Heat dissipating assembly

Information

  • Patent Grant
  • D566828
  • Patent Number
    D566,828
  • Date Filed
    Friday, October 27, 2006
    18 years ago
  • Date Issued
    Tuesday, April 15, 2008
    16 years ago
  • US Classifications
    Field of Search
    • US
    • D23 370
    • D23 411
    • D23 377
    • 415 176000
    • 415 177000
    • 415 178000
    • 415 211200
    • 361 697000
    • 361 695000
    • 165 080300
    • 165 121000
  • International Classifications
    • 2304
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a perspective view of a heat dissipating assembly showing our new design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a rear elevational view thereof;



FIG. 4 is a right side elevational view thereof, the left side being a mirror image;



FIG. 5 is a top plan view thereof; and,



FIG. 6 is a bottom plan view thereof.


Claims
  • The ornamental design for a heat dissipating assembly, as shown and described.
Priority Claims (1)
Number Date Country Kind
95302317 May 2006 TW national
US Referenced Citations (6)
Number Name Date Kind
D481452 Luo Oct 2003 S
D491260 Luo Jun 2004 S
D509580 Lin Sep 2005 S
7025125 Sheng et al. Apr 2006 B2
7130192 Wang et al. Oct 2006 B2
7218518 Chin et al. May 2007 B2