11/857,439, Non Final Office Action dated Aug. 17, 2011”, 16 pgs.
“U.S. Appl. No. 11/857,439, Notice of Allowance dated May 30, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Notice of Allowance dated Sep. 19, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Response filed Apr. 30, 2012 to Final Office Action dated Feb. 29, 2012”, 9 pgs.
“U.S. Appl. No. 11/857,439, Response filed Jun. 13, 2011 to Restriction Requirement dated May 11, 2011”, 8 pgs.
“U.S. Appl. No. 11/857,439, Response filed Dec. 17, 2011 to Non Final Office Action dated Aug. 17, 2011”, 12 pgs.
“U.S. Appl. No. 11/857,439, Restriction Requirement dated May 11, 2011”, 6 pgs.
“U.S. Appl. No. 12/027,173, Final Office Action dated Dec. 8, 2011”, 12 pgs.
“U.S. Appl. No. 12/027,173, Non Final Office Action dated Jul. 11, 2011”, 10 pgs.
“U.S. Appl. No. 12/027,173, Non Final Office Action dated Jul. 27, 2012”, 11 pgs.
“U.S. Appl. No. 12/027,173, Notice of Allowance dated Mar. 19, 2013”, 8 pgs.
“U.S. Appl. No. 12/027,173, Response filed Jun. 8, 2012 to Final Office Action dated Dec. 8, 2011”, 7 pgs.
“U.S. Appl. No. 12/027,173, Response filed Nov. 14, 2011 to Non Final Office Action dated Jul. 11, 2011”, 8 pgs.
“U.S. Appl. No. 12/027,173, Response filed Dec. 26, 2012 to Non Final Office Action dated Jul. 27, 2012”, 8 pgs.
“U.S. Appl. No. 12/059,578, Notice of Allowance dated Oct. 5, 2011”, 8 pgs.
“U.S. Appl. No. 12/325,838, Non Final Office Action dated Jun. 16, 2011”, 5 pgs.
“U.S. Appl. No. 12/539,195, Advisory Action dated Apr. 23, 2013”, 3 pgs.
“U.S. Appl. No. 12/539,195, Final Office Action dated Feb. 11, 2013”, 15 pgs.
“U.S. Appl. No. 12/539,195, Non Final Office Action dated Jul. 20, 2012”, 13 pgs.
“U.S. Appl. No. 12/539,195, Non Final Office Action dated Aug. 2, 2013”, 14 pgs.
“U.S. Appl. No. 12/539,195, Notice of Allowance dated Nov. 29, 2013”, 12 pgs.
“U.S. Appl. No. 12/539,195, Response filed Apr. 11, 2013 to Final Office Action dated Feb. 11, 2013”, 7 pgs.
“U.S. Appl. No. 12/539,195, Response filed Nov. 4, 2013 to Non Final Office Action dated Aug. 2, 2013”, 7 pgs.
“U.S. Appl. No. 12/539,195, Response filed Dec. 20, 2012 to Non Final Office Action dated Jul. 20, 2012”, 7 pgs.
“U.S. Appl. No. 12/548,051, Final Office Action dated Apr. 19, 2012”, 12 pgs.
“U.S. Appl. No. 12/548,051, Non Final Office Action dated Jan. 24, 2013”, 12 pgs.
“U.S. Appl. No. 12/548,051, Non Final Office Action dated Oct. 12, 2011”, 11 pgs.
“U.S. Appl. No. 12/548,051, Notice of Allowance dated Jul. 31, 2013”, 14 pgs.
“U.S. Appl. No. 12/548,051, Response filed Jan. 12, 2012 to Non Final Office Action dated Oct. 12, 2011”, 9 pgs.
“U.S. Appl. No. 12/548,051, Response filed Apr. 24, 2013 to Non Final Office Action dated Jan. 24, 2013”, 8 pgs.
“U.S. Appl. No. 12/548,051, Response filed Sep. 19, 2012 to Final Office Action dated Apr. 19, 2012”, 8 pgs.
“U.S. Appl. No. 12/644,188, Advisory Action dated Jul. 25, 2013”, 3 pgs.
