Patent Application
20140198447
1. Technical Field
The present disclosure relates to a heat dissipation device for cooling memory cards.
2. Description of Related Art
It is well known that many electronic systems comprising many memory cards generate a large amount of heat. If the heat is not removed rapidly, it will cause damage to the memory cards.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”
The supporting bracket 10 includes a substantially rectangular supporting plate 11, and two bar-shaped mounting portions 12 protruding out from two opposite ends of the supporting plate 11. A middle of the supporting plate 11 defines an air ventilation area 112. Four positioning posts 114 protrude up from the supporting plate 11, at four corners of a portion of the supporting plate 11 surrounding the air ventilation area 112. Two resilient hooks 116 protrude up from two opposite sides of the supporting plate 11, adjacent to two diagonally opposite positioning posts 114. A first end of each mounting portion 12 longitudinally defines a mounting hole 121. A second end of each mounting portion 12 opposite to the first end longitudinally defines a receiving slot 1123. Each receiving slot 1123 extends through a longitudinal side surface of the corresponding mounting portion 12 opposite to the supporting plate 11 and an end surface at the second end of the mounting portion 12. An end of the receiving slot 1123 adjacent to the first end of the mounting portion 12 defines a positioning hole 1125 communicating with the receiving slot 1123. A bottom wall bounding each receiving slot 1123 defines a plurality of substantially L-shaped cutouts 1127 arrayed in an extending direction of the receiving slot 1123, and each cutout 1127 communicates with the receiving slot 1123.
Each latching member 30 includes a connecting pole 31 perpendicularly extending from a first end thereof, and a latching pole 32 perpendicularly extending from a second end thereof. The connecting pole 31 and the latching pole 32 extend in a same direction. The latching member 30 is made of resilient material, such as metal wire.
The fan 50 includes a rectangular end plate 51. Four corners of the end plate 51 define four installing holes 512.
An end of each second sliding pole 22 opposite to the clamping portion 222 is slidably inserted into the slide slot 215 of the corresponding first sliding pole 21, to allow the latching block 2173 of the first sliding pole 21 to mesh with the rack 224 of the second sliding pole 22. The rack 224 of the second sliding pole 22 can be slid over the guiding surface 2174 of the first sliding pole 21, and can be stopped by the stopping surface 2175 of the latching block 2173. When a distance between the clamping portion 212 of the first sliding pole 21 and the clamping portion 222 of the second sliding pole 22 of each positioning frame 20 needs to be adjusted, the operation portion 2171 is pulled away from the slide slot 215, thereby deforming the resilient arm 217 out. This allows the latching block 2173 to disengage from the rack 224 of the second sliding pole 22, and the second sliding pole 22 to be pulled away from or pushed further into the first sliding pole 21 as required.
In use of the heat dissipation device, the distance between the clamping portions 212 and 222 of each positioning frame 20 is adjusted, until the distance is greater than a width of the plurality of memory slots 801. The positioning frames 20 are attached to opposite ends of the plurality of memory slots 801. The plurality of memory slots 801 are located between the clamping portions 212 and 222 of the positioning frames 20. The second sliding pole 22 of each positioning frame 20 is moved toward the first sliding pole 21, until the clamping portions 212 and 222 of the positioning frame 20 firmly engage with two outmost of the plurality of memory slots 801. Thereby, the positioning frames 20 are mounted to the plurality of memory slots 801. The supporting bracket 10 is supported on the memory cards 100, and the latching poles 32 of the latching members 30 are inserted into the positioning holes 2121 and 2221 of the positioning frames 20. Thereby, the supporting bracket 10 is mounted on the memory cards 100, with the fan 50 aligning with the memory cards 100, for dissipating heat generated by the memory cards 100.
To detach the heat dissipation device, an end of each latching member 30 adjacent to the latching pole 32 is pulled away from the corresponding positioning frame 20, deforming the latching member 30, until the latching pole 32 is disengaged from the corresponding positioning hole 2121 or 2221. The supporting bracket 10 with the fan 50 can then be easily detached from the memory cards 100. The operation portions 2171 of the first sliding poles 21 are pulled away from the expansion cards 801, deforming the resilient arms 217, until the latching blocks 2173 are disengaged from the racks 224 of the second sliding poles 22. The second sliding poles 22 are moved away from the corresponding first sliding poles 21, until the clamping portions 222 disengage from the plurality of memory slots 801.
Thus the heat dissipation device is adaptable for use with different motherboards having different arrangements of memory slots and memory cards, such as the motherboard 800 having the memory slots 801 and the memory cards 100 and the motherboard 900 having the memory slots 901 and the memory cards 100.
While the disclosure describes examples and embodiments, it is to be understood that the disclosure is not limited thereto. On the contrary, the disclosure is intended to cover various modifications and similar arrangements as would be apparent to those skilled in the art. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013100102886 | Jan 2013 | CN | national |
