Claims
- 1. A heat activatable thermoplastic adhesive composition comprising: (a) 100 parts by weight of a thermoplastic polymer; (b) about 1 to 100 parts by weight of an organic polymer having a plurality of functional groups available for crosslinking reactions, said organic polymer being selected from the group consisting of hydroxy-substituted polyesters, hydroxylated acrylates and polyamines; and (c) a sufficient amount of crosslinking agent capable of effecting the desired degree of crosslinking of said organic polymer; said adhesive composition exhibiting delayed tack on heat activation and exhibiting high temperature resistance.
- 2. A heat activatable thermoplastic adhesive composition in accordance with claim 1, wherein said thermoplastic polymer is selected from the group consisting of polyesters, polyurethanes, polyamides, rubbers and ethylene vinylacetates.
- 3. A heat activatable thermoplastic adhesive composition in accordance with claim 1, wherein said crosslinking agent is selected from the group consisting of diisocyanates and polyisocyanates.
- 4. A heat activatable thermoplastic adhesive composition in accordance with claim 1, wherein said first part comprises a tackifying resin.
- 5. A heat activable thermoplastic adhesive composition comprising: (a) 100 parts by weight of a thermoplastic polymer selected from the group consisting of thermoplastic polyurethanes, thermoplastic polyamides, and ethylene vinylacetates; (b) about 1 to 100 parts by weight of an organic polymer having a plurality of functional groups available for crosslinking reactions; and (c) a sufficient amount of crosslinking agent capable of effecting the desired degree of crosslinking of said organic polymer; said adhesive composition exhibiting delayed tack on heat activation and exhibiting high temperature resistance.
- 6. A heat activatable thermoplastic adhesive composition in accordance with claim 5, wherein said organic polymer is selected from the group consisting of polyalcohols and polyamines.
- 7. A heat activatable thermoplastic adhesive composition in accordance with claim 5, wherein said first part comprises a tackifying resin.
- 8. A heat activatable thermoplastic adhesive composition in accordance with claim 5, wherein said crosslinking agent is selected from the group consisting of diisocyanates and polyisocyanates.
- 9. A heat activable thermoplastic adhesive composition comprising:
- (a) 100 parts by weight of a thermoplastic segmented copolyester consisting essentially of from about 5 to 75 percent by weight of amorphous ester units and 95 to 25 percent by weight of crystallizable ester units joined through ester linkages, the crystallizable ester units being of the formula: ##STR7## and the amorphous ester units being of the formula: ##STR8## wherein R.sub.1 consists of residues of one or more diacids selected from saturated aliphatic dicarboxylic acids containing from 4 to 10 carbon atoms and aromatic dicarboxylic acids selected from terephthalic acid, isophthalic acid, phthalic acid, 4,4'-benzophenone dicarboxylic acid, 4,4'-diphenylmethane dicarboxylic acid, 4,4'-diphenylether dicarboxylic acid, 4,4'-diphenylamine dicarboxylic acid, R.sub.2 consists of residues of one or more saturated aliphatic diols containing from 2 to 12 carbon atoms, R.sub.3 is R.sub.1 or R.sub.5, R.sub.4 is R.sub.2 or R.sub.6, R.sub.5 consists of the divalent radicals containing from about 22 to 50 carbon atoms which remain after removal of the carboxyl groups from saturated aliphatic dimer acids and R.sub.6 consists of the divalent radicals remaining after removal of the hydroxyl groups of long chain aliphatic diols having an average molecular weight of 200 to 4000, provided that at least one of R.sub.3 and R.sub.4 in each amorphous ester unit is R.sub.5 or R.sub.6, and provided that when R.sub.1 is aromatic, R.sub.2 contains from 6 to 12 carbon atoms and the amorphous content is 50-75 percent by weight, the said copolyester having a DTA melting temperature of from about 25.degree. to 150.degree. C., an inherent viscosity of at least 0.5 dl/g at 25.degree. C., as measured in 0.3 g/dl solutions of polymer in chloroform at 25.degree. C., and substantially complete solubility in toluene at 25.degree. C. in the ratio of about 1 percent by weight of copolyester and 90% by weight of solvent;
- (b) about 1 to 100 parts by weight of an organic polymer having an average hydroxyl functionality of greater than two available for crosslinking reactions; and
- (c) a sufficient amount of an isocyanate crosslinking agent to provide about 0.5 to 4 equivalents of NCO for each equivalent of --OH contained in (a) and (b); said adhesive composition exhibiting delayed tack on heat activation and exhibiting high temperature resistance.
- 10. A heat activatable thermoplastic adhesive composition in accordance with claim 9, wherein said segmented copolyester comprises adipic acid, the C.sub.36 dimer acid of linoleic acid, 1,4-cyclohexane dimethanol, and poly(oxytetramethylene) glycol residues.
- 11. A heat activatable thermoplastic adhesive composition in accordance with claim 9, wherein said organic polymer is hydroxy-substituted polyester.
- 12. A heat activatable thermoplastic adhesive composition in accordance with claim 9, wherein said organic polymer comprises radicals of diglycidyl ester of bisphenol A and a C.sub.36 dimer acid of linoleic acid.
