The present disclosure relates to a lamp structure and, in particular, to a heat dissipation device for a lamp.
Light-emitting diodes (LEDs) have high brightness, low power consumption, and a long lifespan, so the LEDs are extensively used. Also, because high power LED modules had been developed in the market, the LEDs are more widely adopted in all kinds of illumination devices, and using LED has become an environmentally friendly trend.
However, when LEDs are used in a high wattage lamp, the following problems occur. A high wattage LED light source generates a large amount of heat and causes high temperature. As the temperatures of the LEDs and electronic components inside the high wattage LED light source increase continuously, the LEDs and the electronic components malfunction or are short circuited. Therefore, it is desirable to provide a solution to effectively transfer the heat away from the high wattage lamp.
In views of this, in order to solve the above disadvantage, the inventor studied related technology and provided a reasonable and effective solution in the present disclosure.
It is an objective of the present disclosure to provide a heat dissipation device for a lamp, which expels the heat of a light source module to the outside by using a first hollow tube and a second hollow tube, thus achieving excellent heat dissipation by use of the heat dissipation device for the lamp.
Accordingly, the present disclosure provides a heat dissipation device for a lamp, comprising: a housing including an opening; a heat sink module accommodated in the housing, the heat sink module comprising a heat sink member which includes a substrate, the substrate including a first area and a second area surrounding a perimeter of the first area, one side of the first area including an installation surface, a plurality of first hollow tubes extending from the other side of the first area, a plurality of second hollow tubes extending from two opposite sides of the second area; and a light source module thermally adhered to the installation surface and exposed from the opening.
Accordingly, the present disclosure provides a heat dissipation device for a lamp, comprising a housing, a heat sink module, and a light source module. The housing includes an opening. The heat sink module is accommodated in the housing, and the heat sink module comprises two heat sink members and a plurality of heat pipes, wherein the two heat sink members are stacked one above the other, each heat sink member includes a substrate, each of the substrates includes a first area and a second area surrounding a perimeter of the first area, one side of the first area includes an installation surface, a plurality of first hollow tubes extend from the other side of the first area, a plurality of second hollow tubes extend from two opposite sides of the second area, the two installation surfaces are disposed at outer sides of the two heat sink members, the first hollow tubes are disposed at inner sides of the two heat sink members, and two ends of each heat pipe are interference fit into two corresponding ones of the first hollow tubes. The light source module is thermally adhered to one of the installation surfaces and is exposed from the opening.
The disclosure will become more fully understood from the detailed description, and the drawings given herein below is for illustration only, and thus does not limit the disclosure, wherein:
Detailed descriptions and technical contents of the present disclosure are illustrated below in conjunction with the accompanying drawings. However, it is to be understood that the descriptions and the accompanying drawings disclosed herein are merely illustrative and exemplary and not intended to limit the scope of the present disclosure.
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Furthermore, the housing 1 includes a plurality of first screws 14 and a plurality of second screws 15, each first screw 14 is correspondingly fastened to each first screw hole 1223 and each second screw hole 132, so that the lower casing 12 and the cover plate 13 are assembled together.
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In detail, the heat sink member 21 includes a substrate 210, the substrate 210 includes a first area 211 and a second area 212 surrounding a perimeter of the first area 211, one side of the first area 211 includes an installation surface 2111, a plurality of first hollow tubes 2113 extend from the other side of the first area 211, the heat pipes 22 are interference fit into the first hollow tubes 2113 respectively, a plurality of second hollow tubes 2121 extend from two opposite sides of the second area 212, each of the second hollow tubes 2121 penetrates the substrate 210 to form an air passage 2122 inside each second hollow tube 2121.
The bottom plate 121 and the cover plate 13 include a plurality of first ports 124 disposed corresponding to the air passages 2122, and the outer circular plate 122 includes a plurality of second ports 125 disposed corresponding to the second hollow tubes 2121, thus improving heat dissipation of the second hollow tubes 2121.
Moreover, a plurality of first positioning holes 2115 are disposed on the installation surface 2111, a plurality of second positioning holes 1213 are disposed on the bottom of the recess 1211, and each second screw 15 is fastened to each first positioning hole 2115 and each second positioning hole 1213, so that the lower casing 12 and the heat sink member 21 are assembled together. A plurality of first through holes 2116 and a plurality of second through holes 2117 are disposed on the installation surface 2111.
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In the heat dissipation device 10 for the lamp, the housing 1 includes the opening 11, the heat sink module 2 is disposed inside the housing 1, the heat sink module 2 includes the heat sink member 21, the heat sink member 21 includes the substrate 210, the substrate 210 includes the first area 211 and the second area 212 surrounding the perimeter of the first area 211, one side of the first area 211 includes the installation surface 2111, the first hollow tubes 2113 extend from the other side of the first area 211, the second hollow tubes 2121 extend from two opposite sides of the second area 212, and the light source module 3 is thermally adhered to the installation surface 2111 and exposed from the opening 11.
