Patent Application
20110305559
1. Technical Field
The disclosure relates to heat dissipation devices, and particularly to a heat dissipation device having a centrifugal fan capable of preventing airflow from reflowing.
2. Description of Related Art
With the continuing improvements in the power of electronic components such as central processing units (CPUs), the heat dissipation requirements of such components are attracting increasing attention. Usually a heat sink is installed on a printed circuit board for cooling an electronic device mounted on the printed circuit board. The heat sink typically includes a heat pipe thermally contacting the electronic device, and a plurality of fins thermally connecting the heat pipe. A centrifugal fan is provided at a side of the fins. The centrifugal fan has an air inlet and an air outlet. The air outlet of the centrifugal fan is in alignment with the side of the fins. The centrifugal fan draws cool air through the air inlet. The cool air under the action of an impeller in the centrifugal fan is blown through and out of the air outlet towards the fins, and turns into hot air. However, in this process, the hot air is prone to reflow back to the impeller of the centrifugal fan from the fins.
What is needed, therefore, is a heat dissipation device with a centrifugal fan which can overcome the limitations described.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Also referring to
The heat pipe 14 is flat, and includes an evaporating section 142 attached to the mounting plate 12 and a condensing section 144 attached to the fin assembly 16.
The mounting plate 12 and the heat spreaders 40 each are made of metal such as aluminum, copper or an alloy thereof. A channel 120 is defined in a top face of the mounting plate 12, and the evaporating section 142 of the heat pipe 14 is received in the channel 120. Two rectangular grooves 122 are defined in a bottom face of the mounting plate 12, and the two heat spreaders 40 are respectively received in the two grooves 122. The grooves 122 are in communication with the channel 120 of the mounting plate 12, so that a bottom face of the evaporating section 142 of the heat pipe 14 can thermally contact the heat spreaders 40. The heat spreaders 40 thermally contact the two electronic devices respectively to absorb heat from the electronic devices.
The fin assembly 16 includes a plurality of fins (not labeled) stacked together. Two fixing plates 162 are attached to two ends of the fin assembly 16. A fixing hole (not labeled) is defined in a top end of each fixing plate 162. The condensing section 144 of the heat pipe 14 extends through the fixing holes of the fixing plates 162. A bottom face of the condensing section 144 thermally contacts a top face of the fin assembly 16. A plurality of airflow channels are formed between the fins of the fin assembly 16.
The centrifugal fan 20 includes a fan frame 22, and an impeller 24 mounted in the fan frame 22. The fan frame 22 includes a base 26, and a cover plate 28 covering the base 26. A first air inlet 280 is defined in a center of the cover plate 28. A plurality of through holes 282 is defined in a periphery of the cover plate 28. The base 26 includes a base plate 260, and a side wall 262 extending vertically upwardly from an outer edge of the base plate 260. The base plate 260 includes a fixing seat 2602 at a center thereof. Three second air inlets 2600 are defined in the base plate 260 around the fixing seat 2602, corresponding to the first air inlet 280 of the cover plate 28. The impeller 24 is fixed on the fixing seat 2602 of the base plate 260. An air outlet 202 is defined in the side wall 262 of the base 26. A plurality of fixing holes 2620 are defined in a top face of the side wall 262, corresponding to the through holes 282 of the cover plate 28. Screws (not shown) extend through the through hole 282 of the cover plate 28 and are screwed into the fixing holes 2620 of the side wall 262 to fasten the cover plate 28 on the side wall 262. Thereby, the cover plate 28 and the base 26 cooperatively form a space (not labeled) where the impeller 24 is received.
An air blocking portion 30 integrally extends from a side of the cover plate 28 nearest the fin assembly 16. The air blocking portion 30 protrudes upwardly and outwardly from the side of the cover plate 28 and extends to the fin assembly 16. In particular, the air blocking portion 30 includes a planar main body 32 and a slantwise portion 34. The slantwise portion 34 extends from the cover plate 28, and the main body 32 extends from the slantwise portion 34 to the air outlet 202. The main body 32 is located at a level above the level of the cover plate 28, and at a same level as the top face of the fin assembly 16. In this embodiment, the air blocking portion 30 has an approximate “C” shape when viewed from above. The main body 32 and the slantwise portion 34 cooperatively define a space therebetween, and a part of the space immediately below the main body 32 has a uniform height. With this configuration, a total transverse cross-sectional area of the space of the air blocking portion 30 increases from an inner side of the air blocking portion 30 near the impeller 24 to an outer side of the air blocking portion 30 near the fin assembly 16. Accordingly, the airflow generated by the impeller 24 can be prevented from reflowing back to the first air inlet 280 from the air outlet 202.
During operation of the heat dissipation device, the heat spreaders 40 absorb heat generated from the electronic devices, and the heat pipe 14 transfers heat in the heat spreaders 40 to the fin assembly 16. The centrifugal fan 20 draws air through the first air inlets 280 and the second air inlet 2600 into the space formed by the cover plate 28 and the base 26. The air under the action of the impeller 24 is blown through and out of the fin assembly 16. The total cross-sectional area of the space of the air blocking portion 30 increases from the inner side of the air blocking portion 30 near the impeller 24 to the outer side of the air blocking portion 30 near the fin assembly 16. Therefore the airflow generated by the impeller 24 can be prevented from reflowing back to the first air inlet 280 from the air outlet 202. Thus a higher heat dissipation efficiency of the heat dissipation device is achieved.
Referring to
It is believed that the embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 99118743 | Jun 2010 | TW | national |