- 13. A heat activatable thermoplasic adhesive composition in accordance with claim 9, wherein said crosslinking agent is a polyisocyanate.
- 14. A heat activatable thermoplastic adhesive composition in accordance with claim 9, wherein said crosslinking agent is selected from the group consisting of polymethylene polyphenylisocyanate and modified diphenylmethane diisocyanate.
- 15. A heat activatable thermoplastic adhesive composition in accordance with claim 9, wherein said first part comprises a tackifying resin.
- 16. A method of bonding, said method comprising:
- (a) applying a heat activatable thermoplastic adhesive composition to the surface of a substrate to be bonded,
- (b) heating said adhesive composition to a temperature at or above the crystalline melt temperature of said adhesive composition,
- (c) allowing said adhesive composition to cool below said crystalline melt temperature,
- (d) contacting said adhesive composition with the surface of a second substrate during the open time of said adhesive composition,
- (e) maintaining said adhesive composition and said substrates in contact until said adhesive composition has reverted to a non-tacky state,
- wherein said adhesive composition comprises the reaction product of:
- (a) 100 parts by weight of a thermoplastic polymer;
- (b) about 1 to 100 parts by weight of an organic polymer having a plurality of functional groups available for crosslinking reactions; and
- (c) a sufficient amount of crosslinking agent capable of effecting the desired degree of crosslinking of said organic polymer;
- said adhesive composition exhibiting delayed tack on heat activation and exhibiting high temperature resistance.
- 17. A method of bonding in accordance with claim 16, wherein said thermoplastic polymer is a polyester and said organic polymer is a hydroxy-substituted polyester.
- 18. A process for preparing heat activatable thermoplastic adhesive composition, comprising combining:
- (a) 100 parts by weight of a thermoplastic segmented copolyester consisting essentially of from about 5 to 75 percent by weight of amorphous ester units and 95 to 25 percent by weight of crystallizable ester units joined through ester linkages, the crystallizable ester units being of the formula: ##STR9## and the amorphous ester units being of the formula: ##STR10## wherein R.sub.1 consists of residues of one or more diacids selected from saturated aliphatic dicarboxylic acids containing from 4 to 10 carbon atoms and aromatic dicarboxylic acids selected from terephthalic acid, isophthalic acid, phthalic acid, 4,4'-benzophenone dicarboxylic acid, 4,4'-diphenylmethane dicarboxylic acid, 4,4'-diphenylether dicarboxylic acid, 4,4'-diphenylthioether dicarboxylic acid and 4,4'-diphenylamine dicarboxylic acid, R.sub.2 consists of residues of one or more saturated aliphatic diols containing from 2 to 12 carbon atoms, R.sub.3 is R.sub.1 or R.sub.5, R.sub.4 is R.sub.2 or R.sub.6, R.sub.5 consists of the divalent radicals containing from about 22 to 50 carbon atoms which remain after removal of the carboxyl groups from saturated aliphatic dimer acids and R.sub.6 consists of the divalent radicals remaining after removal of the hydroxyl groups of long chain aliphatic diols having an average molecular weight of 200 to 4000, provided that at least one of R.sub.3 and R.sub.4 in each amorphous ester unit is R.sub.5 or R.sub.6, and provided that when R.sub.1 is aromatic, R.sub.2 contains from 6 to 12 carbon atoms and the amorphous content is 50-75 percent by weight, the said copolyester having a DTA melting temperature of from about 25.degree. to 150.degree. C., an inherent viscosity of at least 0.5 dl/g at 25.degree. C., as measured in 0.3 g/dl solutions of polymer in chloroform at 25.degree. C., and substantially complete solubility in toluene at 25.degree. C. in the ratio of about 10 percent by weight of copolyester and 90% by weight of solvent;
- (b) about 1 to 100 parts by weight of a hydroxy-substituted polyester having an average hydroxyl functionality of greater than two available for crosslinking reactions; and
- (c) a sufficient amount of an isocyanate crosslinking agent to provide about 0.5 to 4 equivalents of NCO for each equivalent of --OH contained in (a) and (b);
- said adhesive composition exhibiting delayed tack on heat activation and exhibiting high temperature resistance.
- 19. A heat activatable composition in accordance with claim 1, wherein said organic polymer and said crosslinking agent are pre-reacted.
- 20. A heat activatable composition in accordance with claim 5, wherein said organic polymer and said crosslinking agent are pre-reacted.
- 21. A heat activable composition in accordance with claim 9, wherein said organic polymer and said crosslinking agent are pre-reacted.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation of application Ser. No. 247,251 filed Mar. 25, 1981, now abandoned, which is a continuation of Ser. No. 173,178 filed Aug. 5, 1980 now abandoned, which is a continuation-in-part application of Ser. No. 078,596 filed Sept. 14, 1979 now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2257501 |
May 1974 |
DEX |
54-7441 |
Jan 1979 |
JPX |
Continuations (2)
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Number |
Date |
Country |
Parent |
247251 |
Mar 1981 |
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Parent |
173178 |
Aug 1980 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
78596 |
Sep 1979 |
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