“U.S. Appl. No. 12/644,188, Final Office Action dated May 22, 2013”, 7 pgs.
“U.S. Appl. No. 12/644,188, Non Final Office Action dated Sep. 9, 2013”, 9 pgs.
“U.S. Appl. No. 12/644,188, Non Final Office Action dated Sep. 19, 2012”, 8 pgs.
“U.S. Appl. No. 12/644,188, Notice of Allowance dated Mar. 21, 2014”, 5 pgs.
“U.S. Appl. No. 12/644,188, Response filed Feb. 19, 2013 to Non Final Office Action dated Sep. 19, 2012”, 6 pgs.
“U.S. Appl. No. 12/644,188, Response filed Jul. 22, 2013 to Final Office Action dated May 22, 2013”, 6 pgs.
“U.S. Appl. No. 12/644,188, Response filed Dec. 9, 2013 to Non Final Office Action dated Sep. 9, 2013”, 6 pgs.
“U.S. Appl. No. 12/842,305, Examiner Interview Summary dated Apr. 19, 2013”, 3 pgs.
“U.S. Appl. No. 12/842,305, Non Final Office Action dated Jan. 17, 2014”, 8 pgs.
“U.S. Appl. No. 12/842,305, Response filed Apr. 8, 2013 to Restriction Requirement dated Feb. 8, 2013”, 6 pgs.
“U.S. Appl. No. 12/842,305, Response filed Apr. 17, 2014 to Non Final Office Action dated Jan. 17, 2014”, 9 pgs.
“U.S. Appl. No. 12/842,305, Restriction Requirement dated Feb. 8, 2013”, 6 pgs.
“U.S. Appl. No. 13/181,752, Final Office Action dated Jul. 11, 2013”, 7 pgs.
“U.S. Appl. No. 13/181,752, Non Final Office Action dated Mar. 5, 2013”, 7 pgs.
“U.S. Appl. No. 13/181,752, Notice of Allowance dated Sep. 25, 2013”, 9 pgs.
“U.S. Appl. No. 13/181,752, Response filed Jun. 5, 2013 to Non Final Office Action dated Mar. 5, 2013”, 8 pgs.
“U.S. Appl. No. 13/181,752, Response filed Sep. 11, 2013 to Final Office Action dated Jul. 11, 2013”, 8 pgs.
“U.S. Appl. No. 13/422,177, Advisory Action dated Jun. 9, 2014”, 3 pgs.
“U.S. Appl. No. 13/422,177, Final Office Action dated Feb. 27, 2014”, 12 pgs.
“U.S. Appl. No. 13/422,177, Non Final Office Action dated Jul. 16, 2014”, 12 pgs.
“U.S. Appl. No. 13/422,177, Non Final Office Action dated Sep. 26, 2013”, 10 pgs.
“U.S. Appl. No. 13/422,177, Notice of Allowance dated Feb. 3, 2015”, 8 pgs.
“U.S. Appl. No. 13/422,177, Response filed Apr. 28, 2014 to Final Office Action dated Feb. 27, 2014”, 9 pgs.
“U.S. Appl. No. 13/422,177, Response filed Oct. 16, 2014 to Non Final Office Action dated Jul. 16, 2014”, 10 pgs.
“U.S. Appl. No. 13/422,177, Response filed Dec. 20, 2013 to Non Final Office Action dated Sep. 26, 2013”, 8 pgs.
“U.S. Appl. No. 13/776,557, Final Office Action dated Mar. 20, 2014”, 8 pgs.
“U.S. Appl. No. 13/776,557, Non Final Office Action dated Oct. 22, 2013”, 6 pgs.
“U.S. Appl. No. 13/776,557, Notice of Allowance dated Jun. 13, 2014”, 8 pgs.
“U.S. Appl. No. 13/776,557, Response dated Jan. 22, 2014 to Non Final Office Action dated Oct. 22, 2013”, 6 pgs.
“U.S. Appl. No. 13/776,557, Response filed May 15, 2014 to Final Office Action dated Mar. 20, 2014”, 7 pgs.
“U.S. Appl. No. 14/257,537, Advisory Action dated Jul. 14, 2016”, 6 pgs.
