1. Technical Field
The disclosure generally relates to heat dissipation devices, and particularly to a heat dissipation device for efficiently dissipating heat from components such as illuminators.
2. Description of Related Art
Light emitting diodes (LEDs) are currently used extensively as light sources for illumination devices due to their high luminous efficiency, low power consumption and long life span.
The stability of light emitted by LEDs is affected by heat generated by the LEDs. When the temperature of an LED is too high, the light intensity of the LED may gradually attenuate, and the life span of the illumination device is liable to be shortened.
Therefore, what is needed is a heat dissipation device that overcomes the described limitations.
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the various views.
Referring to
The heat dissipation device 10 includes an elongated main body 12, and a plurality of heat sinks 16.
The main body 12 has a central axis M, and includes a first portion 120 receiving the heat sinks 16. The first portion 120 has a first end 120A. Each heat sink 16 includes a cylindrical (or annular) sleeve 160, and a plurality of fins 162 extending out from the sleeve 160 radially. Preferably, the fins 162 are evenly spaced apart from each other around the sleeve 160. The heat sinks 16 are arranged around the first portion 120 in sequence along the central axis M of the main body 12, and are spaced from one another. The sleeve 160 of each heat sink 16 has an inner surface (not labeled) snugly contacting a peripheral surface of the first portion 120. The fins 162 thus surround not only the sleeve 160, but also the first portion 120 of the main body 12.
The at least one solid-state light source 18 may be arranged on the first end 120A. However, in this embodiment, the main body 12 advantageously further includes a second portion 122 extending up from the first end 120A of the first portion 120. The second portion 122 has a second end surface 122A, which is distant from the first portion 120. The second surface 122A may be larger than a corresponding horizontal dimension of the first end 120A. Thereby, more than one solid-state light source 18 can be arranged on (or above) the second surface 122A. In the embodiment shown in
The solid-state light sources 18 can be LEDs, or other suitable kinds of light sources. The illumination device 100 may further include a circuit board 19, such as a printed circuit board. The circuit board 19 supports the solid-state light sources 18 thereon. The circuit board 19 can be disposed on the second end surface 122A to thereby contact the second portion 122 of the main body 12.
The main body 12 and the heat sinks 16 may be made of metal with high thermal conductivity, such as copper, aluminum, copper-aluminum alloy, or other suitable metal or alloy. In operation, heat from the solid-state light sources 18 is transferred in sequence from the circuit board 19 to the second portion 122 and to the first portion 120. The heat is further transferred from the first portion 120 to the fins 162 through the sleeves 160. The fins 162 provide a large surface area in contact with ambient air. Thus a large amount of heat can be dissipated from the solid-state light sources 18.
One advantage of the illumination device 100 is that the heat sinks 16 are spaced from one another. Accordingly, a plurality of first airflow channels T are formed in a plurality of gaps 16A between each two neighboring heat sinks 16. The first airflow channels T surround the first portion 120 and allow air to flow therethrough. Thus the heat at the fins 162 can be efficiently dissipated. Another advantage is that the solid-state light sources 18 are arranged at the second surface 122A distant from the first portion 120. If the heat accumulated at the heat sinks 16 is not dissipated promptly, heat from the solid-state light sources 18 can still be dissipated directly from the second portion 122.
The heat sinks 16 can be arranged to have optimized heat dissipation performance. For example, the number of fins 162 of each heat sink 16 may be the same as the number of fins 162 of each other heat sink 16. With such configuration, each fin 162 of each heat sink 16 may be aligned with a corresponding fin 162 of a neighboring heat sink 16 along a vertical direction parallel to the axis M of the main body 12. Thus a plurality of second airflow channels S may be formed in gaps 16B between the fins 162. Each second airflow channel S extends along a series of the gaps 16B in a vertical direction parallel to the axis M of the main body 12. The second airflow channels S intersect with the first airflow channels T and allow air to flow therethrough. Thus the heat in and around the heat sinks 16 can be dissipated more efficiently.
The heat dissipation device 20 is similar to the heat dissipation device 10 of the first embodiment. The heat dissipation device 20 includes an elongated main body 22, and a plurality of heat sinks 26. The elongated main body 22 includes a first portion 220 and a second portion 222. The second portion 222 includes a first section 22A extending up from the first portion 220, and a second section 22B distant from the first portion 220. The heat dissipation device 20 differs from the heat dissipation device 10, inter alia, in that each of the heat sinks 26 includes a plurality of fins 262 extending directly from the main body 22. In addition, the second portion 222 differs from the second portion 122 in structure. The first section 22A is circular frustoconical, and tapers downwardly. The second section 22B is generally circular frustoconical, and tapers upwardly. The second section 22B has a second end surface 222A and a plurality of planar side surfaces 222B. Each of the side surfaces 222B adjoins the second end surface 222A, and the side surfaces 222B surround the second end surface 222A. An obtuse angle θ is defined between each side surface 222B and the second end surface 222A. The side surfaces 222B cooperate with the second end surface 222A to provide space for the solid-state light sources 28 to be arranged thereon or thereat. In the illustrated embodiment, each of the side surfaces 222B supports a circuit board (not labeled) that has one solid-state light source 28, and the second end surface 222A supports a circuit board (not labeled) that has, for example, five solid-state light sources 28. Thus a radiating range of the illumination device 200 is increased.
The heat dissipation device 30 is similar to the heat dissipation device 20 of the second embodiment. The heat dissipation device 30 includes an elongated main body 32, and a plurality of heat sinks 36. The elongated main body 32 includes a first portion 320 and a second portion 322. The second portion 322 includes a first section 32A and a second section 32B. The heat dissipation device 30 differs from the heat dissipation device 20, inter alia, in that the first section 32A is cylindrical, and the second section 32B is hexagonally frustoconical (i.e., prismoid). The second section 32B tapers upward. A diameter of a bottom of the second section 32B is larger than a diameter of the first section 32A. Similar to the heat dissipation device 20, the second section 32B of the second portion 322 has a second end surface 322A and a plurality of planar side surfaces 322B. The side surfaces 322B cooperate with the second end surface 322A to provide space for the solid-state light sources 38 to be arranged thereon or thereat. In the illustrated embodiment, each of the side surfaces 322B supports a circuit board (not labeled) that has one solid-state light source 38, and the second end surface 322A supports a circuit board (not labeled) that has, for example, one solid-state light source 38. Thus a radiating range of the illumination device 300 is increased.
It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.
Number | Date | Country | Kind |
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200910301794.4 | Apr 2009 | CN | national |