Patent Application
20200232714
The technical field relates to a heat dissipation technology, and more particularly to a heat dissipating device.
As the computing speed of electronic components continues to increase, the heat generated by the electronic components is getting higher and higher. To effectively overcome the issue of high heat generation, related manufacturers have designed various different types of heat dissipating devices for cooling. However, the present existing heat dissipating devices still require further improvements in actual applications.
In general, a conventional heat dissipating device includes a heat sink and a fan, and the heat sink is roughly divided into two main types including an aluminum extruded heat sink and a stacked heat sink, wherein the aluminum extruded heat sink has the advantages of easy manufacture and light weight, but its heat conduction and dissipation performance are much lower than those of the stacked heat sink of the same volume. On the other hand, the stacked heat sink also has the issues of heavy weight, complicated structure, and high cost.
In view of the aforementioned drawbacks of the conventional heat dissipating devices, the discloser of this disclosure based on years of experience in the related industry to conduct extensive research and experiment, and finally provided a feasible solution to overcome the drawbacks of the prior art.
Therefore, it is a primary object of this disclosure to provide a heat dissipating device capable of improving the heat conduction and dissipation speed of the extruded heat sink and the overall heat dissipation performance of the heat dissipating device.
To achieve the aforementioned and other objectives, this disclosure provides a heat dissipating device comprising an extruded heat sink and a fan, and the extruded heat sink comprises a base, a plurality of cooling fins extending outwardly from the periphery of the base, a vacuum chamber directly formed in the base, and a capillary tissue disposed in the vacuum chamber and filled with a working fluid, wherein the fan is mounted onto the extruded heat sink.
This disclosure has the following effects. With the vacuum chamber formed in the base, the heat dissipating device of this disclosure not just can conduct heat by a gas-liquid phase change only, but also can reduce the total weight significantly and achieve the advantages of simple structure, easy manufacture, and low cost. Each support column and the capillary tissue are attached to each other, and such arrangement not just can fix the capillary tissue only, but also can return the liquefied working fluid quickly. The design of the rotating direction of the impeller being opposite to that of each cooling fin allows the airflow blown from the impeller to enter into the intervals of the cooling fins in order to carry away the heat of each cooling fin quickly.
The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
With reference to
The extruded heat sink 10 is extruded and made of a material such as aluminum, copper, or their alloys, and the extruded heat sink 10 comprises a base 11 and a plurality of cooling fins 12, wherein the base 11 of this embodiment is in a circular shape, but this disclosure is not limited to this shape only, and an accommodating groove 111 is formed directly in the base 11 and a cover 115 is installed at an open end of the accommodating groove 111, so that a vacuum chamber A is formed and enclosed between the accommodating groove 111 and the cover 115, and a working fluid 13 is filled into the vacuum chamber A.
A capillary tissue 112 is distributed on an upper wall and a peripheral wall of the accommodating groove 111, wherein the capillary tissue 112 is made of a material such as a metal powder sintered substance or a woven mesh, and the cover 115 is made of a material such as a material such as aluminum, copper, or their alloys, and the cover 115 comprises a bottom plate 116 and a plurality of support columns 117 extending outwardly from the bottom plate 116, and an another capillary tissue 118 is distributed on the bottom plate 116 and a surface of each support column 117, wherein such capillary tissue 118 is also made of a material such as a metal powder sintered substance or a woven mesh, and each support column 117 and the other capillary tissue 118 are attached to the capillary tissue 112 in the accommodating groove 111, so that a liquefied working fluid 13 can return quickly through the capillary suction of the capillary tissue 112 and the other capillary tissue 118.
Each cooling fin 12 extends outwardly from the periphery of the base 11 in a radial form, and each cooling fin 12 and the base 11 are integrally formed; each cooling fin 12 has a connection end 121 and a free end 122 disposed away from the connection end 121, and the connection end 121 is coupled to the periphery of the base 11. Wherein, the circular base 11 has a central axis, and each free end 122 is formed around the central axis of the base 11 and bent in a clockwise or counterclockwise direction. In this embodiment, the free end 122 is bent in the clockwise direction.
Further, the extruded heat sink 10 further comprises a plurality of arms 14 spaced from one another and disposed between the cooling fins 12, and an end of each arm 14 extends outwardly from the periphery of the base 11, and the end of each arm 14 away from the base 11 has a first fixing hole 141 and a second fixing hole 142, and a screw element 15 is passed through the first fixing hole 141 to mount and fix the fan 20 onto the top of the extruded heat sink 10, and another screw element is passed through the second fixing hole 142 to install and fix the heat dissipating device onto a circuit board (not shown in the figure).
In this embodiment, the fan 20 comprises a fan frame 21 and an impeller 22 installed in the fan frame 21, wherein the outer periphery of the fan frame 21 has a plurality of hollow columns 211, and each hollow column 211 is passed and coupled to the screw element 15 to mount the fan 20 onto the top of the extruded heat sink 10.
Further, the fan 20 is an axial flow fan, and the rotating direction of the impeller 22 is opposite to the rotating direction of each cooling fin 12, so that the airflow blown from the impeller 22 can enter into the intervals between the cooling fins 12 and carry away or dissipate the heat from each cooling fin 12 quickly.
With reference to
In summation of the description above, the heat dissipating device of this disclosure can surely achieve the expected effects and overcome the drawbacks of the prior art, and this disclosure also complies with patent application requirements, and thus is duly filed for patent application.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