“U.S. Appl. No. 14/257,537, Advisory Action dated Oct. 21, 2015”, 2 pgs.
“U.S. Appl. No. 14/257,537, Appeal Brief filed Oct. 27, 2016”, 15 pgs.
“U.S. Appl. No. 14/257,537, Decision dated Aug. 15, 2016 on Pre-Appeal Brief Request filed Jul. 27, 2016”, 4 pgs.
“U.S. Appl. No. 14/257,537, Final Office Action dated Apr. 27, 2016”, 20 pgs.
“U.S. Appl. No. 14/257,537, Final Office Action dated Aug. 3, 2015”, 16 pgs.
“U.S. Appl. No. 14/257,537, Non Final Office Action dated Mar. 19, 2015”, 19 pgs.
“U.S. Appl. No. 14/257,537, Non Final Office Action dated Nov. 17, 2015”, 20 pgs.
“U.S. Appl. No. 14/257,537, Pre-Appeal Brief Request filed Jul. 27, 2016”, 4 pgs.
“U.S. Appl. No. 14/257,537, Response filed Feb. 17, 2016 to Non Final Office Action dated Nov. 17, 2015”, 19 pgs.
“U.S. Appl. No. 14/257,537, Response filed Jun. 19, 2015 to Non Final Office Action dated Mar. 19, 2015”, 6 pgs.
“U.S. Appl. No. 14/257,537, Response filed Jun. 27, 2016 to Final Office Action dated Apr. 27, 2016”, 8 pgs.
“U.S. Appl. No. 14/257,537, Response filed Oct. 5, 2015 to Final Office Action dated Aug. 3, 2015”, 8 pgs.
“U.S. Appl. No. 14/257,537, Response filed Nov. 3, 2015 to Advisory Action dated Oct. 21, 2015”, 8 pgs.
“U.S. Appl. No. 14/301,103, Advisory Action dated Jun. 10, 2016”, 3 pgs.
“U.S. Appl. No. 14/301,103, Final Office Action dated Mar. 25, 2016”, 11 pgs.
“U.S. Appl. No. 14/301,103, Non Final Office Action dated Dec. 2, 2015”, 9 pgs.
“U.S. Appl. No. 14/301,103, Non-Final Office Action dated Jul. 28, 2016”, 10 pgs.
“U.S. Appl. No. 14/301,103, Notice of Allowance dated Feb. 15, 2017”, 8 pgs.
“U.S. Appl. No. 14/301,103, Preliminary Amendment filed Jul. 1, 2014”, 5 pgs.
“U.S. Appl. No. 14/301,103, Response filed Mar. 2, 2016 to Non Final Office Action dated Dec. 2, 2015”, 6 pgs.
“U.S. Appl. No. 14/301,103, Response filed May 25, 2016 to Final Office Action dated Mar. 25, 2016”, 7 pgs.
“U.S. Appl. No. 14/301,103, Response filed Oct. 28, 2016 to Non-Final Office Action dated Jul. 28, 2016”, 6 pgs.
“U.S. Appl. No. 14/512,560, Non Final Office Action dated Jan. 29, 2016”, 9 pgs.
“U.S. Appl. No. 15/632,742, Preliminary Amendment filed Sep. 5, 2017”, 6 pgs.
“European Application Serial No. 12167845.2, Extended EP Search Report dated Sep. 12, 2012”, 6 pgs.
“European Application Serial No. 08253065.0, European Examination Notification dated Oct. 11, 2011”, 7 pgs.
“European Application Serial No. 08253065.0, European Office Action dated Aug. 26, 2010”, 6 Pgs.
“European Application Serial No. 08253065.0, Extended Search Report dated Dec. 15, 2008”, 9 pgs.
“European Application Serial No. 08253065.0, Office Action dated Jul. 17, 2009”, 1 pg.
“European Application Serial No. 08253065.0, Response filed Jan. 16, 2010 to Office Action dated Jul. 17, 2009”, 9 pgs.
“European Application Serial No. 08253065.0, Response filed Feb. 8, 2012 to Examination Notification dated Oct. 11, 2011”, 15 pgs.
