BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:
FIG. 1 is an assembled perspective view illustrating the combination of a heat-dissipating backlighting module a flat panel display in accordance with the prior art;
FIG. 2 is an exploded perspective view illustrating a heat-dissipating backlighting module and a flat panel display in accordance with a first embodiment of the present invention;
FIG. 3 is an assembled, cross-sectional view illustrating the assembled relation of the heat-dissipating backlighting module and the flat panel display in accordance with the first embodiment of the present invention;
FIG. 4 is an assembled, cross-sectional view, similar to FIG. 3, illustrating the assembled relation of the heat-dissipating backlighting module and the flat panel display in accordance with the second embodiment of the present invention;
FIG. 5 is an exploded perspective view illustrating the heat-dissipating backlighting module and the flat panel display in accordance with the third embodiment of the present invention; and
FIG. 6 is an assembled, cross-sectional view, similar to FIG. 3, illustrating the assembled relation of the heat-dissipating backlighting module and the flat panel display in accordance with the third embodiment of the present invention;
DETAILED DESCRIPTION OF THE INVENTION
Referring now to FIGS. 2 and 3, views of a heat-dissipating backlighting module in accordance with the first embodiment of the present invention are illustrated. The heat-dissipating backlighting module designated numeral 1 generally includes a heat-dissipating plate designated numeral 11 and a back light unit designated numeral 12. The heat-dissipating plate 11 and the back light unit 12 are assembled to form the heat-dissipating backlighting module 1 that is combined with a rear surface of a flat panel display designated numeral 2. In operation, the heat-dissipating backlighting module 1 functions as a light source that projects light on the flat panel display 2. In a preferred embodiment, the heat-dissipating backlighting module 1 is applied to the flat panel display 2 which is generally selected from a liquid crystal display (“LCD”) or a plasma display panel (“PDP”).
Still referring to FIGS. 2 and 3, construction of the heat-dissipating plate 11 shall be described in detail. In this preferred embodiment, the heat-dissipating plate 11 is made from a metal such as aluminum, copper, gold, silver or alloy thereof having a good thermal conductivity. The heat-dissipating plate 11 includes a plurality of vertically extended air-circulating channels 110, a plurality of vertically extended fins 111, at least one assembling compartment 112 and at least one supporting wall 113. The heat-dissipating plate 11 has a first side and a second side opposite to the first side. In a preferred embodiment, the vertically extended air-circulating channels (i.e. grooves) 110 are integrally recessed and extended in parallel on the first side of the heat-dissipating plate 11. Also, the vertically extended fins 111 are integrally protruded and extended in parallel on the first side of the heat-dissipating plate 11. The two adjacent fins 111 define each of the vertically extended air-circulating channels 110. In this manner, the combination of the vertically extended air-circulating channels 110 and vertically extended fins 111 constitute a vertically extended air-cooling structure. When heating the heat-dissipating plate 11, airflows may dissipate away heats from the vertically extended air-circulating channels 110 and vertically extended fins 111 to the ambient environment.
On the other hand, formed on the second side of the heat-dissipating plate 11 are the assembling compartment 112 and supporting wall 113. To provide an assembling space for receiving the back light unit 12, there provides the assembling compartment 112. Preferably, the assembling compartment 112 is extended in a longitudinal or lateral direction of the heat-dissipating plate 11. In a preferred embodiment, the assembling compartment 112 is integrally formed on the second side of the heat-dissipating plate 11, and the supporting walls 113 confine each of the assembling compartments 112. The supporting wall 113 is of an annular wall having a predetermined height that sufficiently receives the entire thickness of the back light unit 12 such that no portion of the back light unit 12 extends beyond the height of the supporting wall 113 when the heat-dissipating plate 11 and back light unit 12 are assembled to form the heat-dissipating backlighting module 1. Accordingly, the back light unit 12 is completely received in the assembling compartment 112. However, the back light unit 12 preferably has a height to provide a consistent height with a top surface of the supporting wall 13. In assembling operation, the supporting wall 113 of the heat-dissipating plate 11 is engaged with the rear surface of the flat panel display 2 so as to intensify the assembled relationship of the heat-dissipating backlighting module 1 and the flat panel display 2.
