1. Field of the Invention
The present invention relates to a heat dissipating system of a multi-media computer, and particularly relates to a heat dissipating system installed inside a computer.
2. Description of the Related Art
With the coming of the diversiform information generation, high technology products with varies functions are continuing intergraded into a computer. For example, multi-media computer is a multi functions computer with not only computer system but also recording-video digital versatile disk (DVD). The computer is installed with varies electric devices and peripheral devices, and the computer is almost closed by a near sealed case. However, heat is generated when the electric and peripheral devices are operated. Therefore, how to efficiently eliminate the heat source inside the computer is an urgent and necessary subject today.
Recently, it is a popular way to resolve the heat problem mentioned above that a heat sink device comprising a heat sink and a fan are installed nearby the electric and peripheral devices in order to reduce the ambient temperature of the computer, the electric devices, and the peripheral devices by the heat sink device.
By utilization of the fan installed on the rear plate of the computer case, the atmosphere is flowing between the heat sink device and the external environment. In addition, heat is eliminated to external environment through holes open through the rear plate by the heat sink device installed on CPU and a chip and/ or the fan installed nearby a hard disk, interface cards, and a power supplier. However, CPU, the chip, and the peripheral devices are all installed inside the computer case, such that heat generated by each of those devices which respectively produce various amount of heat, gathers inside the computer case. Furthermore, greenhouse effect is occurred due to a lot of heat sources produced in the same environment. Thus, the cold air from the external environment could not reach the position of CPU, the chip, the hard disk driver, the interface cards, and the power supplier, and remove the heat generated by electric devices during operating.
The prevent invention is to provide a heat dissipating system of a multi-media computer, such that each main heat sources is installed in a different heat dissipating area in order to induce the external atmosphere into the computer case and eliminate the heat alone a short path. Therefore, the heat dissipating efficiency of the computer case is greatly improved.
Accordingly, the heat dissipating system of a multi-media computer of the present invention includes a computer case, a first heat dissipating area, and a second heat dissipating area. The first heat dissipating area is formed on an inner side of the computer case, wherein a hard disk driver, a video graphics card, and a TV tuner card are installed therein. The second heat dissipating area is formed on the other inner side of the computer case, wherein a power supply module is installed therein. Heat flows are formed in the first heat dissipating area and the second heat dissipating area respectively.
FIGS. 3 is a decomposed schematic view of a computer and a cover according to the present invention;
The following provides exemplary embodiments of the present invention with reference to the accompanying drawings.
In
The computer case 10 comprises a front plate 11 with a plurality of through holes installed corresponding to electric devices inside the computer cases 10, a rear plate 12 paralleled and behind the front plate 11 with a certain distance, a base plate 13 connected in the bottom of the front plate 11 and the rear plate 12, and a cover 14 with a U shape (as shown in
The first heat dissipating area 20 is formed on an inner side of the computer case 10. For example, in the preferred embodiment, the first heat dissipating area 20 is formed on the left side of the computer case 10 in view of facing the panel 15, wherein electric devices, such as a hard disk driver 21 with 3.5 inches, a video graphics card (VGA) 22, a TV tuner card 23, a USB interface slot, and memory card module (not shown), are disposed in the first heat dissipating area 20. In the first heat dissipating area 20, a first ventilation 131 are formed on left side of the base plate 13 of the computer case 10 corresponding to the first heat dissipating area 20, and a plurality of slots 141 paralleled with each other are formed on the left side of the cover 14. A first heat sink module 16 comprising a heat sink device 161, a plurality of heat pipes 162 joined through the heat sink device 161 (as shown in
The second heat dissipating area 30 is formed on the other inner side of the computer case 10, wherein a power supply module 31 standing upside down, a removable hard disk module 32 with 2.5 inches are disposed on the second heat dissipating area 30. In the second heat dissipating area 30, a series of gate-shaped holes 121 (as shown in
In addition, the present invention further comprises a third heat dissipating area 40 formed in the central area of the computer case 10 between the first heat dissipating area 20 and the second heat dissipating area 30. A mother board 41 and an optical disk driver 42 connected on the top of the mother board 41 are installed on the third heat dissipating area 40. In the third heat dissipating area 40, a CUP 411, a north bridge and south bridge chip set 412 (as shown in
In
The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.