Patent Application
20170343298
The present invention relates generally to a heat dissipation component, and more particularly to a heat dissipation component having multiple heat dissipation effects and is able to greatly enhance the heat exchange efficiency.
Along with the advance of semiconductor technique, the volume of integrated circuit has become smaller and smaller. In order to process more data, the current integrated circuit with the same volume has contained numerous calculation components several times more than the components contained in the conventional integrated circuit. There are more and more calculation components contained in the integrated circuit. Therefore, the execution efficiency of the integrated circuit is higher and higher. As a result, in working, the heat generated by the calculation components is also higher and higher. With a common central processing unit taken as an example, in a full-load working state, the heat generated by the central processing unit is high enough to burn down the entire central processing unit. Therefore, the heat dissipation problem of the integrated circuit has become a very important issue.
The central processing unit and the chips or other electronic components in the electronic apparatus are all heat sources. When the electronic apparatus operates, these heat sources will generate heat. Currently, heat conduction components with good heat dissipation and conduction performance, such as heat pipes, vapor chambers and flat-plate heat pipes are often used to conduct or spread the heat. In these heat dissipation components, the heat pipe serves to conduct heat to a remote end. One end of the heat pipe absorbs the heat to evaporate and convert the internal liquid working fluid into vapor working fluid. The vapor working fluid transfers the heat to the other end of the heat pipe to achieve the heat conduction effect. With respect to a part with larger heat transfer area, a vapor chamber is selected as the heat dissipation component. One plane face of the vapor chamber is in contact with the heat source to absorb the heat. The heat is then transferred to the other face and dissipated to condense the vapor working fluid.
However, both the conventional heat pipe and vapor chamber are heat dissipation components for solving one single problem. In other words, the heat pipe or vapor chamber disposed in the electronic apparatus can only dissipate the heat of the heat source by means of conducting the heat to the remote end or spreading the heat, while failing to achieve both the heat spreading and remote-end heat conduction effects. As a result, the heat exchange efficiency is relatively poor.
It is therefore a primary object of the present invention to provide a heat dissipation component having multiple heat dissipation effects.
It is a further object of the present invention to provide a heat dissipation component, which can greatly enhance the heat exchange efficiency.
To achieve the above and other objects, the heat dissipation component of the present invention includes a first main body, a second main body, a first tubular body, a third main body, a second tubular body and a working fluid. The first main body has a first plate body and a second plate body. The first and second plate bodies are correspondingly mated with each other to together define a first chamber. A first capillary structure is disposed in the first chamber. The second plate body is formed with a first connection section. The second main body has a third plate body and a fourth plate body. The third and fourth plate bodies are correspondingly mated with each other to together define a second chamber. A second capillary structure is disposed in the second chamber. The third plate body is formed with a second connection section. The first tubular body has a first end, a second end and a first flow way. A fourth capillary structure is disposed on inner wall face of the first tubular body. The first end is correspondingly connected with the first connection section and abuts against inner side of the first plate body. The second end is correspondingly connected with the second connection section and abuts against inner side of the fourth plate body. The fourth capillary structure is in capillary contact with the first and second capillary structures. The first end of the first tubular body is formed with at least one first perforation in communication with the first chamber. The second end of the first tubular body is formed with at least one second perforation in communication with the second chamber, whereby the first flow way communicates with the first and second chambers through the first and second perforations. The fourth plate body is further formed with a third connection section in alignment with the second connection section. The third main body has a fifth plate body and a sixth plate body. The fifth and sixth plate bodies are correspondingly mated with each other to together define a third chamber. A third capillary structure is disposed in the third chamber. The fifth plate body is formed with a fourth connection section. The second tubular body has a third end, a fourth end and a second flow way. A fifth capillary structure is disposed on inner wall face of the second tubular body. The third end is passed through the first, second and third connection sections and the first flow way and abuts against the inner side of the first plate body. The fourth end is correspondingly connected with the fourth connection section and abuts against inner side of the sixth plate body. The fifth capillary structure is in capillary contact with the first and third capillary structures. The third end of the second tubular body is formed with at least one third perforation in communication with the first chamber. The fourth end of the second tubular body is formed with at least one fourth perforation in communication with the third chamber, whereby the second flow way communicates with the first and third chambers through the third and fourth perforations. The second tubular body has a diameter smaller than a diameter of the first tubular body.
