1. Field of the Invention
The invention relates to a heat dissipating device, more particularly to a heat dissipating device for a central processing unit (CPU).
2. Description of the Related Art
Central processing units (CPUs) of computers can generate a lot of heat during operation, which is required to be removed therefrom using a heat dissipating device so as to ensure stable operation of the computers.
Conventional water-cooling heat dissipating devices normally include tubes for passage of circulating water therethrough. The tubes are arranged to form a tortuous channel, and are supported on two opposite base plates. Since the heat dissipating device is relatively small, welding of the tubes on the base plates is relatively inconvenient.
Therefore, the object of this invention is to provide a heat dissipating device that is capable of overcoming the aforesaid drawback associated with the prior art.
Accordingly, a heat dissipating device of this invention includes: a plurality of conduits stacked one above the other, each of the conduits being in fluid communication with an adjacent one of the conduits and including upper and lower halves, each of the upper and lower halves including a flat base wall that has a peripheral edge, two opposite end portions, and an intermediate portion extending between the end portions, each of the upper and lower halves further including a flange that extends from the peripheral edge of the base wall and that cooperates with the base wall to define a chamber half therebetween, and two protrusions that protrude respectively and outwardly of the chamber half from the end portions of the base wall, at least one of the protrusions of each of the upper and lower halves of each of the conduits being formed with a through-hole, the protrusions of each of the upper and lower halves of each of the conduits being connected respectively to the protrusions of an adjacent one of the upper and lower halves of an adjacent one of the conduits in such a manner so as to permit fluid communication between two adjacent ones of the conduits; and a plurality of heat dissipating fin units, each of which is disposed between two adjacent ones of the conduits, and each of which is in contact with two adjacent ones of the intermediate portions of the base walls of the upper and lower halves of two adjacent ones of the conduits.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
Referring to FIGS. 1 to 5, the preferred embodiment of a heat dissipating device according to the present invention is shown to include: a plurality of conduits 2 stacked one above the other, each of the conduits 2 being in fluid communication with an adjacent one of the conduits 2 and including upper and lower halves 20, each of the upper and lower halves 20 including a flat base wall 201 that has a peripheral edge, two opposite end portions 23, 24, and an intermediate portion 25 extending between the end portions 23, 24, a flange 200 that extends from the peripheral edge of the base wall 201 and that cooperates with the base wall 201 to define a chamber half 207 therebetween, and two protrusions 202 that protrude respectively and outwardly of the chamber half 207 from the end portions 23, 24 of the base wall 201, at least one of the protrusions 202 of each of the upper and lower halves 20 of each of the conduits 2 being formed with a through-hole 203, the protrusions 202 of each of the upper and lower halves 20 of each of the conduits 2 being connected respectively to the protrusions 202 of an adjacent one of the upper and lower halves 20 of an adjacent one of the conduits 2 in such a manner so as to permit fluid communication between two adjacent ones of the conduits 2; and a plurality of heat dissipating fin units 5, each of which is disposed between two adjacent ones of the conduits 2, and each of which is in contact with two adjacent ones of the intermediate portions 25 of the base walls 201 of the upper and lower halves 20 of two adjacent ones of the conduits 2.
In this embodiment, each of the upper and lower halves 20 of each of the conduits 2 is made from a punched metal plate. It is noted that each of the topmost and the bottommost conduits 2 includes only one of the upper and lower halves 20.
After the conduits 2 are stacked one above the other, and are welded to each other, the chamber halves 207 of the upper and lower halves 20 of each of the conduits 2 cooperatively define a fluid chamber 208 in the respective one of the conduits 2. The conduits 2 are arranged in such a manner that the fluid chambers 208 are formed into a tortuous fluid channel (the flow directions in the conduits 2 are indicated by the arrows shown in
Referring back to
The heat dissipating device is further formed with a coolant inlet 26 (see
Since the first seam 205 is formed around peripheral edges of the flanges 200 of the upper and lower halves 20 of each of the conduits 2 and since the second seam 206 is formed around peripheral edges of each welded pair of the protrusions 202, the welding operation for forming the first and second seams 205, 206 is more convenient to conduct as compared to the welding of the tubes on the base plates of the aforesaid conventional heat dissipating devices.
With the invention thus explained, it is apparent that various modifications and variations can be made without departing from the spirit of the present invention.