BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view showing a first embodiment in accordance with the present invention.
FIG. 2 is an assembled perspective view showing the first embodiment in accordance with the present invention.
FIG. 3 is an exploded perspective view showing a second embodiment in accordance with the present invention.
FIG. 4 is an assembled perspective view showing the second embodiment in accordance with the present invention.
FIG. 5 is an exploded perspective view showing a third embodiment in accordance with the present invention.
FIG. 6 is an assembled perspective view showing the third embodiment in accordance with the present invention.
FIG. 7 is a cross-sectional view showing the structure of a heat sink in accordance with the present invention.
FIG. 8 is an exploded perspective view showing the assembling relationship of a conventional heat sink and a memory.
FIG. 9 is a perspective view showing a conventional heat sink and a memory after they are assembled.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
FIG. 1 is an exploded perspective view illustrating a first embodiment of a heat-dissipating device 1 used for a memory 2 according to the present invention. The heat-dissipating device 1 comprises two heat sinks 11, which is made of material with high thermal conductivity such as copper or aluminum. The heat sink 11 has a plurality of protrusions on one side. In the first embodiment, the protrusions are combs 12A. They can also be shorter in length or in spherical shapes such as raised dots (not shown). Part of the other side of the heat sink 11 is a flat surface 15. The thickness of the heat sink is not necessary to be uniform. The shape of the heat sink can be a cube, a grooved plate with raised edges or the like. A plurality of extended edges 16 extends vertically from one edge of the heat sink 11 towards the flat surface 15. The extended edges 16 of the two heat sinks 11 are staggered in such a manner that they can be fitted complementarily together. In order to fix the two heat sinks 11 together, a fixation space 13 is left between the combs 12A for mounting a clamping member 3, and has a locking wedge 14 thereon.
The memory 2 generally comprises a circuit board, and a plurality of chips 21 disposed on the circuit board. The package of the memory comprises a plurality of electrical connecting pins 22. The two heat sinks 11 mentioned above are symmetrically arranged at both sides of the memory 2. The flat surfaces 15 of both the heat sinks 11 are in contact with both sides of the memory 2 respectively. And then, the U-shaped clamping member 3 clamps on the fixation spaces 13 of the two heat sinks 11. The locking wedges 14 on the fixation space 13 are inserted into the locking holes 31 at both sides of the clamping member 3 to make a joint. Therefore the two heat sinks 11 are held at both sides of the memory 2. The assembled memory and heat sinks are shown in FIG. 2.
Referring to FIGS. 3 and 4, the protrusions on the heat sink 11 are a plurality of fins 12B that are parallel with the length direction (i.e. the axial direction) of the heat sink 11 according to a second embodiment of the present invention. The fixation spaces 13 separate the axial fins 12B into a plurality of partitions. The clamping members 3B according to the second embodiment are clips, which are used to hold the two heat sinks 11 at both sides of the memory 2.
Referring to FIGS. 5 and 6, the protrusions on the heat sink 11 are a plurality of fins 12C that are perpendicular to the length direction (i.e. the lateral direction) of the heat sink 11 according to a third embodiment of the present invention. The fixation space 13 separates the lateral fins 12C into a plurality of partitions. The fixation space 13 according to the third embodiment is provided with a clip as the clamping member 3B to hold the two heat sinks 11 at both sides of the memory 2.
The various heat sinks 11 in accordance with the aforementioned embodiments of the present invention are integrally manufactured. Referring to FIG. 7, the heat sinks 11 are made of plates with appropriate thickness H to store heat. The heat is transferred to the protrusions and then dissipated into the surrounding environment, thereby achieving an excellent heat-dissipating effect. If heat sinks 11 are made of copper, the manufacturing process can be forging, powder metallurgy, extrusion or the like. If the heat sinks 11 are made of aluminum, the manufacturing process can be forging, casting, extrusion or the like.
Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.
Patent Application
20080011453
