Patent Application
20200333083
The invention relates to coolers, particularly to a heat dissipating module with two vapor chambers.
With unceasing upgrade of electronic components, their produced heat becomes higher and higher. To solve this problem of high produced heat, the industries combine heat pipes and vapor chambers into coolers to improve efficiency of heat dissipation.
However, condensing ends of heat pipes or vapor chambers of such conventional coolers are connected to fins, but these fins can dissipate heat only by pressure difference caused by environmental temperature variation, so efficiency of heat dissipation of fins is limited considerably. As a result, heat is accumulated at the condensing ends of heat pipes or vapor chambers and finally the cooling effect malfunctions.
An object of the invention is to provide a heat dissipating module, which uses a heat pipe and fins to connect between two vapor chambers so as to improve performance of heat transfer and dissipation.
To accomplish the above object, the heat dissipating module of the invention includes a lower vapor chamber, an upper vapor chamber, a heat pipe and fins. The lower and upper vapor chambers have a first chamber and a second chamber, respectively. The upper vapor chamber is disposed over the upper vapor chamber. The heat pipe is connected between the lower vapor chamber and the upper vapor chamber and has a third chamber. The first chamber, the second chamber and the third chamber communicate with each other. The fins are parallelly upright connected between the lower vapor chamber and the upper vapor chamber. Upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.
According to the above description, the fins and the heat pipe are located between the two vapor chambers, heat absorbed by the lower vapor chamber can be dissipated by both thermal conductions caused by environmental temperature variation via the fins and heat transfer by the heat pipe and the upper vapor chamber through circulation of working fluid. The latter makes the heat transferred to both the upper vapor chamber and the outside. As a result, great performance and efficiency of heat transfer and dissipation can be obtained.
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The lower vapor chamber 1 has a first chamber 11. The upper vapor chamber 2 is disposed over the upper vapor chamber 1. The upper vapor chambers 2 has a second chamber. The heating element 100 is attached on the lower vapor chamber 1.
The heat pipe 3 is connected between the lower vapor chamber 1 and the upper vapor chamber 2 and has a third chamber 31. The heat pipe 3 corresponds to the heating element 100 in position as shown in
The fins 4 are parallelly upright connected between the lower vapor chamber 1 and the upper vapor chamber 2. Upper ends and lower ends of the fins 4 connect to the upper vapor chamber 2 and the lower vapor chamber 1, respectively. Parts of the fins 4 connect to the heat pipe 3.
The fins 4 are connected to the lower chamber 1, the upper chamber 2 and the heat pipe 3 in one-piece molding, but not limited to this. The fins 4 may be inserted into the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3.
In detail, the lower vapor chamber 1 has a first side 12 and a second side 13, which are opposite to each other. The lower vapor chamber 1 further has a middle section 14 between the first side 12 and the second side 13. The heat pipe 3 is one in number and is disposed in the middle section 14.
The heat dissipating module 10 further includes a wick structure 5 and working fluid. The wick structure 5 is attached on inner sides of the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3. The working fluid is received in the first chamber 11, the second chamber 21 and the third chamber 3. The wick structure 5 is one or more of grooves, mesh, fibers, sintered powder and waved plates.
The fins 4 and the heat pipe 3 are located between the two vapor chambers 1 and 2, and heat absorbed by the lower vapor chamber 1 can be dissipated by both thermal conductions caused by environmental temperature variation via the fins 4 and heat transfer by the heat pipe 3 and the upper vapor chamber 2 through circulation of working fluid. The latter makes the heat transferred to both the upper vapor chamber 2 and the outside. As a result, great performance and efficiency of heat transfer and dissipation can be obtained.
In addition, the wick structure 5 is attached on inner sides of the lower vapor chamber 1, the upper vapor chamber 2 and the heat pipe 3, so that the working fluid absorbs heat from the lower vapor chamber 1 and then flows to the upper vapor chamber 2 to condense through the heat pipe 3. The two vapor chambers 1 and 2 obtain an effect of rapid heat transfer.
Furthermore, the heat pipe 3 corresponds to the heating element 100 in position as shown in
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It will be appreciated by persons skilled in the art that the above embodiments have been described by way of example only and not in any limitative sense, and that various alterations and modifications are possible without departure from the scope of the invention as defined by the appended claims.
