1. Technical Field
The present invention relates generally to heat dissipation devices, and more particularly to a clip assembly which can conveniently mount a heat sink to an electronic component.
2. Description of Related Art
It is widely acknowledged that heat is produced during operations of electronic components such as processors of computers. Therefore, a heat dissipation device such as a heat sink is needed for heat dissipation of the electronic component. In order to keep the heat sink into an intimate contact with the electronic component, a clip such as a retainer or a fastener is generally required. However, the conventional clip needs a special tool during mounting or dismounting of the heat sink, which is not appreciated by users or operators.
Therefore, it is desirable to provide a clip assembly to overcome the above-mentioned shortcoming.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Referring to
The clip assembly 10 includes a Z-shaped wire clip 12 and a W-shaped positioning member 13. The wire clip 12 is made of a resilient material such that when it is twisted it produces a torsional spring-bias force tending to return to an original shape. The wire clip 12 is a bent wire and includes a longitudinal resisting portion 121, a first clipping arm 122 and a second clipping arm 123. The first clipping arm 122 and the second clipping arm 123 are perpendicular to the resisting portion 121 and extend from two opposite ends of the resisting portion 121 in opposing directions. The resisting portion 121 forms a protrusion 124 by bending a center of the resisting portion 121. A lateral width of the positioning member 13 in a natural state is larger than a width of a gap 130 between the hooks 115. Each of the first clipping arm 122 and the second clipping arm 123 forms a catch 125 at a free end thereof.
Referring to
When the heat dissipation device 1 is pre-assembled, the resisting portion 121 of the wire clip 12 is received in the receiving groove 134 and the protrusion 124 of the wire clip 12 is inserted into the positioning slot 135 of the positioning member 13. The positioning member 13 is placed in the longitudinal air channel 119a and the resisting portion 121 is oriented substantially parallel to the longitudinal air channel 119a. Then, the positioning member 13 is pushed downwardly together with the wire clip 12 to cause the positioning arms 132 to move downwardly. The guiding surfaces 116 of the hooks 115 guide the positioning arms 132 of the positioning member 13 to slide downwardly. The positioning arms 132 are brought into interaction with the guiding surfaces 116 to cause the positioning arms 132 to contract inwardly toward each other.
Once the positioning arms 132 have passed through the gap 130 between the two hooks 115, the positioning arms 132 elastically restore back to their original state. The two positioning arms 132 laterally resist on the two fins 112a, 112b, respectively, whereby the positioning member 13 is laterally sandwiched between the two fins 112a, 112b. Each of the two positioning arms 132 is vertically sandwiched between the base 111 and a corresponding hook 115 of one of the two fins 112a, 112b whereby the positioning member 13 is vertically sandwiched between the hooks 115 and the base 111. The fin 112a (112b) is longitudinally sandwiched between the two fingers 138 of a corresponding positioning arm 132. The resisting portion 121 of the wire clip 12 rests on the heat sink 11 and is received in the receiving groove 134 of the seat 131 whereby the wire clip 12 is vertically sandwiched between the seat 131 and the base 111. A blockage of the protrusion 124 by the front tab 136 and the rear tab 137 prevents the wire clip 12 from moving along a longitudinal direction of the resisting portion 121 of the wire clip 12.
In assembly of the heat dissipation device 1 onto the printed circuit board 20 (PCB) having the electronic component 30 thereon, the base 111 of the heat sink 11 is placed on the electronic component 30. Then, the first clipping arm 122 is clockwise rotated and the second clipping arm 123 is anti-clockwise rotated whereby the catches 125 of the first clipping arm 122 and the second clipping arm 123 are engaged with a first tab 21 and a second tab 22 of the PCB 20, respectively. A resilient deformation of the wire clip 12 causes the resisting portion 121 of the wire clip 12 to press downwardly the base 111 of the heat sink 11. Therefore, the heat dissipation device 1 is easily and firmly fixed on the electronic component 30 of the PCB 20. Thus, heat generated by the electronic component 30 can be effectively transferred to the heat sink 11.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Number | Date | Country | Kind |
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200910303295.9 | Jun 2009 | CN | national |