“European Application Serial No. 08253065.0, Response to Office Action filed Feb. 28, 2011 to European Office Action dated Aug. 26, 2010”, 17 pgs.
“European Application Serial No. 08725262.3, EPO Written Decision to Refuse dated Oct. 19, 2012”, 14 pgs.
“European Application Serial No. 08725262.3, Office Action dated Apr. 21, 2010”, 6 Pgs.
“European Application Serial No. 08725262.3, Office Action dated Aug. 5, 2011”, 5 pgs.
“European Application Serial No. 08725262.3, Response filed Feb. 13, 2012 to Office Action dated Aug. 5, 2011”, 11 pgs.
“European Application Serial No. 08725262.3, Response filed Nov. 2, 2010 to Office Action dated Apr. 21, 2010”, 14 pgs.
“European Application Serial No. 08725262.3, Summons to Attend Oral Proceedings dated Jun. 6, 2012”, 5 pgs.
“European Application Serial No. 09168844.0, European Search Report dated Apr. 19, 2010”, 3 Pgs.
“European Application Serial No. 09168844.0, Office Action dated Apr. 8, 2013”, 5 pgs.
“European Application Serial No. 09168844.0, Office Action dated Apr. 28, 2011”, 5 pgs.
“European Application Serial No. 09168844.0, Office Action dated May 14, 2012”, 2 pgs.
“European Application Serial No. 09168844.0, Office Action dated May 3, 2010”, 5 pgs.
“European Application Serial No. 09168844.0, Response filed Feb. 24, 2012 to Office Action dated Apr. 28, 2011”, 12 pgs.
“European Application Serial No. 09168844.0, Response filed Jul. 24, 2012 to Examination Notification Art. 94(3) dated May 14, 2012”, 10 pgs.
“European Application Serial No. 09168844.0, Response filed Nov. 15, 2010 to Office Action dated May 3, 2010”, 8 pgs.
“European Application Serial No. 09250729.2, Extended Search Report dated Dec. 14, 2009”, 4 pgs.
“European Application Serial No. 10251319.9, Office Action dated Jan. 3, 2012”, 6 pgs.
“European Application Serial No. 10251319.9, Response filed Jul. 24, 2012 to Extended European Search Report dated Jan. 3, 2012”, 10 pgs.
“European Application Serial No. 12160102.5, Extended European Search Report dated Sep. 7, 2016”, 8 pgs.
“European Application Serial No. 12167845.2, Response filed Apr. 10, 2013 to Extended European Search Report dated Sep. 12, 2012”, 14 pgs.
“European Application Serial No. 09168844.0, Office Action dated Sep. 4, 2012”, 4 pgs.
“European Application Serial No. 09168844.0, Response filed Mar. 14, 2013 to Office Action dated Sep. 4, 2012”, 34 pgs.
“International Application Serial No. PCT/US2008/001609, International Preliminary Report on Patentability dated Aug. 20, 2009”, 10 pgs.
“International Application Serial No. PCT/US2008/001609, Search Report dated Jun. 19, 2008”, 7 pgs.
“International Application Serial No. PCT/US2008/001609, Written Opinion dated Jun. 19, 2008”, 8 pgs.
Buchoff, L S, “Advanced Non-Soldering Interconnection”, Electro International, 1991 (IEEE), XP 10305250A1, (1991), 248-251.
P, “U.S. Appl. No. 14/257,537, Notice of Allowance dated Jan. 13, 2017”, 10 pgs.
Tondra, Mark, “Flow Assay With Integrated Detector”, U.S. Appl. No. 60/887,609, filed Feb. 1, 2007, 28 pgs.
“U.S. Appl. No. 15/632,742, Non Final Office Action dated Feb. 7, 2018”, 11 pgs.
Related Publications (1)
Number Date Country
20170318402 A1 Nov 2017 US
Provisional Applications (1)
Number Date Country
61087899 Aug 2008 US
Continuations (2)
Number Date Country
Parent 14257537 Apr 2014 US
Child 15595302 US
Parent 12539195 Aug 2009 US
Child 14257537 US