Claims
- 1. A method of applying heat to a selected object comprising the steps of:
- (a) forming a microwavable pad having a liquid and a liquid absorbing means sealed within an envelope in which the absorbing means is compressed within the envelope to less than its non-compressed size;
- (b) subjecting the pad to microwave radiation; and
- (c) placing the irradiated pad against the object to heat the same.
- 2. The method of claim 1 wherein the step of subjecting the pad to microwave radiation comprises the step of placing the pad in a microwave oven.
- 3. The method of claim 1 wherein the step of subjecting the pad to microwave radiation comprises subjecting the pad to microwave radiation for approximately five minutes.
- 4. The method of claim 1 wherein the step of forming a microwavable pad comprises the steps of:
- (a) applying pressure to said envelope to compress the contents thereof; and
- (b) closing and sealing said envelope while said liquid absorbing means remains compressed.
- 5. The method of claim 4 wherein the step of applying a vacuum pressure to said filled envelope comprises applying a vacuum pressure of twenty-four inches of mercury as measured on a vacuum gauge to said envelope.
- 6. The method of claim 5 wherein the step of allowing said vacuum pressure to compress said liquid absorbing means comprises allowing said vacuum pressure to compress said liquid absorbing means to 50% of its original size.
- 7. A method of heat application comprising the steps of:
- (a) forming a microwavable pad having a liquid and a liquid absorbing means sealed within an envelope in which the absorbing means is compressed within the envelope to less than its non-compressed size;
- (b) subjecting the pad to microwave radiation;
- (c) applying the irradiated pad in contact with an object to be heated; and
- (d) allowing the irradiated pad to heat the object.
Parent Case Info
This is a continuation of application Ser. No. 08/085,570 filed Jun. 30, 1993, now U.S. Pat. No. 5,300,105, which was a continuation of application Ser. No. 07/871,826 filed Apr. 21, 1992 now abandoned, which was a continuation of Ser. No. 07/643,344 filed Jan. 22, 1991 now abandoned, which was a continuation-in-part of application Ser. No. 07/486,806 filed Feb. 26, 1990 also now abandoned.
US Referenced Citations (56)
Foreign Referenced Citations (1)
Number |
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2503-993 |
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FRX |
Non-Patent Literature Citations (2)
Entry |
Pending patent application Ser. No. 07/969,959 filed 03 Dec. 1992. |
Prior art pad. |
Continuations (3)
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Date |
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Parent |
85570 |
Jun 1993 |
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Parent |
871826 |
Apr 1992 |
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Parent |
643344 |
Jan 1991 |
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Continuation in Parts (1)
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486806 |
Feb 1990 |
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