Patent Application
20140063806
1. Field of the Invention
The present invention relates to a heat-dissipating structure and more particularly to a heat-dissipating structure for an LED (light-emitting diode) lamp.
2. Description of the Related Art
To cope with global energy depletion, the government of every country stipulates different policies advocating for energy conservation. In response to the call, LED appears to be the lighting element receiving the most attention recently. Many electronic appliances developed with LED, such as LED televisions, LED lamps and the like, are widely favored by consumers.
The development of LED lamps has become increasingly mature in recent years, and LED lamps are commonplace everywhere. Regular families prefer LED bulbs more because users can perfectly mount the LED bulbs in the original light bulb sockets without replacing the original lamp set, thereby saving users' effort and expense.
When LEDs are powered on to emit light, lots of heat is generated. If not quickly dissipated, the heat will be accumulated. The temperature rise caused by the accumulated heat will finally destroy the LEDs. To tackle such issue, manufacturers of LED lamps attempt to improve the heat dissipation by changing the structure of the LED lamps externally. With reference to
Although the conventional LED lamp can dissipate heat through the heat sink 92, it is more likely than not that the heat generated by the light source substrate 90 and the power conversion device 91 is still accumulated in the chamber 94 to cause high temperature rise as the heat sink 92 only contacts peripheries of the light source substrate 90 and the power conversion device 91. If the accumulated heat inside the chamber 94 is not dissipated soon enough, the light source substrate 90 or the power conversion device 91 can be easily damaged. Besides, the heavy heat sink 92 also caused inconvenience in assembly of the LED lamp.
An objective of the present invention is to provide a heat-dissipating structure for LED lamp capable of rapidly dissipating heat through a heat convection effect.
To achieve the foregoing objective, the heat-dissipating structure for LED lamp has a lamp cover, a ceramic substrate and a power conversion device.
The lamp cover has a peripheral wall, multiple heat-dissipating holes and multiple mounting ears. The heat-dissipating holes are formed through the peripheral wall.
Each mounting ear is formed on an edge of one of the heat-dissipating holes, and is bent inwardly with the heat-dissipating hole uncovered.
The ceramic substrate is mounted inside the lamp cover, is securely mounted on the mounting ears, and has multiple light-emitting diodes (LEDs) mounted thereon.
The power conversion device is mounted on the lamp cover, faces the ceramic substrate, and is electrically connected to the LEDs on the ceramic substrate.
An LED lamp having the foregoing heat-dissipating structure acquires the mains power through the power conversion device and transmits the converted power to the ceramic substrate so that each LED on the ceramic substrate is turned on to emit light. The heat generated when each LED emits light is first absorbed by the ceramic substrate and the remaining heat is conducted to the mounting ears and the entire lamp cover. The heat absorbed by the ceramic substrate and generated when the power conversion device converts the mains power is transferred to the heat convection space, which is defined between the ceramic substrate and the lamp cover, through the heat convection effect and is further dissipated to ambient air around the LED lamp through the heat-dissipating holes of the lamp cover. Accordingly, the heat generated when the LEDs are lit and when the power conversion device converts the mains power is not accumulated and can be quickly dissipated. Also because the lamp cover has no heat sink or other heat-dissipating module mounted thereon, the LED lamp is light in weight.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
With reference to
The lamp cover 10 is funnel-shaped and has multiple heat-dissipating holes 11 and multiple mounting ears 12. The heat-dissipating holes 11 are formed through a peripheral wall of the lamp cover 10. Each mounting ear 12 is formed on an edge of one of the heat-dissipating holes 11, is bent inwardly with the corresponding heat-dissipating hole 11 uncovered, and has a through hole 121 formed through the mounting ear 12. In the present embodiment, the lamp cover 10 is made of an aluminum material.
The power conversion device 20 is mounted inside a power cap 21, is located inside the lamp cover 10, and converts an AC power acquired from the mains power into a DC power as an operating power to the LED lamp. The power cap 21 has a cable hole 22 formed through the power cap 21 for at least one power cable 23 to penetrate through the power cap 21, and is electrically insulating to avoid the risk of electric shock.
The ceramic substrate 30 is mounted inside the lamp cover 10, is securely connected with the mounting ears 12, faces the power conversion device 20, and has an air passage hole 32, multiple threaded holes 31, multiple bolts 33 and multiple LEDs 35. The air passage hole 32 is centrally formed through the ceramic substrate 30. Each threaded hole 31 is formed through the ceramic substrate 30 to correspond to the through hole 121 of a corresponding mounting ear 12. Each bolt 33 is mounted through one of the threaded holes 31 of the ceramic substrate and the through hole 121 of a corresponding mounting ear 12 and is screwed with a nut 34. The LEDs 35 are mounted on the ceramic substrate 30. In the present embodiment, the ceramic substrate 30 is made of a ceramic material, has a good heat-dissipating capability, and is electrically insulating, thereby avoiding power to be transmitted to the lamp cover 10 through the ceramic substrate 30 and the risk of electric shock. With reference to
An LED lamp having the foregoing heat-dissipating structure acquires the mains power through the power conversion device 20 and transmits the converted power to the ceramic substrate 30 through the at least one power cable 23 so that each LED 35 on the ceramic substrate 30 is turned on to emit light. Since the ceramic substrate 30 is made of a ceramic material and thus has an optimal heat-dissipating effect and the mounting ears 12 contact the ceramic substrate 30, the heat generated when each LED emits light is first absorbed by the ceramic substrate 30 and the remaining heat is conducted to the mounting ears 12 and the entire lamp cover 10. The heat on the lamp cover 10 is transferred to the ambient air. A heat convection space 40 is defined between the ceramic substrate 30 and the lamp cover 10. With reference to
With reference to
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