According to the above structural design of the present invention, when the first main body of the heat dissipation component contacts the heat source, the liquid working fluid in the first chamber will absorb the heat and become vapor working fluid. Then, the vapor working fluid will partially flow through the first perforation and the first flow way into the second chamber. The vapor working fluid will condense and convert into liquid working fluid in the second chamber. Then, the liquid working fluid will flow back into the first chamber through the second and fourth capillary structures to continuously circulate. The other part of the vapor working fluid will flow through the first perforation of the first tubular body and the second flow way into the third chamber. The vapor working fluid will condense and convert into liquid working fluid in the third chamber. Then, the liquid working fluid will flow back into the first chamber through the third and fifth capillary structures to continuously circulate. The heat sinks disposed between the first and second main bodies and the second and third main bodies cooperatively dissipate the heat to complete the vapor-liquid circulation in the heat dissipation component. Therefore, the heat dissipation component can achieve multiple heat dissipation effects to greatly enhance the heat exchange efficiency.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
Please refer to
The fourth plate body 122 is further formed with a third connection section 1221 in alignment with the second connection section 1211. The third main body 13 has a fifth plate body 131 and a sixth plate body 132. The fifth and sixth plate bodies 131, 132 are correspondingly mated with each other to together define a third chamber 133. A third capillary structure 134 is disposed in the third chamber 133. The fifth plate body 131 is formed with a fourth connection section 1311.
The second tubular body 15 has a third end 151, a fourth end 152 and a second flow way 153. A fifth capillary structure 154 is disposed on inner wall face of the second tubular body 15. The third end 151 is passed through the first, second and third connection sections 1121, 1211, 1221 and the first flow way 143 and abuts against the inner side of the first plate body 111. The fourth end 152 is correspondingly connected with the fourth connection section 1311 and abuts against the inner side of the sixth plate body 132. The fifth capillary structure 154 is in capillary contact with the first and third capillary structures 114, 134. The third end 151 of the second tubular body 15 is formed with at least one third perforation 1511 in communication with the first chamber 113. The fourth end 152 of the second tubular body 15 is formed with at least one fourth perforation 1521 in communication with the third chamber 133. Accordingly, the second flow way 153 communicates with the first and third chambers 113, 133 through the third and fourth perforations 1511, 1521.
The working fluid 2 is filled in the first, second and third chambers 113, 123, 133. The working fluid 2 is selected from a group consisting of pure water, inorganic compound, alcohol group, ketone group, liquid metal, coolant and organic compound.
The first, second, third, fourth and fifth capillary structures 114, 124, 134, 144, 154 are selected from a group consisting of mesh bodies, fiber bodies, sintered powder bodies, combinations of mesh bodies and sintered powders and microgroove bodies. The capillary structures are porous structures for providing capillary attraction to drive the working fluid 2 to flow.
The second tubular body 15 has a diameter smaller than that of the first tubular body 14. The diameter of the third and fourth connection sections 1221, 1311 is smaller than the diameter of the first and second connection sections 1121, 1211. In other words, the diameter of the first tubular body 14 is equal to the diameter of the first and second connection sections 1121, 1211, whereby the first tubular body 14 can be tightly connected with the first and second main bodies 11, 12. The diameter of the second tubular body 15 is equal to the diameter of the third and fourth connection sections 1221, 1311, whereby the second tubular body 15 can be tightly connected with the second and third main bodies 12, 13.
A hub section is formed on each of the first, second, third and fourth connection sections 1121, 1211, 1221, 1311, whereby the first and second main bodies 11, 12 can be more tightly connected with the first tubular body 14 and the second and third main bodies 12, 13 can be more tightly connected with the second tubular body 15.
