1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device which can be conveniently fixed to a memory module for efficiently dissipating heat generated by memory chips on the memory module.
2. Description of Related Art
Nowadays, memory modules such as random-access memory (RAM) modules are widely used in computers to improve performances of the computers. The memory module includes a circuit board and a plurality of memory chips mounted on two opposite side surfaces thereof. With continuing development of the electronic technology, the memory chips of the memory modules trend to high integration, and thus generate a large amount of heat required to be dissipated immediately. Therefore, heat dissipation devices are widely used to dissipate the heat generated by the memory modules.
A typical heat dissipation device for using with the memory module includes a top wall and two side walls extending downwardly from two opposite lateral sides of the top wall. A gap is formed between the two side walls for receiving the memory module therein. The gap between the two side walls at a free state is smaller than a thickness of the memory module. In assembly, a tool is needed to enlarge the gap between the two side walls to enable the memory module inserted into the gap. When the tool is removed, the memory module is snappingly sandwiched between the side walls with the memory chips thermally attached to the side walls. Thus, an assembly process of the heat dissipation device is inconvenient.
Furthermore, the heat dissipation device dissipates heat via the top wall and the two side walls. The heat exchange area of the top wall and the two side walls is so small that the heat dissipation device has a low heat dissipation efficiency.
For the foregoing reasons, a heat dissipation device which can overcome the above described shortcomings is desired.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The heat dissipation device 10 includes two fin assemblies 11, two heat spreaders 12 spaced from the two fin assemblies 11, two heat pipes 13 respectively connecting the two fin assemblies 11 with the two heat spreaders 12, and a pivot 14 pivotally extending through the two fin assemblies 11.
Each of the two fin assemblies 11 includes a plurality of fins 111 stacked together. Each of the fins 111 defines an axle hole 112 in a middle portion thereof and a through hole 113 near the axle hole 112 thereof. As particularly shown in
Each of the heat pipes 13 is substantially U-shaped. The heat pipe 13 includes a condensation section 131 formed at one end thereof, an evaporation section 132 formed at the other end thereof, and a connecting section 133 connected between the condensation section 131 and the evaporation section 132. The condensation section 131 is spaced from and parallel to the evaporation section 132 of the heat pipe 13. The condensation section 131 is round and shorter than the evaporation section 132. The through holes 113 of each of the fin assemblies 11 align with each other for receiving the condensation section 131 of one of the heat pipes 13. The condensation sections 131 of the heat pipes 13 respectively extend into the through holes 113 of the fin assemblies 11 from two confronting directions. The condensation sections 131 of the heat pipes 13 are parallel to the pivot 14. The evaporation section 132 is substantially flat. The evaporation sections 132 of the heat pipes 13 are parallel to each other and positioned below the fin assemblies 11. Each of the evaporation sections 132 is attached to one of the heat spreaders 12.
The two heat spreaders 12 are spaced from each other. Each of the heat spreaders 12 is a metal plate and includes an inner surface 121 and an outer surface 122 opposite to the inner surface 121. A top side of each of the heat spreaders 12 which is located adjacent to the fin assemblies 11 is bent towards its inner surface 121 to form a flange 123. The evaporation section 132 of each of the heat pipes 13 is secured to a corresponding heat spreader 12 by a securing plate 124 which is mounted on a middle portion of the outer surface 122 of the heat spreader 12. The securing plate 124 defines a securing slot 1241 in a middle portion thereof. The securing slot 1241 has a same shape as that of the evaporation section 132 of the heat pipe 13 and is opened in a direction toward the outer surface 122 of the corresponding heat spreader 12. The evaporation section 132 of the heat pipe 13 is received in the securing slot 1241 and attached to the outer surface 122 of the corresponding heat spreader 12 by the securing plate 124.
The pivot 14 includes a head 141, a pole portion 142 extending straight from the head 141, and a retaining ring 143 coiled around a free end of the pole portion 142. An outer diameter of the head 141 is larger than that of the pole portion 142. The pole portion 142 defines an annular notch 1421 at the free end thereof. The annular notch 1421 is formed around an outer surface of the pole portion 142. When the pole portion 142 of the pivot 14 extends into the axle holes 112 of the two fin assemblies 11, the retaining ring 143 is engaged in the annular notch 1421 of the pole portion 142 to prevent the fin assemblies 11 from slipping off the pole portion 142.
Referring to
During operation, heat generated by the memory chips 21 is transferred to the evaporation sections 132 through the thermal interface materials 30 and the heat spreaders 12. Working liquid in the evaporation section 132 of the heat pipe 13 absorbs the heat and evaporates into vapor. The vapor condenses in the condensation section 131 and releases the heat to the fin assemblies 11 and finally to the ambient environment. Thus, the heat of the memory module 20 is efficiently transferred and dissipated via the heat dissipation device 10.
It is to be understood that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
2009 1 0300120 | Jan 2009 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
6025992 | Dodge et al. | Feb 2000 | A |
6496375 | Patel et al. | Dec 2002 | B2 |
6937474 | Lee | Aug 2005 | B2 |
7106595 | Foster et al. | Sep 2006 | B2 |
7151668 | Stathakis | Dec 2006 | B1 |
7187552 | Stewart et al. | Mar 2007 | B1 |
7345882 | Lee et al. | Mar 2008 | B2 |
7349220 | Lai et al. | Mar 2008 | B2 |
7372702 | Gauche et al. | May 2008 | B2 |
7391613 | Lai et al. | Jun 2008 | B2 |
7612992 | Chen | Nov 2009 | B2 |
7626823 | Yang et al. | Dec 2009 | B2 |
7755897 | Chen et al. | Jul 2010 | B2 |
20040250989 | Im et al. | Dec 2004 | A1 |
20080264613 | Chu | Oct 2008 | A1 |
20080291630 | Monh et al. | Nov 2008 | A1 |
20090168356 | Chen et al. | Jul 2009 | A1 |
20100025010 | Cipolla et al. | Feb 2010 | A1 |
20100188809 | Hsu et al. | Jul 2010 | A1 |
20100188811 | Liang | Jul 2010 | A1 |
Number | Date | Country | |
---|---|---|---|
20100172088 A1 | Jul 2010 | US |