The construction of the back light unit 12 shall be described in detail, by still referring to FIGS. 2 and 3. Once assembled, the back light unit 12 is received in the assembling compartment 112 of the heat-dissipating plate 11. In the first embodiment, the back light unit 12 includes a substrate 120, at least one illumination device 121 and at least one conductive member 122. The substrate 120 may be constructed from a printed circuit board (“PCB”) or a flexible printed circuit board. Preferably, the substrate 120 is mounted on a bottom surface of the assembling compartment 112 by means of adhesion or screw connection. The illumination device 121 is arranged on the substrate 120 and constructed from a series of LEDs, white LED for example, which are preferably equi-spaced on the substrate 120. The conductive member 122 is preferably selected from a printed circuit if the substrate 120 is constructed from the printed circuit board or flexible printed circuit board. The conductive member 122 electrically connects the illumination device 121 with an exterior control circuit (not shown). In an alternative embodiment, the conductive member 122 is selected from an enameled wire according to the design needs.
Still referring to FIG. 3, when assembling the heat-dissipating backlighting module 1 and the flat panel display 2, the supporting wall 113 of the heat-dissipating plate 11 is engaged with the rear surface of the flat panel display 2. The back light unit 12 emits white light to penetrate through the flat panel display 2 such that images may appear on a front surface of the flat panel display 2. Meanwhile, heats generated from the illumination device 121 of the back light unit 12 are directly transmitted from the assembling compartment 112 to the vertically extended air-cooling structure of the heat-dissipating plate 11 due to the fact that the heat-dissipating plate 11 has a good thermal conductivity. Subsequently, the vertically extended air-circulating channels 110 and vertically extended fins 111 can dissipate the heats to the ambient environment by means of the action of air convection. In heat-dissipating operation, cooling airflows may automatically pass the vertically extended air-circulating channels 110 and vertically extended fins 111 in a vertical direction (indicated by the direction arrows in FIG. 3) to accomplish heat exchange in an efficient manner. Advantageously, the vertically extended air-cooling structure may enhance the efficiency of heat dissipation by allowing the airflow to run upwardly. The heat-dissipation operation will be further described in greater detail below.
With continued reference to FIG. 3, cool air may enter the heat-dissipating backlighting module 1 from a bottom portion of the vertically extended air-circulating channels 110 of the heat-dissipating plate 11 which is placed in an upright position. Once entered, the cool air automatically runs upwardly and passes the vertically extended air-circulating channels 110 and vertically extended fins 111 for accomplishing heat exchange. The heated air exchanged from the vertically extended air-cooling structure may be discharged from a top portion of the vertically extended air-circulating channels 110 in the event for dissipating heats to the ambient environment. A continuous heat exchange in the heat-dissipating backlighting module 1 is helpful in transmitting heats from the substrate 120 and illumination device 121 of the back light unit 12 to the heat-dissipating plate 11. In this way, the combination of heat conduction in the heat-dissipating plate 11 with heat exchange on the vertically extended air-cooling structure carries out a higher efficiency of heat dissipation in the heat-dissipating backlighting module 1. In a preferred embodiment, a fan unit (not shown) is provided in a casing (not shown) of the flat panel display 2 for ventilation purpose if desired. The fan unit may be disposed at the bottom portion of the vertically extended air-circulating channels 110 when the heat-dissipating plate 11 is positioned in the upright position. Preferably, the fan unit is helpful in enhancing the efficiency of heat exchange by forcing the air entering the heat-dissipating backlighting module 1 and discharging therefrom. It is apparent from FIG. 2 that no additional fan unit is applied in practicing the heat-dissipating backlighting module 1 in accordance with the first embodiment of the present invention. In addition, the entire back light unit 12 is completely embedded in the assembling compartment 112 that can reduce the entire thickness of the heat-dissipating backlighting module 1.