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When the first main body 11 of the heat dissipation component 1 contacts the heat source 3, the liquid working fluid 2 in the first chamber 113 will absorb the heat and become vapor working fluid 2. Then, the vapor working fluid 2 will partially flow through the first perforation 1411 and the first flow way 143 into the second chamber 123. The vapor working fluid 2 will condense and convert into liquid working fluid 2 in the second chamber 123. Then, the liquid working fluid 2 will flow back into the first chamber 113 through the second and fourth capillary structures 124, 144 to continuously circulate. The other part of the vapor working fluid 2 will flow through the first perforation 1411 of the first tubular body 14 and the second flow way 153 into the third chamber 133. The vapor working fluid 2 will condense and convert into liquid working fluid 2 in the third chamber 133. Then, the liquid working fluid 2 will flow back into the first chamber 113 through the third and fifth capillary structures 134, 154 to continuously circulate. The heat sinks 4 disposed between the first and second main bodies 11, 12 and the second and third main bodies 12, 13 cooperatively dissipate the heat to complete the vapor-liquid circulation in the heat dissipation component 1. Therefore, the heat dissipation component 1 can achieve multiple heat dissipation effects to greatly enhance the heat exchange efficiency.
Moreover, two ends of the first and second tubular bodies 14, 15 respectively abut against the inner sides of the first, second and third main bodies 11, 12, 13 instead of the support structure in the conventional vapor chamber. This effectively saves cost and shortens the manufacturing time.
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The third tubular body 17 is passed through the second and third main bodies 12, 13 and in capillary contact with the first and fourth main bodies 11, 16. The third tubular body 17 is formed with an internal third flow way 173. A seventh capillary structure 174 is disposed on inner wall face of the third tubular body 17. The third tubular body 17 has a fifth end 171 and a sixth end 172. The fifth end 171 is passed through the first, second, third, fourth and fifth connection sections 1121, 1211, 1221, 1311, 1321 and the second flow way 153 and abuts against the inner side of the first plate body 111. The sixth end 172 is connected with the sixth connection section 1611 and abuts against the inner side of the eighth plate body 162. The seventh capillary structure 174 is in capillary contact with the first and sixth capillary structures 114, 164. The fifth end 171 is formed with at least one fifth perforation 1711 in communication with the first chamber 113. The sixth end 172 is formed with at least one sixth perforation 1721 in communication with the fourth chamber 163. Accordingly, the third flow way 173 communicates with the first and fourth chambers 113, 163 through the fifth and sixth perforations 1711, 1721.
The third tubular body 17 has a diameter smaller than that of the second tubular body 15. The diameter of the fifth and sixth connection sections 1321, 1611 is smaller than the diameter of the third and fourth connection sections 1221, 1311. A hub section is formed on each of the fifth and sixth connection sections 1321, 1611, whereby the fourth main body 16 and the third tubular body 17 can be tightly connected with the third main body 13.
Similarly, when the first main body 11 contacts the heat source 3, the liquid working fluid 2 in the first chamber 113 will absorb the heat and become vapor working fluid 2. Then, part of the working fluid 2 will circulate as in the first embodiment. The other part of the vapor working fluid 2 will flow through the first perforation 1411 of the first tubular body 14 and the third flow way 173 into the fourth chamber 163. The vapor working fluid 2 will condense and convert into liquid working fluid 2 in the fourth chamber 163. Then, the liquid working fluid 2 will flow back into the first chamber 113 through the sixth and seventh capillary structures 164, 174 to continuously circulate. Therefore, the vapor-liquid circulation is completed to achieve multiple heat dissipation effects.
In other words, the structural design of the present invention is not limited to the above first and second embodiments. According to the requirements of a user, the numbers of the main bodies and the tubular bodies can be adjusted (increased or decreased) to achieve best use effect.
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In conclusion, in comparison with the conventional vapor chamber, the present invention has the following advantages:
1. The present invention can provide multiple heat dissipation effects.
2. The present invention can greatly enhance the heat exchange efficiency.
3. The cost for the support structure of the conventional vapor chamber is saved and the manufacturing time is shortened.
The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
