Heat-curable epoxy resin systems having a good reactivity/stability ratio

Abstract

Heat-curable epoxy resin systems comprising(a) at least one epoxy resin,(b) at least one polycarboxylic acid anhydride, and(c) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing accelerator, andwherein one portion of the curing accelerator (c) is replaced by(d) a complex of a boron halide with an amine,have good reactivity at elevated temperatures and comparatively high stability at temperatures below c. 80.degree. C.

Description

Claims

1. A process for fabricating molded objects using a heat-curable epoxy resin system comprising (a) at least one epoxy resin, (b) at least one polycarboxylic acid anhydride, and (c) a combination of (1) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane and (2) a complex of boron trichloride with N,N-dimethyloctylamine as a curing accelerator, wherein the weight ratio of (1) to (2) ranges from 8/92 to 75/25 , which comprises mixing at least some of the epoxy resin and at least some of (b) and (c) at a temperature below the curing temperature, and introducing said mixture under normal or elevated pressure, into a mold in which the temperature is sufficiently high to effect cure of the resin molding material.

2. A process according to claim 1, wherein uncured resin molding material is continuously introduced into the mold in such an amount as to compensate for any shrinkage of the resin molding material in the mold occurring in the course of the cure.