1. Field of the Invention
The present invention relates generally to heat-dissipating modules, and more particularly, to structure of a heat-dissipating module.
2. Description of the Related Art
Referring to
As we know, the heat is transferred by the contact between the substrate 2, the upper plate 2, and the heat pipes 4. Basically, the larger the contact area between them is, the more efficient the thermal dissipation will be. However, the contact area between the substrate 2, the upper plate 3, and the heat pipes 4 of the aforementioned conventional heat-dissipating module 1 is limited to provide efficient thermal dissipation. In other words, the conventional heat-dissipating module 1 is defective in small contact area and inefficient thermal dissipation.
The primary objective of the present invention is to provide a heat-dissipating module, which provides larger contact area to have preferable heat-dissipating efficiency.
The foregoing objective of the present invention is attained by the heat-dissipating module composed of a heat-dissipating member and at least one heat pipe. The heat-dissipating member includes a pillared convexity and an annular groove formed on and surrounding the heat-dissipating member. The at least one heat pipe passes through the annular groove, partially surrounding the convexity and stopped against the convexity.
In light of the above structure, the contact area between the heat-dissipating member and the heat pipe is greatly enhanced to facilitate transferring heat from the heat-dissipating member to the heat pipe. Therefore, the present invention has more efficient thermal dissipation than the prior art did.
Referring to
The heat-dissipating member 20 at its bottom side is in contact with a top side of a chip (not shown) for transferring outside heat generated by the chip. The heat-dissipating member 20 includes a pillared convexity 22 and two annular grooves 24 formed on the convexity 22. The convexity 22 includes a column-shaped middle part. The two annular grooves 24 parallel surround the middle part of the convexity 22.
The two heat pipes 30 are mounted to the convexity 22, passing through the two annular grooves 24 respectively. A midsection of each of the heat pipes 30 partially surrounds the convexity 22. Each of the heat pipes 30 is curved around the convexity 22 for an angle larger than 180 degrees and is rotatable on the annular groove 24 with respect to the convexity 22. A plurality of fins 40 are mounted in parallel to external distal ends of the heat pipes 30 for outward dissipation of the heat of the heat pipes 30. The midsection of each of the heat pipes 30 is stopped against the convexity 22 for conducting the heat of the pillared convexity 22 to the fins 40.
In this way, the heat-dissipating module 10 can enlarge the contact area between the heat pipes 30 and the convexity 22 of the heat-dissipating member 20 to speed up the transmission of the heat from the heat-dissipating member 20 to the heat pipes 30. Compared with the prior art, the present invention indeed has higher heat-dissipating efficiency. In addition, the heat pipes 30 are adjustable in orientation subject to the user's requirement to have operational convenience.
Referring to
Referring to
Although the present invention has been described with respect to specific preferred embodiments thereof, it is no way limited to the details of the illustrated structures but changes and modifications may be made within the scope of the appended claims.
Number | Date | Country | Kind |
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97205586 | Apr 2008 | TW | national |