To use the heat dissipation device 10 for the lamp, the light source module 3 is thermally adhered to the installation surface 2111. The heat of the light-emitting-diode light source 31 is uniformly expelled to the outside via the first hollow tubes 2113 and the second hollow tubes 2121. Each second hollow tube 2121 has the air passage 2122 inside, and the second hollow tube 2121 are uniformly distributed at two sides of the heat sink member 21 and in an outer peripheral area of the light source module 3, so the heat dissipation device 10 for the lamp achieves excellent heat dissipation.
Moreover, the heat sink module 2 further includes a plurality of heat pipes 22, and the heat pipes 22 are interference fit into the first hollow tubes 2113 respectively. Therefore, the heat of the light-emitting-diode light source 31 is even more quickly expelled to the outside via the heat pipes 22, thus further enhancing heat dissipation efficiency of the heat dissipation device 10 for the lamp.
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In detail, two heat sink members are stacked on above the other inside the housing 1, each heat sink member 21 includes a substrate 210, each of the substrates 210 includes a first area 211 and a second area 212 surrounding a perimeter of the first area 211, one side of the first area 211 includes an installation surface 2111, a plurality of first hollow tubes 2113 extend from the other side of the first area 211, a plurality of second hollow tubes 2121 extend from two opposite sides of the second area 212, the two installation surfaces 2111 are disposed at outer sides of the two heat sink members 21, the first hollow tubes 2113 are disposed at inner sides of the two heat sink members 21. Two ends of each of the heat pipes 22 are interference fit into two corresponding ones of the first hollow tubes 2113. According, the present embodiment achieves similar effects and functions as the first embodiment.
The housing 1 includes a lower casing 12 and an upper casing 16. The heat sink module 2 is accommodated between the lower casing 12 and the upper casing 16, the upper casing 16 includes a top plate 161 and an outer peripheral plate 162, a cavity 1611 extends inwardly from a middle portion of the top plate 161, a mounting rack 133′ is connected to a bottom of the cavity 1611, a circular ring plate 1621 extends outwardly from one end of the outer peripheral plate 162 away from the top plate 161, the circular ring plate 1621 includes a plurality of second screw holes 1622, and a plurality of first positioning holes 2115′ are disposed on each installation surface 2111, and a plurality of second positioning holes 1213′ are disposed on the bottom of the recess 1211 and the bottom of the cavity 1611.
A plurality of heat sink fins 123′ are connected to the exterior of the outer circular plate 122 and the exterior of the outer peripheral plate 162. The bottom plate 121 of the lower casing 12 and the top plate 161 of the upper casing 16 include a plurality of first ports 124′ disposed corresponding to the air passages 2122, and the outer circular plate 122 of the lower casing 12 and the outer peripheral plate 162 of the upper casing 16 include a plurality of second ports 125′ disposed corresponding to the second hollow tubes 2121, thus improving heat dissipation of the second hollow tubes 2121.
Moreover, the housing 1 further includes a plurality of first screws 14′. Each first screw 14′ is correspondingly fastened to each first screw hole 1224 and each second screw hole 1622, so that the lower casing 12 and the upper casing 16 are assembled together.
Moreover, the housing 1 further includes a plurality of second screws 15′, and each second screw 15′ is fastened to each first positioning hole 2115′ and each second positioning hole 1213′, so that one of the heat sink members 21 and the lower casing 12 are assembled together, and the other heat sink member 21 and the upper casing 16 are assembled together.
Compared to the first embodiment, the second embodiment utilizes the heat pipe 22 to connect the two heat sink members 21, and the heat of the two heat sink members 21 are thermally conducted stably by means of the heat pipe 22. Thus, the number of the heat sink members 21 of the heat dissipation device 10 for the lamp can increase according to the amount of heat of the LED light source 31. Therefore, the heat dissipation device 10 for the lamp has the following advantage: the number of the heat sink members 21 and a heat dissipation area can be adjusted easily.
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In detail, the intermediate cooling member 24 is disposed between the two heat sink members 21, the intermediate cooling member 24 includes a main board 240, the main board 240 includes a third area 241 and a fourth area 242 surrounding a perimeter of the third area 241, a plurality of coupling tubes 2411 penetrate two opposite sides of the third area 241, a plurality of third hollow tubes 2421 penetrate two opposite sides of the fourth area 242, and a middle section of each heat pipe 22 is interference fit into a corresponding one of the coupling tubes 2411.
The housing 1 includes a plurality of support pillars 17, the protruding ring plate 1222 of the lower casing 12 includes a plurality of first insertion holes 1225, the circular ring plate 1621 of the upper casing 16 includes a plurality of second insertion holes 1623, two ends of each support pillar 17 are respectively inserted into a corresponding one of the first insertion holes 1225 and a corresponding one of the second insertion holes 1623, and the support pillars 17 are disposed around the intermediate cooling member 24 to surround the same.
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In summary, the heat dissipation device 10 for the lamp can achieve anticipated objectives and solve the conventional defects. The present disclosure also has industrial applicability, novelty and non-obviousness, so the present disclosure completely complies with the requirements of patentability. Therefore, a request to patent the present disclosure is filed pursuant to patent law. Examination is kindly requested, and allowance of the present application is solicited to protect the rights of the inventor.
Number | Date | Country | Kind |
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105218634 | Dec 2016 | TW | national |