Patent Application
20100243211
1. Field of the Invention
The present invention generally relates to a heat sink, and more particularly to a heat dissipating structure disposed in a high power light emitting diode (LED) lamp.
2. Description of Prior Art
There are many projector lamps, which are applied as lighting devices in many places such as exhibitions, stores, etc., on the market.
The technology of light emitting diodes (LEDs) grows and becomes mature because of the features of low power consumption, long service life, small size and quick response. The LED lamps gradually substitute traditional light bulbs and are extensively used in various lighting devices. However, high power of the LEDs brings the problem of heat dissipation. It needs to be considered about the heat dissipating structure of the high power LEDs applied in the projector lamps.
With reference to
It is a primary object of the invention to provide a heat dissipating structure of a high power LED projector lamp, which can effectively dissipate the heat of a high power LED to improve the heat dissipating efficiency without an additional fan.
Another object of the invention is to provide a heat dissipating structure of a high power LED projector lamp, which can reduce the size of the LED projector lamp.
To achieve the foregoing objects, the present invention provides a heat dissipating structure of a high power LED projector lamp comprising a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is provided with a plurality of grooves for being embedded by one end of the plate type heat pipe, where those two are perpendicular to one another. Furthermore, the heat dissipating fins are stacked with an inclined angle and parallelly arranged with gaps, in which the heat dissipating fins have a plurality of slots for accommodating the plate type heat pipe. Hence, the heat generated from the high power LEDs can be conducted quickly and the heat conduction efficiency will be improved.
In comparison with the conventional LED projector lamp, the present invention can promote the heated air within the gaps to rise by disposing the slant heat dissipating fins on both sides of the plate type heat pipe. It can not only rapidly conduct the heat generated from the high power LED but also improve heat conduction efficiency of the heat dissipating fins. Moreover, the integrated exterior size and its occupying space can be reduced because the heat dissipating fins are aslant stacked at intervals. Because the heat dissipating structure of the present invention has the plate type heat pipe conducting heat rapidly and the heat dissipating fins having large heat-dissipating areas, it can dissipate the heat of high power LEDs by natural convection without consuming any electricity.
The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of preferred embodiments with reference to the accompanied drawings, and the preferred embodiments are used for illustrating the present invention only, but not intended to limit the scope of the present invention.
Referring to
The plate type heat pipes 20, 20′ are of a barlike shape. One end of each of the plate type heat pipes 20, 20′ is embedded in one of the grooves 11, and they are perpendicular to the heat-conducting plate 10. Each plate type heat pipe 20, 20′ has a bent section 21, 21′ on the side near the heat-conducting plate 10, which are sandwiched between the two side plates 12 for increasing the contacting area between the heat-conducting plate 10 and the plate type heat pipes 20, 20′. In the present invention, the bent directions of the bent sections 21, 21′ are in directions of approaching to each other for shorting the distance between two plate type heat pipes 20, 20′ in the side near the heat-conducting plate 10 and enlarging the distance in the other side. The heat dissipating fins 30 are stacked with a gap 300 between two adjacent fins. The heat dissipating fin 30 is provided with two slots 31 for accommodating the plate type heat pipes 20, 20′. A flange 32 on the edge of the slot 31 contacts the plate type heat pipes 20, 20′ for increasing the contact area between the heat dissipating fin 30 and the plate type heat pipes 20, 20′. The heat dissipating fins 30 are arranged with an inclined angle against the plate type heat pipes 20, 20′, in which the inclined angle is preferredly within a range from 25 degrees to 35 degrees. That is, the heat dissipating fins 30 are aslant disposed on the plate type heat pipes 20, 20′ with an angle about 25 degrees to 35 degrees. In the shown embodiment, two slots 31, 31′ corresponding to those two plate type heat pipes 20, 20′ are provided on the heat dissipating fin 30. In fact, the number of the slots 31 in the heat dissipating fin 30 and that of the plate type heat pipes 20, 20′ can be changed correspondingly. For example, the number of the slot 31 and that of plate type heat pipes 20, 20′ also can be one or three.
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While the invention is described in by way of examples and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, the aim is to cover all modifications, alternatives and equivalents falling within the spirit and scope of the invention as defined by the appended claims.