Turning now to FIG. 4, an assembled, cross-sectional view, similar to FIG. 3, of the assembled relation of the heat-dissipating backlighting module and the flat panel display in accordance with the second embodiment of the present invention is illustrated. In comparison with the first embodiment, the back light unit 12 of the second embodiment provides the illumination device 121 and conductive member 122 directly mounted on the bottom surface of the assembling compartment 112 for accomplishing a simplified structure that omits the arrangement of the substrate 120 in the first embodiment. Preferably, the conductive member 122 is selected from an enamel-insulated wire having insulating layer coated thereon. In the preferred embodiment, the back light unit 12 is mounted on the bottom surface of the assembling compartment 112 by adhesion, engagement or snap fitting. Advantageously, the design of the back light unit 12 of the second embodiment can omit a specific thickness occupied by the substrate 120 for reducing the total thickness; or the design of the back light unit 12 is suitable for accommodating a large size of the illumination device 121.
Turning now to FIGS. 5 and 6, views of the heat-dissipating backlighting module in accordance with the third embodiment of the present invention are illustrated. In comparison with the first and second embodiments, the heat-dissipating backlighting module 1 of the third embodiment further includes an assembling rack 13 mounted on the heat-dissipating plate 11. The assembling rack 13 provides at least one assembling space 130 for receiving the illumination device 121. In assembling, one side of the assembling rack 13 is mounted to the rear surface of the flat panel display 2 while the other side is combined with a set of the heat-dissipating plates 11. Consequently, the assembling rack 13 is sandwiched in-between the heat-dissipating plates 11 and the flat panel display 2.
In the third embodiment, the assembling rack 13 is made from a metal or alloy (e.g. aluminum, copper, gold, silver or alloy thereof) having a good thermal conductivity. In this way, the heat-dissipating plates 11 and assembling rack 13 are separately made from similar or dissimilar materials. In an alternative embodiment, the assembling rack 13 is made from a non-metal material such as plastic or foam material. Formed in the combination of the heat-dissipating plates 11 and assembling rack 13 is a set of assembling compartments for correspondingly accommodating a set of the back light units 12. Preferably, the back light units 12 may not extended beyond a thickness of the assembling rack 13. When the heat-dissipating plates 11 are connected each other in a common plane, the vertically extended air-circulating channels 110 and vertically extended fins 111 of the heat-dissipating plate 11 is aligned with those of the adjacent heat-dissipating plate 11. Each of the back light units 12 has a substrate 120 directly mounted on the corresponding heat-dissipating plate 11. Advantageously, the combination of the heat-dissipating plates 11 and assembling rack 13 of the third embodiment can accomplish an increase of the efficiency of heat dissipation, and reduce the total thickness of the heat-dissipating backlighting module 1.
As has been discussed above, the conventional heat-dissipating backlighting module results in an unbalanced distribution of the efficiency of heat dissipation due to the arrangement of the heat sink sets 93 and heat-dissipating fans 94, as shown in FIG. 1. Conversely, the first side of the heat-dissipating plate 11 of the present invention is formed with the vertically extended air-circulating channels 110 and vertically extended fins 111 while the second side is formed with the assembling compartment 112, as best shown in FIG. 2. In the heat-dissipating backlighting module 1, airflows can automatically run upwardly and pass through the vertically extended air-circulating channels 110 and vertically extended fins 111. Advantageously, the combination of the heat-dissipating plate 11 and back light unit 12 can simplify the structure, enhance the efficiency of heat dissipation and reduce the total thickness of the heat-dissipating backlighting module 1.
Although the invention has been described in detail with reference to its presently preferred embodiment, it will be understood by one of ordinary skill in the art that various modifications can be made without departing from the spirit and the scope of the invention, as set forth in the appended claims.
Patent Application
20070274051
